HK1177503A1 - Detecting means and detecting method for semiconductor device - Google Patents
Detecting means and detecting method for semiconductor deviceInfo
- Publication number
- HK1177503A1 HK1177503A1 HK13102945.7A HK13102945A HK1177503A1 HK 1177503 A1 HK1177503 A1 HK 1177503A1 HK 13102945 A HK13102945 A HK 13102945A HK 1177503 A1 HK1177503 A1 HK 1177503A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- detecting
- semiconductor device
- detecting means
- detecting method
- semiconductor
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100033278A KR101169406B1 (en) | 2010-04-12 | 2010-04-12 | Test Handler for semiconductor device, and inpection method for semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1177503A1 true HK1177503A1 (en) | 2013-08-23 |
Family
ID=44745811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK13102945.7A HK1177503A1 (en) | 2010-04-12 | 2013-03-08 | Detecting means and detecting method for semiconductor device |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR101169406B1 (en) |
| CN (2) | CN102214549A (en) |
| HK (1) | HK1177503A1 (en) |
| TW (1) | TWI436074B (en) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102000948B1 (en) * | 2012-02-29 | 2019-07-17 | (주)제이티 | Semiconductor device inspection apparatus |
| KR102009991B1 (en) * | 2013-08-13 | 2019-08-12 | 세메스 주식회사 | Apparatus for transferring semiconductor package |
| TWI534437B (en) * | 2013-10-08 | 2016-05-21 | Chroma Ate Inc | Electronic device testing equipment for integrated high and low temperature test and its detection method |
| KR102120713B1 (en) * | 2014-03-18 | 2020-06-11 | (주)테크윙 | Handler for testing semiconductor device |
| KR102355615B1 (en) * | 2014-10-02 | 2022-01-25 | (주)제이티 | Device handler |
| CN108139442A (en) * | 2015-03-16 | 2018-06-08 | 精工爱普生株式会社 | Electronic component handling apparatus, electronic component inspection device, moisture condensation or the inspection of frosting test film and moisture condensation or the inspection method of frosting |
| CN106206392B (en) * | 2015-05-07 | 2021-04-30 | 梭特科技股份有限公司 | Die positioning and arranging equipment and die positioning and arranging method |
| KR102401058B1 (en) * | 2015-05-12 | 2022-05-23 | (주)제이티 | Sorting Apparatus for Semiconductor Device |
| CN106206348B (en) * | 2015-05-27 | 2019-06-14 | 细美事有限公司 | Test handler |
| KR20170037079A (en) * | 2015-09-25 | 2017-04-04 | (주)제이티 | Device handler |
| KR102656451B1 (en) * | 2016-03-18 | 2024-04-12 | (주)테크윙 | Handler for testing electronic components |
| KR102430477B1 (en) | 2016-06-03 | 2022-08-09 | 세메스 주식회사 | Size free buffer tray for storaging device |
| CN106601657B (en) | 2016-12-12 | 2019-12-17 | 厦门市三安光电科技有限公司 | Micro-component transfer system, micro-component transfer method, micro-component manufacturing apparatus, and electronic device |
| KR20180083557A (en) * | 2017-01-13 | 2018-07-23 | (주)제이티 | Device handler |
| KR102366550B1 (en) * | 2017-06-29 | 2022-02-23 | 에스케이하이닉스 주식회사 | Test handler and operating method of the same |
| CN109709463A (en) * | 2017-10-25 | 2019-05-03 | 泰克元有限公司 | Manipulator |
| JP7245639B2 (en) * | 2018-12-14 | 2023-03-24 | 株式会社アドバンテスト | sensor test equipment |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7033842B2 (en) * | 2002-03-25 | 2006-04-25 | Matsushita Electric Industrial Co., Ltd. | Electronic component mounting apparatus and electronic component mounting method |
| CN1954202A (en) * | 2004-06-08 | 2007-04-25 | 株式会社爱德万测试 | Image sensor test device |
| KR100858491B1 (en) * | 2006-12-29 | 2008-09-12 | 옵토팩 주식회사 | Apparatus and method for testing image sensor package |
| KR101206430B1 (en) * | 2007-05-12 | 2012-12-03 | (주)테크윙 | Test handler and method for transferring carrier boards in test handler |
| KR100781336B1 (en) * | 2007-08-20 | 2007-11-30 | 미래산업 주식회사 | Handler for Testing Semiconductor Devices And Method for Controlling the Same |
| KR100938172B1 (en) * | 2007-12-28 | 2010-01-21 | 미래산업 주식회사 | Handler, Method of Transferring Test-tray, and Method of Manufacturing Semiconductor |
| KR100929780B1 (en) * | 2008-01-14 | 2009-12-04 | 에버테크노 주식회사 | SSD test handler |
| KR20090096264A (en) * | 2008-03-14 | 2009-09-10 | 정라파엘 | Test apparatus for testing semiconductor device |
-
2010
- 2010-04-12 KR KR1020100033278A patent/KR101169406B1/en not_active IP Right Cessation
-
2011
- 2011-04-11 CN CN2011100897530A patent/CN102214549A/en active Pending
- 2011-04-11 CN CN201210205024.1A patent/CN102778642B/en not_active Expired - Fee Related
- 2011-04-11 TW TW100112478A patent/TWI436074B/en not_active IP Right Cessation
-
2013
- 2013-03-08 HK HK13102945.7A patent/HK1177503A1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN102778642A (en) | 2012-11-14 |
| TWI436074B (en) | 2014-05-01 |
| CN102214549A (en) | 2011-10-12 |
| CN102778642B (en) | 2015-07-08 |
| KR20110113928A (en) | 2011-10-19 |
| KR101169406B1 (en) | 2012-08-03 |
| TW201140089A (en) | 2011-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20190409 |