KR101329960B1 - Apparatus for providing and retrieving a wafer in mult-chamber system - Google Patents

Apparatus for providing and retrieving a wafer in mult-chamber system Download PDF

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Publication number
KR101329960B1
KR101329960B1 KR1020120095246A KR20120095246A KR101329960B1 KR 101329960 B1 KR101329960 B1 KR 101329960B1 KR 1020120095246 A KR1020120095246 A KR 1020120095246A KR 20120095246 A KR20120095246 A KR 20120095246A KR 101329960 B1 KR101329960 B1 KR 101329960B1
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KR
South Korea
Prior art keywords
wafer
unit
cleaning
cassette mounting
chamber
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KR1020120095246A
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Korean (ko)
Inventor
류인환
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주식회사 로보스타
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Priority to KR1020120095246A priority Critical patent/KR101329960B1/en
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Publication of KR101329960B1 publication Critical patent/KR101329960B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention relates to a multi-chamber wafer supply and recovery apparatus, the present invention comprising: a base frame; Cleaning chambers arranged in a row at a rear region of the base frame, each of which cleans a wafer; A guide rail positioned parallel to the cleaning chambers; A plurality of cassette mounting units arranged in a front region of the base frame in parallel with the guide rails, the cassettes being detachably stacked; A wafer alignment unit positioned in a front region of the base frame to be aligned with the cassette mounting units and aligning the wafer; An inversion unit positioned in the front region of the base frame to be in line with the cassette mounting units and inverting the wafer back and forth; And a transfer robot that moves along the guide rail and moves the wafer loaded in the cassette mounted on the cassette mounting unit to the cleaning chamber, the wafer alignment unit, and the inversion unit according to a process. The present invention shortens the time for supplying and withdrawing a wafer to a plurality of chambers for cleaning the wafer, and also minimizes the installation space by compacting the configuration for supplying and recovering the wafer to the plurality of chambers for cleaning the wafer. .

Description

Multi-chamber wafer feeding and retrieval device {APPARATUS FOR PROVIDING AND RETRIEVING A WAFER IN MULT-CHAMBER SYSTEM}

The present invention relates to a multi-chamber wafer supply and recovery apparatus.

Semiconductor chips are manufactured through various processes. Among processes for manufacturing a semiconductor chip, a cleaning process for removing particles on both surfaces of a substrate or a wafer is included. For example, after waxing a wafer, the waxed wafer is cleaned.

The process of cleaning a wafer generally proceeds with cleaning equipment. The cleaning equipment must be able to clean many wafers in a short time to increase productivity. Failure to do so will reduce the productivity of the entire production line when installed in a semiconductor manufacturing line.

In addition, the cleaning equipment must be compact in configuration to take up less space for installation. If the cleaning equipment takes up a lot of installation space, it will not only be constrained by the installation site, but also unsuitable for the arrangement of semiconductor manufacturing lines.

It is an object of the present invention to provide a multi-chamber wafer supply and recovery apparatus that shortens the time for supplying and withdrawing a wafer to a plurality of chambers for cleaning the wafer.

It is another object of the present invention to provide a multi-chamber wafer supply and recovery apparatus which minimizes the installation space by compacting the configuration of supplying and recovering the wafer to the plurality of chambers for cleaning the wafer.

In order to achieve the object of the present invention, a base frame; Cleaning chambers arranged in a row at a rear region of the base frame, each of which cleans a wafer; A guide rail positioned parallel to the cleaning chambers; A plurality of cassette mounting units arranged in a front region of the base frame in parallel with the guide rails, the cassettes being detachably stacked; A wafer alignment unit positioned in a front region of the base frame to be aligned with the cassette mounting units and aligning the wafer; An inversion unit positioned in the front region of the base frame to be in line with the cassette mounting units and inverting the wafer back and forth; A multi-chamber wafer supply and recovery apparatus including a transfer robot moving along the guide rail and moving the wafer loaded in the cassette mounted on the cassette mounting unit to the cleaning chamber, the wafer alignment unit, and the inversion unit according to a process. Is provided.

The cleaning chambers are two, and with respect to the front surface of the base frame, the two cleaning chambers are preferably located in the left and right directions.

Preferably, the cassette mounting units are four.

Preferably, the wafer alignment unit is positioned next to the cassette mounting units, and the inversion unit is positioned next to the wafer alignment unit.

The transfer robot transfers the wafers loaded in the wafer cassette mounted on the cassette mounting unit to the wafer alignment unit, transfers the wafers aligned in the wafer alignment unit to the cleaning chamber, and transfers the wafers cleaned in the cleaning chamber. It is preferable to transfer the wafer, which is transferred to the inversion unit and turned upside down in the inversion unit, to the cleaning chamber and to insert the wafer cleaned in the cleaning chamber into a wafer cassette mounted on the cassette mounting unit.

According to the present invention, the cleaning chambers are arranged in the left and right directions in the rear region of the base frame, and the cassette mounting units, the wafer alignment unit and the inversion unit are arranged in the left and right directions in the front region of the base frame, and the rear region is cleaned. The rows of chambers and the cassette mounting units, the wafer alignment unit and the reversing unit in the front area are parallel to each other and the transfer robot moves in a straight line between the two rows in parallel to the two rows so that the wafer is cleaned. Shorter copper wires and more efficient processes shorten the process time for cleaning wafers. In addition, the compact configuration reduces the size of the device, which takes up less space for installation.

In addition, the present invention includes a reversing unit that flips the wafer back and forth, so that both the front and back surfaces of the wafer, i.e., both sides, can be cleaned, so the configuration is compact.

In addition, the present invention includes a wafer alignment unit so that the entire surface of one side of the wafer is cleanly cleaned inside the cleaning chamber since the wafer is aligned to a predetermined position before the wafer is inserted into the cleaning chamber. .

1 is a plan view showing an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention;
2 is a front view showing an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention;
3 is a plan view showing a cassette mounting unit constituting an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention;
4 is a front view showing a cassette mounting unit constituting an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention;
5 is a front view showing a wafer alignment unit constituting an embodiment of the multi-chamber wafer supply and recovery apparatus according to the present invention;
6 is a plan view showing an inversion unit constituting an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention;
Figure 7 is a side view showing an inverting unit constituting an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention.

Hereinafter, an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention will be described with reference to the accompanying drawings.

1 is a plan view showing an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention. 2 is a front view showing an embodiment of a multi-chamber wafer supply and recovery apparatus according to the present invention.

As shown in Figures 1 and 2, one embodiment of the multi-chamber wafer supply and recovery apparatus according to the present invention is a base frame 100, a plurality of cleaning chambers 200, a guide rail 300, a plurality of cassettes The mounting units 400, the wafer alignment unit 500, the inversion unit 600, and the transfer robot 700 are included.

The base frame 100 connects both the front frame 110, the rear frame 110 positioned at a distance from the front frame 110, and both the front frame 110 and the rear frame 120, respectively. Left and right frames 130 and 140, and the intermediate frame 150 located between the front frame 110 and the rear frame 120. An area between the front frame 110 and the intermediate frame 150 is called a front area A, and an area between the rear frame 120 and the intermediate frame 150 is called a rear area B.

The plurality of cleaning chambers 200 are located in the rear region B. The plurality of cleaning chambers 200 are arranged in a line in the left and right directions. Preferably, the plurality of cleaning chambers 200 are two. The cleaning chamber 200 cleans the wafer when the wafer is placed therein.

The guide rail 300 may be provided in the intermediate frame 150 in parallel with the cleaning chambers 200. The guide rail 300 preferably has a length corresponding to the length in the left and right directions of the intermediate frame 150.

In the cassette mounting unit 400, a cassette 10 loaded with wafers is detachably mounted. The cassette mounting units 400 are located in the front area A of the base frame 100. The cassette mounting units 400 are preferably located to the left of the front region A with respect to the front frame 110 of the base frame 100. The cassette mounting units 400 are arranged in a line in parallel with the guide rail 300. The cassette mounting unit 400 is preferably four. When the cassette mounting units 400 are four, the two cassette mounting units 400 on the left side are respectively equipped with a cassette 10 loaded with wafers to be cleaned, and the two cassette mounting units 400 on the right side are mounted. It is preferable that the cassettes 10 on which the cleaned wafers are loaded are respectively mounted.

3 and 4, the cassette mounting unit 400 fixes the cassette seating member 410 on which the cassette C is seated, and the cassette 10 seated on the cassette seating member 410. A cassette fixing unit 420 for releasing / releasing, an alignment unit 430 for aligning a wafer loaded in the cassette 10 seated on the cassette seating member 410, and a sensor moving up and down along the cassette 10 It includes a fixed unit 440, and a plurality of first sensors (S1) mounted on the sensor fixing unit 440 for detecting the presence and position of the wafer in the loading spaces of the cassette 10. The cassette seating member 410 is preferably provided with a second sensor (S2) for detecting the presence or absence of the cassette (10). The sensor fixing unit 440 is formed in the form of a recess so as to surround the cassette 10, and the fixing member 441 to which the first sensors S1 are mounted, and the vertical member moving the fixing member 441 up and down. Unit (not shown). When the cassette 10 is placed on the cassette seating member 410, the cassette 10 is fixed by the cassette fixing unit 420. After the wafers loaded on the cassette 10 are aligned by the alignment unit 430, the fixing member 441 of the sensor fixing unit 440 moves up and down along the cassette 10 to the first sensors S1. The presence and the presence of a wafer are sensed by each loading space of the cassette 10.

The wafer alignment unit 500 is positioned in the front region of the base frame 100 so that the wafer alignment unit 500 is positioned on the same line as the cassette mounting units 400. The wafer alignment unit 500 is preferably located next to the cassette mounting unit 400 located at the right end when the cassette mounting units 400 are viewed from the front. As illustrated in FIG. 5, the wafer alignment unit 500 sets the position of the wafer so that the wafer is accurately seated at a predetermined position inside the cleaning chamber 200 before the wafer is seated inside the cleaning chamber 200. Will be aligned to the position. The wafer alignment unit 500 includes a support member 510 including a plurality of support shafts 511 on which a wafer is placed, and a support shaft 511 while being moved in a horizontal direction by being positioned at both sides of the support member 510. The left and right positioning members 520 and 530 for aligning the wafers placed on the wafers; and a positioning member driving unit (not shown) for simultaneously moving the left and right positioning members 520 and 530. do. The left and right positioning members 520 and 530 move toward the center of the support member 510 when the wafer is aligned, and move in the opposite direction when the wafer is aligned. The wafer is placed on the support shafts 511 of the support member 510 in a state where the left and right positioning members 520 and 530 are separated from each other. While the wafers are placed on the support shafts 511, the left and right positioning members 520 and 530 move horizontally toward the center of the support member 510, respectively, to align the wafer to a predetermined position.

The inversion unit 600 is located in the front area A of the base frame 100 so as to be in the same line as the cassette mounting units 400. The inversion unit 600 is preferably located next to the wafer alignment unit 500. The inversion unit 600 inverts the wafer back and forth.

As shown in FIGS. 6 and 7, the inversion unit 600 includes a vertical frame 610, a rotating member 620 rotatably coupled to the vertical frame 610, and the rotating member 620. Rotation drive unit 630 for rotating the rotational drive, the linear drive unit 640 is coupled to the rotating member 620 and generates a linear driving force, and the wafer while linearly reciprocating according to the operation of the linear drive unit 640 And a gripper 650 for picking up or placing the wafer, a wafer support unit 660 having a plurality of support pins 661 supporting the wafer, and a vertical drive unit 670 for moving the wafer support unit 660 up and down. do.

The wafer is placed on the support pins 661 of the wafer support unit 660 while the gripper 650 is opened and the wafer support unit 660 is moved upward. In addition, the linear driving unit 640 is operated to narrow the gripper 650 so that the gripper 650 picks up the edge including both sides of the wafer. The wafer picked up by the gripper 650 is reversed by the vertical driving unit 670 moving the wafer support unit 660 downward and the rotation driving unit 630 rotating the rotating member 620 by 180 degrees. The vertical driving unit 670 moves the wafer support unit 660 upward so that the upper surfaces of the support pins 661 of the wafer support unit 660 are positioned on the lower surface of the wafer, and the gripper 650 is opened so that the wafer is supported by the support pins. 661) on the top.

The transfer robot 700 moves along the guide rail 300. The transfer robot may pick up one wafer or two wafers simultaneously. The transfer robot 700 transfers the wafer loaded in the cassette 10 mounted on the cassette mounting unit 400 to the cleaning chamber 200, the wafer alignment unit 500, and the reversing unit 600 according to a process. Move it.

Hereinafter, the operation and effects of the multi-chamber wafer supply and recovery apparatus according to the present invention will be described.

There will be two cleaning chambers 200 and four cassette mounting units 400 will be described. One of the two cleaning chambers 200 is located on the left side of the first cleaning chamber 200 and the right side of the two cleaning chambers 200 is called the second cleaning chamber 200.

First, two cassette mounting units 400 on the left side of the four cassette mounting units 400 are mounted with a cassette 10 loaded with wafers to be cleaned, respectively, and the remaining two cassette mounting units 400 on the right side. The cassettes 10 in which the wafers are not loaded are mounted in each.

The transfer robot 700 picks up a wafer (hereinafter referred to as a first wafer) loaded on the cassette 10 and moves along the guide rail 300 to stop in front of the wafer alignment unit 500. After the transfer robot 700 places the first wafer on the support shafts 511 of the wafer alignment unit 500, the wafer alignment unit 500 aligns the first wafer to a predetermined position. The transfer robot 700 picks up the aligned first wafer and then moves along the guide rail 300 to stop before the first cleaning chamber 200. The transfer robot 700 places the first wafer inside the first cleaning chamber 200. One surface of the first wafer is cleaned in the first cleaning chamber 200. At the same time, the transfer robot 700 moves along the guide rail 300 and stops in front of the cassette mounting unit 400. The transfer robot 700 picks up a wafer (hereinafter referred to as a second wafer) loaded on the cassette 10 and moves in front of the wafer alignment unit 500. After the transfer robot 700 places the second wafer on the support shafts 511 of the wafer alignment unit 500, the wafer alignment unit 500 aligns the second wafer to a predetermined position. The transfer robot 700 picks up the aligned second wafer and then moves along the guide rail 300 to stop before the second cleaning chamber 200. The transfer robot 700 places the second wafer inside the second cleaning chamber 200. One side of the second wafer is cleaned in the second cleaning chamber 200.

The transfer robot 700 moves along the guide rail 300 and stops in front of the first cleaning chamber 200. The transfer robot 700 removes the first wafer having one surface cleaned from the first cleaning chamber 200 and then moves along the guide rail 300 to stop in front of the inversion unit 600. The transfer robot 700 places the first wafer on the support pins 661 of the inversion unit 600, and then the inversion unit 600 inverts the first wafer. After the transfer robot 700 picks up the inverted first wafer, the transfer robot 700 moves along the guide rail 300 to stop in front of the first cleaning chamber 200. The transfer robot 700 is positioned upside down inside the first cleaning chamber 200. The other side of the first wafer is cleaned in the first cleaning chamber 200. The transfer robot 700 moves along the guide rail 300, stops in front of the second cleaning chamber 200, and takes out the second wafer from inside the second cleaning chamber 200. The transfer robot 700 moves along the guide rail 300 and stops in front of the inversion unit, and then places the second wafer on the support pins 661 of the inversion unit 600. The inversion unit 600 inverts the second wafer. After the transfer robot 700 picks up the inverted second wafer, the transfer robot 700 moves along the guide rail 300 to stop in front of the second cleaning chamber 200. The transfer robot 700 places the second wafer inside the second cleaning chamber 200. The other side of the second wafer is cleaned in the second cleaning chamber 200.

The transfer robot 700 removes the wafer to be cleaned from the cassette 10 and places the wafer (hereinafter referred to as a third wafer) on the support shafts 511 of the wafer alignment unit 500. The wafer alignment unit 500 aligns the third wafer to the set position. At the same time, the transfer robot 700 removes the first wafer on which both sides are cleaned from the first cleaning chamber 200 and then mounts the cassette mounting unit 400 to the empty cassette 10 in which the wafers are not loaded. Load it. The third wafer, in which the transfer robot 700 is aligned, is picked up from the wafer alignment unit 500 and positioned in the first cleaning chamber 200. The transfer robot 700 removes the wafer to be cleaned from the cassette 10 and places the wafer (hereinafter referred to as a fourth wafer) on the support shafts 511 of the wafer alignment unit 500. The wafer alignment unit 500 aligns the fourth wafer to the set position. At the same time, the transfer robot 700 removes the second wafer having both surfaces cleaned from the second cleaning chamber 200, and then loads the empty wafer 10 in which the wafers are not loaded, mounted on the cassette mounting unit 400. Load it. The fourth wafer on which the transfer robot 700 is aligned is picked up from the wafer alignment unit 500 and positioned in the second cleaning chamber 200.

By repeating the above process, the wafers to be cleaned, which are loaded in the cassette 10, are cleaned and loaded in the empty cassette 10. The above process may be changed according to the time for cleaning the wafer in the first and second cleaning chambers 200.

According to the present invention, the cleaning chambers 200 are arranged in a horizontal direction in the rear region B of the base frame 100, and the cassette mounting units 400 and the wafer are disposed in the front region A of the base frame 100. The alignment unit 500 and the inversion unit 600 are arranged in a line in the left-right direction, the rows of the cleaning chambers 200 in the rear region B, the cassette mounting units 400 in the front region A, and the wafer alignment. The lines of the transfer robot 700 are moved by allowing the wafers to be cleaned while the rows of the unit 500 and the reversing unit 600 are parallel to each other and the transfer robot 700 moves in a straight line between the two rows in parallel with the two rows. The process is short and efficient, which reduces the time to clean the wafer. In addition, since the configuration is compact, the size of the cleaning equipment is reduced, thus occupying less installation space of the equipment.

In addition, the present invention includes an inverting unit 600 that flips the wafer back and forth, so that both the front and back surfaces of the wafer, i.e., both surfaces, can be cleaned, so the configuration is compact. Cleaning one side of the wafer and cleaning the other side of the wafer with other equipment is complicated because it takes much time to clean both sides of the wafer and requires two cleaning equipments to be installed.

In addition, the present invention includes a wafer alignment unit 500, so that the wafer is aligned with the set position before the wafer is inserted into the cleaning chamber 200, and then the inside of the cleaning chamber 200 is positioned. The entire surface of one side of the wafer is cleaned cleanly inside.

100; A base frame 200; Cleaning chamber
300; Guide rail 400; Cassette Loading Unit
500; Wafer alignment unit 600; Reversing unit

Claims (5)

A base frame;
Cleaning chambers arranged in a row at a rear region of the base frame, each of which cleans a wafer;
A guide rail positioned parallel to the cleaning chambers;
A plurality of cassette mounting units arranged in a front region of the base frame in parallel with the guide rails, the cassettes being detachably stacked;
A wafer alignment unit positioned in a front region of the base frame to be aligned with the cassette mounting units and aligning the wafer;
An inversion unit positioned in the front region of the base frame to be in line with the cassette mounting units and inverting the wafer back and forth;
And a transfer robot moving along the guide rail and moving the wafer loaded in the cassette mounted on the cassette mounting unit to the cleaning chamber, the wafer alignment unit, and the inversion unit according to a process. Device. The multi-chamber wafer supply and recovery apparatus of claim 1, wherein there are two cleaning chambers, and the two cleaning chambers are located in a left-right direction with respect to the front surface of the base frame. The multi-chamber wafer supply and recovery apparatus according to claim 1, wherein the cassette mounting units are four. The multi-chamber wafer supply and recovery apparatus of claim 1, wherein the wafer alignment unit is positioned next to the cassette mounting units, and the inversion unit is positioned next to the wafer alignment unit. The method of claim 1, wherein the transfer robot transfers the wafers loaded in the wafer cassette mounted on the cassette mounting unit to the wafer alignment unit, transfers the wafers aligned in the wafer alignment unit to the cleaning chamber, and cleans the wafer. Transfer the wafer cleaned in the chamber to the inversion unit, transfer the wafer inverted back and forth in the inversion unit to the cleaning chamber, and insert the wafer cleaned in the cleaning chamber into a wafer cassette mounted in the cassette mounting unit. Multi-chamber wafer supply and recovery apparatus.
KR1020120095246A 2012-08-29 2012-08-29 Apparatus for providing and retrieving a wafer in mult-chamber system KR101329960B1 (en)

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KR1020120095246A KR101329960B1 (en) 2012-08-29 2012-08-29 Apparatus for providing and retrieving a wafer in mult-chamber system

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101467523B1 (en) * 2014-02-07 2014-12-01 (주)버금시스템 Device for Transfering Board
KR101779322B1 (en) 2017-08-01 2017-10-10 강성찬 Wafer Cleaner with Improved Operational Pattern

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774139A (en) * 1993-09-02 1995-03-17 Tokyo Electron Ltd Washing treatment apparatus of semiconductor wafer
KR100413067B1 (en) 2001-09-28 2003-12-31 한국디엔에스 주식회사 Apparatus for cleaning wafer of semiconductor fabrication equipment
KR20070033563A (en) * 2005-09-21 2007-03-27 삼성전자주식회사 Apparatus for cleaning wafer

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0774139A (en) * 1993-09-02 1995-03-17 Tokyo Electron Ltd Washing treatment apparatus of semiconductor wafer
KR100413067B1 (en) 2001-09-28 2003-12-31 한국디엔에스 주식회사 Apparatus for cleaning wafer of semiconductor fabrication equipment
KR20070033563A (en) * 2005-09-21 2007-03-27 삼성전자주식회사 Apparatus for cleaning wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101467523B1 (en) * 2014-02-07 2014-12-01 (주)버금시스템 Device for Transfering Board
KR101779322B1 (en) 2017-08-01 2017-10-10 강성찬 Wafer Cleaner with Improved Operational Pattern

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