JP5990279B2 - Component mounter - Google Patents

Description

  The present invention relates to a component mounter for mounting components (electronic components, chips) on a substrate, such as a mounter and a chip bonding apparatus.

  Patent Document 1 discloses a wafer cassette. An optical sensor is disposed in the wafer accommodating portion. According to the wafer cassette described in the same document, it is possible to detect the presence or absence of a wafer in the accommodating portion.

JP-A 63-289828

  Here, the wafer has a large number of chips. A large number of chips are taken out of the wafer cassette by the suction nozzle and mounted on the substrate. The position of a large number of chips is not constant between a plurality of wafers. For this reason, for each wafer, it is necessary to set the position (suction start position) of the chip to be suctioned first among many chips.

  With respect to the wafer in the accommodating portion from the beginning, the suction start position has already been set. On the other hand, it is necessary to set the suction start position for a wafer (replaced wafer) in the housing part from the middle.

  However, the wafer cassette described in this document only confirms the presence or absence of a wafer prior to taking out a chip from the wafer. For this reason, it is not possible to detect the wafer withdrawal history for the accommodating portion. Therefore, the wafer replacement determination cannot be performed. That is, it cannot be determined whether the wafer in the storage unit is the wafer in the storage unit from the beginning or the wafer in the storage unit from the middle. For this reason, even if there is a replaced wafer, there is a possibility that the processing may proceed without noticing. In this case, a chip recognition error may occur. In addition, a wrong chip may be mounted on the substrate and a defective product may be produced. In order to avoid such a situation, it is necessary to reset the suction start position for every wafer mounted on the wafer cassette each time.

  The same applies to the electronic component supply apparatus. That is, a large number of electronic components are placed on the tray of the electronic component supply device. In the case of the conventional electronic component supply apparatus, the tray replacement determination cannot be performed. For this reason, it is necessary to perform an operation for setting the suction start position for all trays. In addition, it is necessary to confirm that electronic components are placed on the trays for all trays. Further, when an electronic component is placed on the tray, it is necessary to confirm the type of the electronic component.

  Accordingly, an object of the present invention is to provide a component mounter that can determine whether or not a tray or wafer pallet is extracted from a component supply apparatus.

  (1) In order to solve the above-described problem, the component mounter of the present invention includes a component supply device having a magazine having a tray on which electronic components are mounted or a slot in which a wafer pallet on which wafers are mounted is removably accommodated. And a mounting machine main body to which the component supply device is mounted, and further comprising an extraction monitoring sensor for monitoring the extraction of the tray or the wafer pallet from the slot, and the mounting machine The main body includes a control device that determines an extraction history of the tray or the wafer pallet with respect to the slot based on a signal from the extraction monitoring sensor.

  According to the component mounting machine of the present invention, the control device of the mounting machine body extracts the tray or wafer pallet (hereinafter referred to as “tray or the like” as appropriate) from the slot based on the signal from the extraction monitoring sensor. The withdrawal history (presence / absence of past withdrawal) can be determined. That is, the extraction history of the tray or the like can be detected. For this reason, it is possible to determine whether to replace the tray or the like. Therefore, it can be determined whether the tray or the like in the slot is the tray or the like in the slot from the beginning or the tray or the like in the slot from the middle. Therefore, it is not necessary to reset the suction start position of the component (electronic component, wafer chip) for all trays mounted on the magazine. The suction start position may be set only for the exchanged tray or the like.

  Moreover, it is not necessary to confirm that the parts are placed on the trays and the like for all the trays and the like mounted on the magazine. It is only necessary to check the presence or absence of parts only for the replaced tray. Moreover, what is necessary is just to confirm the kind of components mounted in the tray etc. only about the replaced | exchanged tray etc. FIG.

  (2) Preferably, in the configuration of (1), the component supply device includes an extraction history holding unit that displays an extraction history of the tray or the wafer pallet with respect to the slot, and the extraction monitoring sensor It is better to set a detection area where the extraction history holding unit can be detected. According to this configuration, when the extraction monitoring sensor detects the extraction history holding unit, it is possible to determine whether or not the tray or the like is extracted from the slot.

  (3) Preferably, in the configuration of (2), the position of the extraction history holding portion when the tray or the wafer pallet is not extracted from the slot is a non-extraction position, and the tray with respect to the slot Alternatively, with the position of the extraction history holding unit when the wafer pallet is extracted as the extraction position, the component supply device extracts the load when the tray or the wafer pallet is extracted from the slot. To move the extraction history holding unit from the non-extraction position to the extraction position, and the tray or the wafer pallet is inserted again into the slot where the tray or the wafer pallet has been extracted. However, it is better to have a structure having a holding part moving mechanism for holding the extraction history holding part at the extraction position.

  The holding unit moving mechanism uses the extraction load (for example, changes the transmission direction of the extraction load) and moves the extraction history holding unit. That is, the holding unit moving mechanism moves the extraction history holding unit from the non-extraction position to the extraction position by a mechanical mechanism. The holding unit moving mechanism holds the extraction history holding unit at the extraction position by a mechanical mechanism.

  For this reason, according to this configuration, even when the tray or the like is extracted from the slot in a state where power is not supplied to the component supply device (non-energized state), the extraction history holding unit is not extracted. It can be moved from the extraction position to the extraction position. Further, in the non-energized state, even when the tray or the like is reinserted into the slot after the tray or the like is extracted, the extraction history holding unit can be held at the extraction position. That is, even in the non-energized state, the extraction history of the tray or the like can be recorded. For this reason, for example, even when the component supply device is detached from the mounting machine main body, the extraction history of the tray or the like can be recorded. Further, for example, even when the component supply device is attached to the mounting machine main body but the power of the mounting machine main body is not turned on, the extraction history of the tray or the like can be recorded.

  (3-1) Preferably, in the configuration of (3), all the extraction history holding units at the extraction position are moved at once from the extraction position to the non-extraction position. A configuration including a holding unit reset mechanism is preferable. According to this configuration, after determining whether or not the tray or the like has been extracted from the slot, the control device of the mounting machine main body aligns all the extraction history holding units at the non-extraction position at once by the holding unit reset mechanism. Can do.

  (4) Preferably, in the configuration of (2) or (3), a plurality of the slots are arranged, and a plurality of the extraction history holding units are arranged corresponding to the plurality of the slots, and the extraction A single monitoring sensor is disposed, and the component supply device has a magazine lifting mechanism capable of moving up and down the magazine together with a plurality of the extraction history holding units, and the detection area of the extraction monitoring sensor It is better to have a configuration that is set at a holding portion passage position through which the plurality of extraction history holding portions pass as it moves up and down.

  According to this configuration, the detection area is set on the trajectory of the plurality of extraction history holding units. Therefore, relatively, a plurality of extraction history holding units can be scanned by the detection area that moves on the orbit of the extraction history holding unit. Therefore, all the extraction history holding units can be detected by a single extraction monitoring sensor.

  In addition, in an existing component supply device, a magazine lifting mechanism is arranged to carry out a plurality of trays and the like stacked in the vertical direction from a predetermined altitude. The magazine lifting mechanism can be used when moving the plurality of extraction history holding units. Thus, according to this structure, the versatility with respect to the existing component supply apparatus becomes high.

  (5) Preferably, in the configuration of (1), a plurality of the slots are arranged, and a plurality of the extraction monitoring sensors are arranged corresponding to the plurality of slots. According to this configuration, it is not necessary to arrange an extraction history holding unit in the component supply device. This simplifies the structure of the component supply device. Further, according to this configuration, it is not necessary to scan a plurality of extraction history holding units. For this reason, the time required to determine whether or not the tray or the like has been removed can be shortened.

  According to the present invention, it is possible to provide a component mounter capable of determining whether or not a tray or a wafer pallet is extracted from a component supply apparatus.

FIG. 1 is a right side view of the chip bonding apparatus according to the first embodiment. FIG. 2 is a block diagram of the chip bonding apparatus. FIG. 3 is an enlarged view in the frame III of FIG. FIG. 4 is a perspective view of the wafer pallet. FIG. 5 is a right side view of the magazine of the wafer supply apparatus of the chip bonding apparatus. 6 is a cross-sectional view in the VI-VI direction of FIG. FIG. 7 is a right side view of the magazine of the wafer supply apparatus of the chip bonding apparatus when the wafer pallet is extracted. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. FIG. 9 is a cross-sectional view of the vicinity of the extraction history holding unit of the wafer supply apparatus of the chip bonding apparatus as seen from above when the wafer pallet is inserted. FIG. 10 is a cross-sectional view of the wafer supply apparatus of the chip bonding apparatus as viewed from the right when the magazine is inserted. FIG. 11 is a cross-sectional view of the wafer supply apparatus of the chip bonding apparatus viewed from the right when pallet replacement is detected. FIG. 12 is a cross-sectional view of the vicinity of the extraction history holding unit of the wafer supply apparatus of the chip bonding apparatus as seen from above when the holding unit is reset. FIG. 13: is sectional drawing seen from the right at the time of pallet replacement | exchange detection of the wafer supply apparatus of the chip bonding apparatus of 2nd embodiment. FIG. 14 is a cross-sectional view before extracting a wafer pallet in the vicinity of an extraction history holding unit of a wafer supply apparatus of a chip bonding apparatus according to another embodiment.

1: Chip bonding device (component mounting machine).
2: Base.
3: Module, 30: Substrate transport device, 302: Clamp unit, 303: Substrate transport unit, 31: XY robot, 310: Y axis slider, 311: X axis slider, 312: Y axis guide rail, 313: X axis guide Rail, 314: X-axis motor, 315: Y-axis motor, 32: Mounting head, 320: Suction nozzle, 322: Z-axis motor, 323: θ-axis motor, 33: Control device, 330: Calculation unit, 331: Storage unit 332: input / output interface, 34: device pallet, 35: substrate lifting apparatus.
4: Device main body (mounting machine main body).
5: Wafer supply device (component supply device), 50: Wafer pallet, 51: Magazine, 510: Holding portion moving hole, 510a: Rotating shaft, 510b: Non-extraction position stopper, 510c: Extraction position stopper, 511: Guide rib, 52: Magazine lifting mechanism, 520: Lifting table, 521: Ball screw part, 521a: Shaft, 521b: Nut, 522: Z-axis motor, 53: Pallet transporting part, 530: Transporting motor, 54: Housing, 540: Pallet entrance / exit, 541: magazine exchange port, 542: door, 55: arm, 56: extraction history holding part, 560: detected part, 561: input slope, 57: holding part moving mechanism, 570: linear motion member, 570a : Input slope, 570b: Output slope, 571: Rotating member, 571a: Inner end, 571b: Outer end, 58: Holding part reset mechanism 580: guide rail, 581: reset bar 582: Reset motor.
60: Wafer grip ring, 61: Wafer sheet, 62: Wafer, 620: Chip.
70: Extraction monitoring sensor, 71: Input / output interface.
9: Bogie.
B: substrate, F: floor, F1: extraction load, P1: extraction position, P2: non-extraction position, P3: suction start position, S: slot.

  Hereinafter, an embodiment in which the component mounter of the present invention is embodied as a chip bonding apparatus will be described.

<First embodiment>
[Configuration of chip bonding equipment]
First, the configuration of the chip bonding apparatus of this embodiment will be described. FIG. 1 shows a right side view of the chip bonding apparatus of the present embodiment. The housing of the module 3 is shown in a transparent manner. As shown in FIG. 1, the chip bonding apparatus 1 includes an apparatus main body 4, a wafer supply apparatus 5, and an extraction monitoring sensor. The apparatus main body 4 is included in the concept of the “mounting machine main body” of the present invention. The wafer supply device 5 is included in the concept of the “component supply device” of the present invention.

(Device body 4)
The apparatus main body 4 includes a base 2 and a module 3. The base 2 is disposed on the floor F of the factory. The module 3 is disposed on the upper surface of the base 2. The module 3 includes a substrate transfer device 30, an XY robot 31, a mounting head 32, a control device, a device pallet 34, and a substrate lifting device 35.

  The substrate transfer device 30 includes a clamp unit 302 and a substrate transfer unit 303. The substrate transport unit 303 includes a pair of conveyor belts. The substrate transport unit 303 can transport the substrate B in the left-right direction. The clamp unit 302 includes a pair of clamp pieces. The clamp unit 302 is disposed on the upper side of the substrate transport unit 303.

  The substrate lifting device 35 is disposed below the substrate transport unit 303. The substrate lifting device 35 can lift the substrate B from the substrate transfer unit 303. When the chip is mounted, the substrate B is sandwiched and fixed from above and below by the clamp unit 302 and the substrate lifting device 35.

  The XY robot 31 includes a Y-axis slider 310, an X-axis slider 311, a pair of left and right Y-axis guide rails 312, and a pair of upper and lower X-axis guide rails 313. The X direction corresponds to the left-right direction, the Y direction corresponds to the front-rear direction, and the Z direction corresponds to the up-down direction.

  The pair of left and right Y-axis guide rails 312 is disposed on the upper surface of the housing internal space of the module 3. The Y-axis slider 310 is attached to a pair of left and right Y-axis guide rails 312 so as to be slidable in the front-rear direction. The pair of upper and lower X-axis guide rails 313 is disposed on the front surface of the Y-axis slider 310. The X-axis slider 311 is attached to a pair of upper and lower X-axis guide rails 313 so as to be slidable in the left-right direction.

  The mounting head 32 is attached to the X-axis slider 311. For this reason, the mounting head 32 can be moved in the front-rear and left-right directions by the XY robot 31. A suction nozzle 320 is attached to the mounting head 32. The suction nozzle 320 is movable in the vertical direction with respect to the mounting head 32. Further, the suction nozzle 320 is rotatable around its own axis. The device pallet 34 is arranged at the front of the housing of the module 3. A wafer supply apparatus 5 described later can be attached to and detached from the device pallet 34.

  FIG. 2 shows a block diagram of the chip bonding apparatus of this embodiment. As illustrated in FIG. 2, the control device 33 includes a calculation unit 330, a storage unit 331, and an input / output interface 332. The input / output interface 332 is electrically connected to the X-axis motor 314, the Y-axis motor 315, the Z-axis motor 322, and the θ-axis motor 323. The X-axis motor 314 is for driving the X-axis slider 311. The Y-axis motor 315 is for driving the Y-axis slider 310. The Z-axis motor 322 is for raising and lowering the suction nozzle 320. The θ-axis motor 323 is for rotating the suction nozzle 320.

(Wafer supply device 5)
FIG. 3 shows an enlarged view in the frame III of FIG. As shown in FIGS. 1 and 3, the wafer supply apparatus 5 is disposed on the front side of the device pallet 34. The wafer supply apparatus 5 includes a plurality of wafer pallets 50, a magazine 51, a magazine elevating mechanism 52, a pallet transfer unit 53, a housing 54, a pair of left and right arms 55, an extraction history holding unit 56, and a holding unit. A moving mechanism and a holding unit reset mechanism are provided.

  The housing 54 has a rectangular parallelepiped box shape. The housing 54 is mounted on the upper surface of the carriage 9. A pallet entrance 540 is opened on the rear wall of the housing 54. On the other hand, a magazine exchange port 541 is opened on the front wall of the housing 54. An openable / closable door 542 is disposed at the magazine exchange port 541.

  The magazine 51 has a rectangular tube shape having openings at the front and rear ends. The magazine 51 is accommodated in the housing 54. A plurality of guide ribs 511 are respectively disposed on the left wall right surface and the right wall left surface of the magazine 51. The guide rib 511 extends in the front-rear direction (the moving direction of the wafer pallet 50). The plurality of guide ribs 511 are arranged side by side in the vertical direction (the stacking direction of the wafer pallet 50). A slot S is defined between a pair of guide ribs 511 adjacent in the vertical direction. In the slot S, a wafer pallet 50 is accommodated in a state of being laid between a pair of left and right guide ribs 511. The wafer pallet 50 can slide in a front-rear direction on a pair of left and right guide ribs 511. The configuration of the wafer pallet 50 will be described in detail later.

  The magazine lifting mechanism 52 includes a lifting table 520, a ball screw portion 521, and a Z-axis motor 522 (see FIG. 2). The ball screw portion 521 includes a shaft 521a and a nut 521b. By rotating the nut 521b with the driving force of the Z-axis motor 522, the shaft 521a can be moved in the vertical direction. The lifting table 520 is disposed at the upper end of the shaft 521a. A magazine 51 is placed on the upper surface of the lifting table 520. The magazine 51 can move in the vertical direction together with the lifting table 520.

  The pair of left and right arms 55 project from the housing 54 toward the rear side. The pair of left and right arms 55 are disposed on both the left and right sides of the pallet doorway 540. In a state where the wafer supply apparatus 5 is mounted on the apparatus main body 4, the rear ends of the pair of arms 55 are installed on the upper edge of the device pallet 34. In this state, as shown in FIG. 2, the apparatus main body 4 and the wafer supply apparatus 5 are electrically connected. For this reason, the wafer supply apparatus 5 can be operated by the power source of the apparatus body 4.

  The pallet transport unit 53 includes a pair of left and right conveyor belts. The wafer pallet 50 to be transported is constructed between a pair of conveyor belts. When the conveyor belt is driven by a transport motor 530 (see FIG. 2), the wafer pallet 50 can move in the front-rear direction.

  FIG. 4 shows a perspective view of the wafer pallet. As shown in FIG. 4, a wafer grip ring 60 is placed on the upper surface of the wafer pallet 50. A wafer sheet 61 is disposed on the wafer grip ring 60 in a state of being stretched in the horizontal direction. A wafer 62 is attached to the wafer sheet 61. The wafer 62 is composed of a large number of individual chips 620. Many chips 620 are formed by cutting a circular wafer 62 into a lattice shape. An integrated circuit (not shown) is formed on each of the many chips 620.

  FIG. 5 shows a right side view of the magazine of the wafer supply device of the chip bonding apparatus of this embodiment. The internal configuration of the magazine is indicated by a thin line. FIG. 6 is a cross-sectional view in the VI-VI direction of FIG.

  As shown in FIGS. 5 and 6, a holding portion moving hole 510 is opened for each slot S on the front side of the right wall of the magazine 51. The holding portion moving hole 510 has a long hole shape that is long in the front-rear direction. The extraction history holding unit 56 is accommodated in the holding unit moving hole 510 so as to be movable in the front-rear direction. However, the extraction history holding part 56 cannot move in the left-right direction with respect to the holding part moving hole 510.

  A circular detected portion 560 is recessed in the right surface (outer surface) of the extraction history holding portion 56. An input slope 561 is disposed on the left surface (inner surface) of the extraction history holding unit 56. The input slope 561 extends in a left rear-right front direction (a direction in which the direction of the load is changed to move the extraction history holding unit 56 rearward when a load is applied from the left side). The position where the extraction history holding part 56 is in contact with the rear end of the holding part moving hole 510 is the extraction position P1. On the other hand, the position where the extraction history holding part 56 is in contact with the front end of the holding part moving hole 510 is the non-extraction position P2.

  The holding unit reset mechanism 58 includes a pair of upper and lower guide rails 580 and a reset bar 581. The guide rail 580 extends in the front-rear direction. The upper guide rail 580 is disposed above the uppermost holding portion moving hole 510. On the other hand, the lower guide rail 580 is disposed below the lowermost holding portion moving hole 510. The reset bar 581 is installed between a pair of upper and lower guide rails 580. The reset bar 581 is slidable in the front-rear direction with respect to the pair of upper and lower guide rails 580. As shown in FIG. 6, the reset bar 581 is arranged on the rear side of the extraction history holding unit 56. By moving the reset bar 581 to the front side, all the extraction history holding units 56 can be moved to the front side. That is, all the extraction history holding parts 56 can be aligned at the non-extraction position P2 at a time. The reset bar 581 is connected to a reset motor 582 shown in FIG. 2 through a gear (not shown). That is, the reset bar 581 is driven by the reset motor 582.

  As shown in FIG. 6, the holding unit moving mechanism 57 includes a linear moving member 570. The linear moving member 570 is accommodated in the holding portion moving hole 510 so as to be movable in the left-right direction. However, the linear moving member 570 is not movable in the front-rear direction with respect to the holding portion moving hole 510.

  On the left surface (inner surface) of the linear motion member 570, an input slope 570a is disposed. The input slope 570a extends in the right rear-left front direction (the direction in which the direction of the load is changed to move the linear motion member 570 to the right when a load is applied from the rear side). On the other hand, an output slope 570 b is disposed on the right surface (outer surface) of the linear motion member 570. The output slope 570b extends in the left rear-right front direction (a direction in which the direction of the load is changed to move the extraction history holding unit 56 rearward when a load is applied from the left side). The output slope 570b and the input slope 561 can slide relative to each other.

(Extraction monitoring sensor 70)
As shown in FIG. 2, the withdrawal monitoring sensor 70 is electrically connected to the control device 33 via the input / output interface 71. As shown in FIG. 3, the extraction monitoring sensor 70 is disposed on the left surface (inner surface) of the right wall of the housing 54. The detection area of the extraction monitoring sensor 70 is a position through which the extraction position P1 (specifically, the detected part 560 of the extraction history holding unit 56 arranged at the extraction position P1) passes as the magazine 51 moves up and down ( Is set to the holding portion passage position).

[Movement of chip bonding equipment]
Next, the movement of the chip bonding apparatus of this embodiment during the production of the substrate will be briefly described. First, the control device 33 shown in FIG. 2 drives the Z-axis motor 522 to raise and lower the magazine 51 shown in FIG. Then, the altitude of the desired wafer pallet 50 is aligned with the altitude of the pallet entrance / exit 540. Next, the controller 33 shown in FIG. 2 drives the transport motor 530 to move the desired wafer pallet 50 to a predetermined position above the device pallet 34 as shown in FIG. Subsequently, when the control device 33 shown in FIG. 2 appropriately drives the X-axis motor 314, the Y-axis motor 315, the Z-axis motor 322, and the θ-axis motor 323, the suction nozzle 320 shown in FIG. The chip 620 is transferred from the wafer 62 to the predetermined coordinates of the substrate B shown in FIG. The conveyance of the chips 620 by the suction nozzle 320 is executed in a predetermined order from the chip 620 at the suction start position P3 shown in FIG. In this way, the chip 620 is mounted on the substrate B during substrate production.

[Motion during wafer pallet exchange]
Next, the movement of the chip bonding apparatus of this embodiment when exchanging the wafer pallet will be described. The exchange of the wafer pallet 50 is performed at the time of setup change (before the above-described substrate production).

  FIG. 7 is a right side view of the magazine of the wafer supply device of the chip bonding apparatus of this embodiment when the wafer pallet is extracted. The internal configuration of the magazine is indicated by a thin line. FIG. 8 is a sectional view taken along the line VIII-VIII in FIG. FIG. 9 is a cross-sectional view, as viewed from above, when the wafer pallet is inserted in the vicinity of the extraction history holding unit of the wafer supply apparatus. FIG. 9 corresponds to FIG.

  First, the operator opens the door 542 shown in FIG. Next, the operator takes out the magazine 51 from the inside of the housing 54 through the magazine exchange port 541. Subsequently, the operator removes the desired wafer pallet 50 (the uppermost wafer pallet 50 in this example) from the front side (extraction history holding unit 56 side) of the magazine 51 as indicated by the white arrow in FIG. , Pull out.

  When the operator pulls out the wafer pallet 50, as shown in FIG. 8, the extraction load F1 from the rear side is transmitted from the wafer pallet 50 to the linear motion member 570 from the left side via the input slope 570a. The linearly moving member 570 moves to the right side by the transmitted load F2 (see FIG. 6). The load F2 from the left side is transmitted from the linear movement member 570 to the extraction history holding unit 56 from the front side via the output slope 570b and the input slope 561. Due to the transmitted load F3, the extraction history holding unit 56 moves rearward (see FIG. 6). As described above, when the operator extracts the wafer pallet 50, the extraction history holding unit 56 is moved from the non-extraction position P2 to the extraction position P1 only by a mechanical mechanism (without using an electric mechanism). Moving.

  As shown in FIG. 9, when the operator inserts a new wafer pallet 50 into the magazine 51, the wafer pallet 50 passes the left side (inside) of the extraction history holding unit 56 from the front side to the rear side. Here, as shown in FIG. 9, the linearly moving member 570 remains moved to the right (see FIG. 6). For this reason, the linear motion member 570 does not interfere with the wafer pallet 50. Therefore, even when a new wafer pallet 50 is inserted, the extraction history holding unit 56 remains held at the extraction position P1. That is, the extraction history of the old wafer pallet 50 is kept.

  FIG. 10 is a cross-sectional view of the wafer supply device of the chip bonding apparatus according to the present embodiment viewed from the right when the magazine is inserted. FIG. 10 corresponds to FIG. Finally, as shown in FIG. 10, the operator inserts the magazine 51 whose wafer pallet 50 has been exchanged into the housing 54 through the magazine exchange port 541.

[Motion when detecting wafer pallet exchange]
Next, the movement of the chip bonding apparatus according to the present embodiment when wafer pallet replacement is detected will be described. FIG. 11 is a cross-sectional view of the wafer supply device of the chip bonding apparatus according to the present embodiment as viewed from the right when pallet replacement is detected. FIG. 11 corresponds to FIG.

  The controller 33 shown in FIG. 2 drives the Z-axis motor 522 to raise and lower the magazine 51 shown in FIG. At this time, the extraction position P1 passes through the detection area of the extraction monitoring sensor 70. Here, the extraction history holding part 56 of the slot S in which the new wafer pallet 50 is inserted has moved to the extraction position P1. The extraction monitoring sensor 70 detects the detected part 560 of the extraction history holding part 56 at the extraction position P1. On the other hand, the extraction monitoring sensor 70 does not detect the detected part 560 of the extraction history holding part 56 at the non-extraction position P2. Based on the signal from the extraction monitoring sensor 70, the arithmetic unit 330 of the control device 33 shown in FIG. 2 indicates that the old wafer pallet 50 has been extracted only for the uppermost slot S, that is, the new wafer pallet 50. Is determined to have been inserted. The storage unit 331 stores the determination result.

  Here, the coordinates of the suction start position P <b> 3 shown in FIG. 4 vary depending on the extent to which the wafer sheet 61 is stretched with respect to the wafer grip ring 60. The calculation unit 330 refers to the determination result of the storage unit 331 and resets the suction start position P3 only for the wafer 62 of the newly inserted wafer pallet 50.

  In addition, the calculation unit 330 performs the check operation of the chip 620 only on the newly inserted wafer pallet 50. The confirmation work is executed by reading the ID arranged on the wafer pallet 50 with an imaging device (not shown, for example, a CCD (Charge-Coupled Device) camera).

  FIG. 12 is a cross-sectional view of the wafer supply apparatus of the chip bonding apparatus according to this embodiment viewed from above when the holding unit is reset in the vicinity of the extraction history holding unit. FIG. 12 corresponds to FIG.

  2 drives the reset motor 582 to move the reset bar 581 shown in FIG. 7 to the front side. Then, the uppermost extraction history holding unit 56 is returned from the extraction position P1 to the non-extraction position P2. Specifically, as shown in FIG. 12, the load F4 due to the movement of the reset bar 581 is transmitted from the reset bar 581 to the extraction history holding unit 56 from the rear side. With the transmitted load F5, the extraction history holding unit 56 moves from the extraction position P1 to the non-extraction position P2. The load F5 is transmitted from the extraction history holding unit 56 to the linear motion member 570 from the right side (outside) via the input slope 561 and the output slope 570b. The linear motion member 570 moves to the left (inside) by the transmitted load F6.

  The reset of the extraction history holding unit 56 is executed after the calculation unit 330 shown in FIG. 2 determines that a new wafer pallet 50 has been inserted and the storage unit 331 stores the determination result.

[Function and effect]
Next, the function and effect of the chip bonding apparatus of this embodiment will be described. According to the chip bonding apparatus 1 of the present embodiment, as shown in FIG. 2 and FIG. Can be determined. That is, the extraction history of the wafer pallet 50 can be detected. Therefore, it is possible to determine whether to replace the wafer pallet 50. Therefore, it can be determined whether the wafer pallet 50 in the slot S is the wafer pallet 50 in the slot S from the beginning or the wafer pallet 50 in the slot S from the middle. Therefore, it is not necessary to reset the suction start position P3 of the chip 620 of the wafer 62 shown in FIG. 4 for all the wafer pallets 50 mounted in the magazine 51. The suction start position P3 may be set only for the replaced wafer pallet 50.

  Further, it is not necessary to confirm that the wafer 62 is placed on the wafer pallet 50 for all the wafer pallets 50 mounted on the magazine 51. The presence or absence of the wafer 62 may be confirmed only for the replaced wafer pallet 50. In addition, only for the replaced wafer pallet 50, the type of the chip 620 placed on the wafer pallet 50 may be confirmed.

  Further, according to the chip bonding apparatus 1 of the present embodiment, as shown in FIG. 8, the holding unit moving mechanism 57 moves the extraction history holding unit 56 using the extraction load F1. That is, the holding part moving mechanism 57 moves the extraction history holding part 56 from the non-extraction position P2 to the extraction position P1 by a mechanical mechanism. Moreover, as shown in FIG. 9, the holding | maintenance part moving mechanism 57 hold | maintains the extraction log | history holding part 56 in the extraction position P1 with a mechanical mechanism.

  For this reason, as shown in FIG. 7, even when the wafer pallet 50 is extracted from the slot S in a state where no power is supplied to the wafer supply device 5 (non-energized state), the extraction history The holding part 56 can be moved from the non-extraction position P2 to the extraction position P1. In the non-energized state, even when the wafer pallet 50 is reinserted into the slot S after the wafer pallet 50 is extracted, the extraction history holding unit 56 can be held at the extraction position P1. That is, even in a non-energized state, the extraction history of the wafer pallet 50 can be recorded. Therefore, for example, even when the carriage 9 (wafer supply device 5) shown in FIG. 1 is detached from the apparatus main body 4, the extraction history of the wafer pallet 50 can be recorded. Further, for example, even when the cart 9 (wafer supply device 5) is attached to the apparatus main body 4, the extraction history of the wafer pallet 50 can be recorded even when the apparatus main body 4 is not turned on. it can.

  Moreover, the chip bonding apparatus 1 of this embodiment is provided with the holding | maintenance part reset mechanism 58 as shown in FIG. 7, FIG. Therefore, after the controller 33 shown in FIG. 2 determines whether or not the wafer pallet 50 is extracted from the slot S, all the extraction history holding units 56 can be aligned at the non-extraction position P2.

  Further, according to the chip bonding apparatus 1 of the present embodiment, as shown in FIG. 3, the detection area of the extraction monitoring sensor 70 is set on the track of the extraction position P1. For this reason, the extraction position P1 can be scanned relatively by the detection area moving on the orbit of the extraction position P1. Therefore, all the extraction history holding parts 56 existing in the extraction position P1 can be detected by the single extraction monitoring sensor 70.

  Further, in the existing wafer supply apparatus 5, a magazine lifting / lowering mechanism 52 is arranged in order to align the desired altitude of the wafer pallet 50 with the altitude of the pallet entrance / exit 540. The magazine lifting / lowering mechanism 52 can be used when the extraction position P1 is moved in the vertical direction. Thus, according to the chip bonding apparatus 1 of this embodiment, the versatility with respect to the existing wafer supply apparatus 5 becomes high.

<Second embodiment>
The difference between the chip bonding apparatus of this embodiment and the chip bonding apparatus of the first embodiment is that a plurality of extraction detection sensors are arranged. Here, only differences will be described.

  FIG. 13 is a cross-sectional view of the wafer supply device of the chip bonding apparatus according to the present embodiment as viewed from the right when pallet replacement is detected. In addition, about the site | part corresponding to FIG. 11, it shows with the same code | symbol. As shown in FIG. 13, the extraction monitoring sensor 70 is disposed on the left surface (inner surface) of the right wall of the magazine 51. The extraction monitoring sensor 70 is arranged for each slot S. The extraction monitoring sensor 70 always directly monitors the presence / absence of the wafer pallet 50, not through the extraction history holding unit 56. The storage unit 331 of the control device 33 illustrated in FIG. 2 stores the extraction detection result transmitted from the extraction monitoring sensor 70.

  The chip bonding apparatus according to the present embodiment and the chip bonding apparatus according to the first embodiment have the same functions and effects with respect to parts having the same configuration. According to the chip bonding apparatus of this embodiment, it is not necessary to arrange the extraction history holding unit 56 in the wafer supply apparatus 5. For this reason, the structure of the wafer supply apparatus 5 is simplified. Further, according to the chip bonding apparatus of this embodiment, as shown in FIG. 11, the extraction monitoring sensor 70 does not need to scan the plurality of extraction history holding units 56. The extraction monitoring sensor 70 constantly monitors the presence / absence of the wafer pallet 50. For this reason, the time required to determine whether or not the wafer pallet 50 is extracted can be shortened.

<Others>
The embodiment of the component mounter of the present invention has been described above. However, the embodiment is not particularly limited to the above embodiment. Various modifications and improvements that can be made by those skilled in the art are also possible.

  The holding part moving mechanism 57 is not particularly limited. FIG. 14 is a cross-sectional view of the wafer supply apparatus of the chip bonding apparatus according to another embodiment before the wafer pallet is extracted in the vicinity of the extraction history holding unit. In addition, about the site | part corresponding to FIG. 8, it shows with the same code | symbol.

  As shown in FIG. 14, the holding unit moving mechanism 57 includes a rotating member 571. In the holding portion moving hole 510, a rotation shaft 510a, a non-extraction position stopper 510b, and an extraction position stopper 510c are arranged. The rotation member 571 can rotate in the horizontal direction around the rotation shaft 510a. The non-extraction position stopper 510b holds the rotating member 571 at the non-extraction position P2. On the other hand, the extraction position stopper 510c holds the rotating member 571 at the extraction position P1.

  When the wafer pallet 50 is extracted from the slot S, the wafer pallet 50 drives the inner end 571a of the rotating member 571 in the counterclockwise direction in FIG. For this reason, the outer end 571b of the rotation member 571 rotates from the non-extraction position P2 to the extraction position P1.

  As described above, the holding unit moving mechanism 57 may include the rotating member 571. Further, the holding unit moving mechanism 57 may include a linear movement member 570 and a rotation member 571. Moreover, the holding | maintenance part moving mechanism 57 may be provided with the spring and the gear.

  The type of the extraction monitoring sensor 70 is not particularly limited. For example, a laser sensor, a photoelectric sensor, an ultrasonic sensor, a proximity sensor, a fiber sensor, an image sensor (CCD camera, CMOS (Complementary Metal-Oxide Semiconductor) camera), or the like can be used as the extraction monitoring sensor 70. When an imaging device is used as the extraction monitoring sensor 70, the visual field (detection area) may be set so as to include the extraction position P1 and the non-extraction position P2. In this case, the control device 33 extracts the wafer pallet 50 from the slot S based on the fact that there is the extraction history holding unit 56 at the extraction position P1 and there is no extraction history holding unit 56 at the non-extraction position P2. It can be determined that there was a problem.

  In the above embodiment, as shown in FIG. 3, the extraction monitoring sensor 70 is arranged in the wafer supply device 5. However, the extraction monitoring sensor 70 may be arranged in the apparatus main body 4. In this case, a detection window for detecting the extraction history holding portion 56 (non-extraction position P2, extraction position P1) from the extraction monitoring sensor 70 may be provided on the right wall of the housing 54.

  In the above embodiment, as shown in FIG. 1, the component mounter of the present invention is embodied as a chip bonding apparatus 1. However, the component mounter of the present invention may be embodied as an electronic component mounter (mounter). In this case, the component supply device may be embodied as a tray feeder. The configuration of the tray feeder is the same as that of the wafer supply device 5. Instead of the wafer pallet 50 of the wafer supply device 5, a tray is arranged in the tray feeder. An electronic component to be mounted on the substrate B is placed on the tray.

  In the above embodiment, the extraction history holding unit 56 shown in FIG. 12 is automatically reset. However, it may be performed manually by an operator. Specifically, the operator may return the extraction history holding unit 56 from the extraction position P1 to the non-extraction position P2 by moving the reset bar 581 shown in FIG. 7 to the front side. As described above, when the operator moves the reset bar 581, the extraction history holding unit 56 is not extracted from the extraction position P <b> 1 even if it is impossible to secure the power source for driving the reset bar 581. It can be moved to position P2.

  In the above embodiment, as shown in FIG. 4, the wafer pallet 50 on which the wafer 62 is placed is accommodated in the slot S of the magazine 51 shown in FIG. However, the circular frame with the wafer 62 attached may be accommodated in the slot S of the magazine 51 shown in FIG. That is, a tape may be stretched so as to cover the circular hole of the frame, and the wafer 62 may be attached to the tape. In this case, the frame is included in the concept of the “wafer pallet” of the present invention.

  When the component mounter of the present invention is embodied as an electronic component mounter (mounter), only for a new tray, operations such as the setting of the suction start position P3, the presence / absence of an electronic component, and the confirmation of the component type are performed. Can be executed. For this reason, compared with the case where these operations are performed on all trays, the workload can be reduced.

Claims (5)

A component supply device having a magazine having a tray on which electronic components are mounted, or a slot in which a wafer pallet on which wafers are mounted is removably accommodated;
A mounting machine body to which the component supply device is attached;
A component mounting machine comprising:
Furthermore, an extraction monitoring sensor for monitoring the extraction of the tray or the wafer pallet with respect to the slot,
The mounting machine main body has a control device for determining the extraction history of the tray or the wafer pallet with respect to the slot based on a signal from the extraction monitoring sensor. The component supply apparatus has an extraction history holding unit that displays an extraction history of the tray or the wafer pallet with respect to the slot,
The component mounting machine according to claim 1, wherein the extraction monitoring sensor sets a detection area in which the extraction history holding unit can be detected. The position of the extraction history holding portion when the tray or the wafer pallet is not extracted from the slot is a non-extraction position, and the extraction when the tray or the wafer pallet is extracted from the slot The position of the exit history holding part is the extraction position,
The component supply device moves the extraction history holding unit from the non-extraction position to the extraction position using an extraction load when the tray or the wafer pallet is extracted from the slot, and 3. A holding unit moving mechanism for holding the extraction history holding unit at the extraction position even when the tray or the wafer pallet is inserted again into the slot where the tray or the wafer pallet has been extracted. The component mounting machine described. A plurality of the slots are arranged,
A plurality of the extraction history holding units are arranged corresponding to the plurality of slots,
One extraction monitoring sensor is arranged,
The component supply device has a magazine lifting mechanism capable of lifting the magazine together with a plurality of the extraction history holding units,
The detection area of the extraction monitoring sensor is set at a holding portion passage position through which the plurality of extraction history holding portions pass as the magazine moves up and down. Component mounter. A plurality of the slots are arranged,
The component mounting machine according to claim 1, wherein a plurality of the extraction monitoring sensors are arranged corresponding to the plurality of slots.

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