JP4490364B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that takes out an electronic component from a toilet supplied to a supply stage and mounts the electronic component on a substrate.

  For example, when a semiconductor chip as an electronic component is mounted on a substrate, a so-called flip chip mounting device is used. Usually, the mounting apparatus is composed of substrate transport means for transporting the substrate, component supply means for supplying the semiconductor chip to the supply stage, and mounting means for taking out the semiconductor chip supplied to the supply stage and mounting it on the substrate. Yes.

  In order to supply a semiconductor chip to the supply stage, usually, a wafer ring is supplied to the supply stage. A semiconductor wafer diced into a large number of semiconductor chips is attached to the wafer ring. However, when the number of defective products included in one semiconductor wafer provided in the wafer ring is large, the operating rate of the mounting apparatus is reduced.

  Therefore, by selecting only good semiconductor chips from the diced semiconductor wafer in advance, storing the semiconductor chips in a tray, and supplying the tray to the supply stage, the operating rate of the mounting apparatus is improved. Has been done.

  On the other hand, depending on the use of the substrate, a plurality of types of semiconductor chips are mounted on one substrate. In such a case, a plurality of trays storing different types of semiconductor chips are supplied to the supply stage, and the respective types of semiconductor chips stored and placed in the respective trays are sequentially mounted on the substrate.

  Conventionally, when supplying a plurality of trays containing different types of semiconductor chips to a supply stage, the plurality of trays are placed on a tray carrier, the tray carriers are supplied to the supply stage, and the semiconductor chips taken out from each tray are It has been performed to transfer to a mounting tool and mount on the board.

  By the way, although a plurality of types of semiconductor chips are accommodated and placed in the plurality of trays provided in the tray carrier, the number may differ for each tray. Moreover, the number of semiconductor chips mounted on the substrate may be different for each type.

  Therefore, when it is repeatedly performed that a plurality of types of semiconductor chips are mounted on the substrate, the semiconductor chips housed in the plurality of trays provided in the tray carrier are not lost at the same time, and only the semiconductor chips in a specific tray are lost. That happens. In such a case, since the semiconductor chip is manually replenished to the tray in which the semiconductor chip is exhausted, the burden on the operator is increased and the productivity may be reduced.

  The present invention provides an electronic component mounting apparatus capable of automatically supplying an electronic component to a tray in which the electronic component is empty among a plurality of trays supplied to a supply stage. It is in.

The present invention is a mounting apparatus for mounting electronic components on a substrate,
Substrate transport means for transporting and positioning the substrate;
Component supply means for supplying a tray storing the electronic components to a supply stage;
A mounting means for taking out the electronic component from the tray supplied to the supply stage by the component supply means and mounting the electronic component on the substrate;
The component supply means is
A plurality of tray stackers provided in parallel so that the trays in which different types of electronic components are stored and placed are detachable; and
A plurality of conveyor units arranged side by side in the same direction as the tray stacker on the supply stage , and selectively feeding and conveying the trays of each tray stacker on which different electronic components are stored and mounted to the conveyor unit Tray transport means for collecting and transporting the tray from the conveyor unit that has been emptied to the respective tray stacker;
When the tray of the tray stacker is selectively supplied to the conveyor unit, and when the empty tray is recovered to the tray stacker, the supply stage is driven so that one end of the conveyor unit approaches the tray stacker. When the mounting means takes out the electronic component from the tray and mounts it on the substrate, the supply stage is arranged such that one end of the conveyor unit is separated from the tray stacker and the electronic component on the tray is taken out by the mounting means. Driving means for driving
The electronic component mounting apparatus is characterized by comprising:

  The plurality of tray stackers are preferably provided integrally with the supply stage.

  The tray supplied to the supply stage is picked up by the image pickup means, and the tray transport means stores the empty tray based on the image pickup signal from the image pickup means from the supply stage into the tray stacker, and creates a new one. It is preferable to supply the tray to the supply stage.

  The plurality of tray transfer means are arranged in parallel in the same direction as the substrate transfer direction, and the plurality of trays supplied from each transfer means to the supply stage are along the substrate transfer direction on the supply stage. It is preferable that they are arranged in a line.

According to this invention, with respect to the plurality of tray stackers provided so that the trays can be taken in and out, a plurality of tray conveying means for conveying each tray to the supply stage or carrying it out is provided integrally with the supply stage. Therefore, it is possible to collect only the tray that has been emptied after the electronic components are taken out by the conveying means, and automatically supply a new tray from the tray stocker to the supply stage.

  An embodiment of the present invention will be described below with reference to the drawings.

  1 to 3 show a first embodiment of the present invention. The flip-chip mounting apparatus shown in FIG. The component supply means 1 includes a supply stage 2. The supply stage 2 can be driven in the X, Y, and θ directions by the driving means 3.

  The driving means 3 has a base 5 provided on the upper surface of one end of the apparatus main body 4. An X table 6 is provided on the base 5 so as to be movable along the X direction indicated by an arrow in FIG. The X table 6 is driven in the X direction by an X drive source 6 a provided at one end of the base 5.

  The X table 6 is provided with a Y table 7 movably along the Y direction perpendicular to the X direction. The Y table 7 is driven in the Y direction by a Y drive source 7 a provided at one end of the X table 6.

  The Y table 7 is provided with a θ table 8. The θ table 8 can be driven in the rotational direction by a θ drive source 8 a provided on the Y table 7. The θ stage 8 is provided with the supply stage 2. Thereby, the supply stage 2 is driven in the X, Y, and θ directions.

  As shown in FIGS. 1 and 2, on the supply stage 2, four conveyor units 101 as tray conveying means are arranged in parallel along the Y direction. The conveyor unit 101 has a frame 102 having an L-shaped side surface, and an endless belt 104 is stretched between a pair of rollers 103 provided on the frame 102. One roller 103 is rotationally driven by a drive source (not shown). Accordingly, the belt 104 can be selectively driven endlessly in the forward direction or the reverse direction.

  A tray stacker 105 is provided at one end of each of the four conveyor units 101 so as to face each other. That is, the tray stackers 105 are arranged side by side along the same Y direction as the direction in which the conveyor units 101 are arranged. Each tray stacker 105 accommodates a plurality of trays 106 as shown in FIG. 1, and the trays 106 are supplied to the respective conveyor units 101 as described later.

  As shown in FIG. 1, each tray stacker 105 has a box-shaped outer casing 107 whose front and upper surfaces are open. The outer casing 107 is erected on the upper surface of one end of the base 5, and a movable case 108 is provided inside. The movable case 108 is guided by linear guides 109 provided on the inner surfaces of both sides of the outer casing 107 and is movable in the vertical direction.

  By using the linear guide 109 as a linear motor, the movable case 108 can be driven from the lowered position shown by the solid line in FIG. 1 to the raised position shown by the chain line. Note that the vertical drive of the movable case 108 may be performed using a cylinder or a pulley and a wire without using a linear motor, and the drive means is not specified.

  The movable case 108 has an open front surface, and a plurality of shelves 110 are partitioned in the vertical direction at predetermined intervals. Each shelf 110 accommodates the tray 106 so that it can be inserted and removed from the front opening of the movable case 108. The tray 106 accommodated in the shelf 110 is pushed out by a pusher 111 provided at substantially the same height as the belt 104 of the conveyor unit 101 on the back surface of the outer casing 107.

  When the supply stage 2 is driven in the X direction and one end of the conveyor unit 101 approaches and faces the front surface of the tray stacker 105, the pusher 111 is activated to reach the shelf 110 at the same height as the pusher 111. The placed tray 106 is pushed out onto the belt 104.

  When the tray 106 is supplied onto the belt 104, the belt 104 is driven to travel, and the tray 106 is conveyed to the other end of the conveyor unit 101 along the X direction, that is, the radial center of the supply stage 2 along the X direction. Is done. The tray 106 conveyed by the belt 104 is positioned in contact with a stopper 102 a provided at the end of the frame 102.

  Each tray 106 supplied to the supply stage 2 stores and mounts semiconductor chips as electronic components. As shown in FIG. 2, a plurality of first to fourth semiconductor chips T1 to T4 having different sizes and performances, that is, different types, are accommodated and mounted on the four trays 106, respectively.

  As will be described later, each of the semiconductor chips T1 to T4 housed in each tray 106 is mounted on the substrate 22, and among the four trays 106, for example, the tray 106 on which the first semiconductor chip T1 is placed is empty. Then, the supply stage 2 is driven in the direction of the tray stacker 105 indicated by an arrow in FIG. When one end of the conveyor unit 101 comes close to the supply stage 2, the driving of the supply stage 2 along the X direction is stopped. Next, the belt 104 of the conveyor unit 101 is driven, and the empty tray 106 is stored in the empty shelf 110 of the tray stacker 105.

  When the empty tray 106 is stored in the shelf 110, the movable case 108 is driven in the upward direction by one step. Next, the pusher 111 is activated and the new tray 106 on which the semiconductor chip T1 is placed is moved to the belt 104. Will be supplied on top.

  The first to fourth semiconductor chips T1 to T4 accommodated in the respective trays 106 are taken out by the pickup tool 11 constituting the pickup device. The pickup tool 11 is L-shaped as shown in FIG. 1, and can be driven to rotate in the direction of the arrow within a range of 180 degrees between the position indicated by the chain line and the position indicated by the solid line in FIG. In addition, a suction nozzle 13 for vacuum-sucking the semiconductor chip is provided at the tip. Further, the pickup tool 11 can be driven in the X, Y direction (horizontal direction) and Z direction (vertical direction) by a driving means (not shown).

  A support 15 is provided at the other end of the base 5. On the upper surface of the support 15, a first base 16 is provided horizontally with one end fixed to the support 15 and the other end protruding toward the supply cottage 2. A stage table 17 is provided on the upper surface of the other end of the first base 16.

  The stage table 17 is provided with an X table 18, a Y table 19 provided on the X table 18 and driven in the X direction so as to be in contact with and away from the supply stage 2, and the Y table 19 The mounting stage 20 is driven in the Y direction.

  The X table 18 is provided with an X drive source 18a for driving the Y table 19 in the X direction, and the Y table 19 is provided with a Y drive source 19a for driving the mounting stage 20 in the Y direction. The mounting stage 20 is driven in the Z direction, which is the vertical direction, by the Z drive source 20a. That is, the mounting stage 20 can be driven in the X, Y, and Z directions.

  A conveyance guide 21 is provided above the mounting stage 20. A substrate 22 such as a lead frame on which the first to fourth semiconductor chips T1 to T4 taken out from the tray 106 by the pickup tool 11 as described later are mounted in the transport guide 21 in a predetermined direction. Then, the pitch is fed along the Y direction orthogonal to the X direction. The substrate 22 is positioned at a mounting position where the first to fourth semiconductor chips T1 to T4 are mounted. The substrate transport means 23 is configured by a drive mechanism (not shown) that pitch-feeds the transport guide 21 and the substrate 22.

  The mounting stage 20 includes a heater (not shown). This heater heats the mounting stage 20 to, for example, 300 to 400 ° C. When the heated mounting stage 20 is driven in the upward direction, the upper surface of the mounting stage 20 is transported by the transport guide 21 and supports the lower surface of the substrate 22 positioned at the mounting position. Thereby, the substrate 22 is heated to 300 to 400 ° C. by the mounting stage 20.

  A second base 25 is provided horizontally at one end of the first base 16 with a first spacer fixed via a first spacer 24. The second base 25 is shorter in length than the first base 16, and the other end protrudes toward the supply stage 2 side.

  A camera table 26 is provided on the upper surface of the other end of the second base 25. The camera table 26 has an X table 27. On the X table 27, a Y table 28 driven in the X direction by an X drive source 27a is provided. On this Y table 28, there is provided an attachment member 29 that is driven in the Y direction by a Y drive source 28a.

  The attachment member 29 is provided with a camera unit 31 that constitutes an imaging means. The camera unit 31 includes a first camera 32 that images the substrate 22 that is transported along the transport guide 21 and a first camera 32 that is transferred from the pickup tool 11 to a suction surface 49a of a mounting tool 49 described later. A second camera 33 that images the first to fourth semiconductor chips T1 to T4 is provided. Each camera 32 and 33 is shown in FIG.

  On the other hand, above the supply stage 2, a third camera 34 that images the tray 106 supplied and positioned on the supply stage 2 by the conveyor unit 101 is provided. That is, the presence / absence and position of the first to fourth semiconductor chips T1 to T4 housed in each tray 106 are recognized by the imaging signal of the third camera 34. Each of the cameras 32, 33, 34 is composed of, for example, a CCD (solid state imaging device).

  As shown in FIG. 3, the imaging signals from the cameras 32, 33, and 34 are input to an image processing unit 40 provided in the control device 39, where they are processed and converted into digital signals. . The control device 39 is provided on the support 15 as shown in FIG.

  As shown in FIG. 1, a second spacer 41 is provided on the upper surface of one end of the second base 25. The second spacer 41 is provided with a third base 42 horizontally with one end fixed. A head table 43 is provided on the upper surface of the other end of the third base 42. The head table 43 has an X table 44. On the upper surface of the X table 44, a Y table 45 driven in the X direction by an X drive source 44a is provided. An attachment body 46 that is driven in the Y direction by a Y drive source 45 a is provided on the upper surface of the Y table 45.

  A Z table 47 is provided on the front end surface of the mounting body 46, and the Z table 47 is driven by a Z drive source 47a in a Z direction perpendicular to a plane formed by the X direction and the Y direction. 48 is provided.

  At the tip of the mounting head 48, the mounting tool 49 containing a heater (not shown) having a rectangular cross section is provided by a θ table 50 so that the horizontal rotation angle can be adjusted. That is, the mounting tool 49 can be driven in the X, Y, Z, and θ directions. The mounting tool 49 heats the semiconductor chips T1 to T4 taken out from the tray 106 of the supply stage 2 and sucked and held to about 300 to 400 ° C., for example.

  FIG. 3 is a block diagram of the control circuit. The control device 39 includes a control unit 55, the image processing unit 40, and a drive output unit 57. The control unit 55 is connected to data input means 58 such as a touch panel and a keyboard and a data storage medium 59 such as an HDD. The data input means 58 mounts mounting conditions for mounting the first to fourth semiconductor chips T1 to T4 on the substrate 22 in the controller 55, for example, the first to fourth semiconductor chips T1 to T4. You can enter the position and number.

  The image processing unit 40 captures images from the first camera 32 and the second camera 33 provided in the camera unit 31 and the third camera 34 that images the tray 106 supplied to the supply stage 2. A signal is input. The image processing unit 40 that has captured the imaging signals from the first camera 32, the second camera 33, and the third camera 34 converts the imaging signal into a digital signal and outputs the digital signal to the control unit 55. The imaging signals from the first and second cameras 32 and 33 can be displayed on a monitor 61 connected to the image processing unit 40.

  The control unit 55 performs image processing on the imaging signals of the first and second cameras 32 and 33 converted into digital signals, thereby holding the substrate 22 positioned on the conveyance guide 21 and the mounting tool 49. The center position of any one of the first to fourth semiconductor chips T1 to T4 is calculated, and the mounting tool 49 is driven in the X and Y directions based on the calculation so that the center of the semiconductor chip is the substrate 22. Position at the mounting position that matches the mounting center. Then, the positioned semiconductor chip is mounted on the substrate 22.

  Further, the control unit 55 performs image processing on the image pickup signal of the third camera 34 to detect the presence or absence of the first to fourth semiconductor chips T1 to T4 accommodated in the four trays 106, and the semiconductors in the tray 106 are detected. When there is a chip, the position of each of the semiconductor chips T1 to T4 is recognized, and the pickup tool 11 is positioned above the predetermined semiconductor chips T1 to T4 based on the recognition.

  The drive of the supply stage 21, the pickup tool 11, the mounting stage 20, the substrate transfer means 23, the camera unit 31, the mounting tool 49 and the four conveyor units 101 by the control unit 55 is the drive output connected to the control unit 55. This is performed by a drive signal output from the unit 57.

Next, the operation of the mounting apparatus having the above configuration will be described.
Four trays 106 on which different types of first to fourth semiconductor chips T1 to T4 are placed by the four conveyor units 101 on the supply stage 2 are transported by the belt 104 and positioned against the stopper 102a of the frame 102. Then, these trays 106 are imaged by the third camera 34.

  The image pickup signal of the third camera 34 is subjected to image processing by the control unit 55, whereby it is determined whether or not each tray 106 has the first to fourth semiconductor chips T1 to T4. The positions of the semiconductor chips T1 to T4 are obtained.

  The pick-up tool 11 is positioned based on the image picked up by the third camera 34, and data of different types of first to fourth semiconductor chips T1 to T4 respectively mounted and accommodated on the four trays 106 on the supply stage 2 are recorded. The data are sequentially extracted based on the conditions set by the input means 58.

  The first to fourth semiconductor chips T1 to T4 taken out from the tray 106 by the pickup tool 11 are transferred to the mounting tool 49 and mounted at a predetermined mounting position of the substrate 22 positioned at the mounting position by the mounting tool 49. Is done.

  By repeating such mounting, among the four trays 106, for example, the tray 106 provided with the first semiconductor chip T1 is emptied, which means that the imaging signal of the third imaging camera 34 is transmitted to the control unit 55. Is recognized by image processing, a drive signal for driving the supply stage 2 in the X direction (indicated by an arrow in FIG. 2) approaching the tray stacker 105 is output from the control unit 55 to the drive output unit 57. The

  Thereby, the supply stage 2 is driven in the X direction by the drive signal from the drive output unit 57. Accordingly, one end of each of the four conveyor units 101 provided on the supply stage 2 approaches the front surface of the tray stacker 105 and faces each other.

  Next, a drive signal for driving the first conveyor unit 101 corresponding to the tray stacker 105 containing the tray 106 provided with the first semiconductor chip T1 is output from the control unit 55 to the drive output unit 57.

  As a result, the belt 104 is driven to run in the direction toward the tray stacker 105, and all the first semiconductor chips T <b> 1 are taken out and the tray 106 that is empty is stored in the empty shelf 110 of the tray stacker 105.

  When the empty tray 106 is accommodated in the shelf 110, the movable case 108 of the tray stacker 105 is driven upward by one step, and a new semiconductor chip T1 is placed at the same height as the belt 104. The correct tray 106 is positioned. Next, the pusher 111 is activated to project the tray 106 onto the belt 104. When the tray 106 is transferred to the belt 104, the belt 104 is driven to run in the opposite direction to the previous one. Accordingly, a new tray 106 provided with the first semiconductor chip T1 is positioned on the supply stage 2.

  At the same time as the tray 106 is transferred onto the belt 104, the supply stage 2 is driven in the X direction away from the tray stacker 105, and the pick-up tool 11 can take out the semiconductor chips T1 to T4 from each tray 106. Return to. Even when the second to fourth semiconductor chips T2 to T4 are eliminated, a new tray 106 is supplied to the supply stage 2 and positioned as in the case of the first semiconductor chip T1.

  As described above, when the first to fourth semiconductor chips T1 to T4 of different types are mounted on the substrate 22, the semiconductor chips of the predetermined tray 106 among the plurality of trays 106 supplied and positioned on the supply stage 2 are used. If there is no more, this is recognized by the third camera 34, and based on the recognition, the empty tray 106 can be automatically replaced with a new tray 106 in which semiconductor chips are accommodated.

  Therefore, compared to the case where the operator manually replaces the tray with no semiconductor chips, the burden on the operator can be greatly reduced, and productivity can be improved.

  The plurality of trays 106 supplied to the supply stage 2 are positioned and arranged in a line along the Y direction, which is the same direction as the conveyance direction of the substrate 22, by the conveyor unit 101. That is, the plurality of trays 106 are at the same position with respect to the X direction.

  Therefore, when the pick-up tool 11 takes out the first to fourth semiconductor chips T1 to T4 from the plurality of trays 106, compared to the case where the plurality of trays 106 are not only in the Y direction but also in the X direction. In addition, since the moving distance of the pickup tool 11 in the X direction can be reduced, the tact time required for mounting can be reduced accordingly.

  4A and 4B are plan views of a supply stage 2A showing a second embodiment of the present invention. In this embodiment, not only the first to fourth conveyor units 101 but also the tray stacker 105 are provided integrally with the supply stage 2A. That is, a holding portion 102C for holding the tray stacker 105 is integrally formed on the frame 102B of the conveyor unit 101 provided integrally with the supply stage 2A, and the tray stacker 105 is provided on the holding portion 102C of each frame 102B. Is provided.

  The supply stage 2 is provided directly on the base 5 and cannot move in the X, Y, and θ directions. The pickup unit 11 is moved from the tray 106 positioned by the conveyor unit 101 to the first to fourth. The semiconductor chips T1 to T4 are fixedly arranged at positions where they can be taken out.

  According to such a configuration, since the tray stacker 105 is provided integrally with the supply stage 2A, the semiconductor chip provided in any one of the four trays 106, for example, the first semiconductor chip T1 is eliminated. When this is recognized by the imaging signal of the third camera 34, the first conveyor unit 101 of the first conveyor unit 101 positioned corresponding to the tray stacker 105 in which the tray 106 provided with the first semiconductor chip T1 is accommodated is placed. The belt 104 is driven.

  As a result, the empty tray 106 on which the first semiconductor chip T1 has been mounted is accommodated in the tray stacker 105. Next, the movable case 108 of the tray stacker 105 is raised by one step, the pusher 111 is operated, and a new tray 106 accommodating and mounting the first semiconductor chip T1 is projected onto the belt 104, and then the belt 104 Is moved in the opposite direction to the previous position, and the tray 106 is positioned at a predetermined position.

  Thus, according to this embodiment, when the empty tray 106 is replaced with a new tray 106, the replacement can be performed without moving the supply stage 2. Therefore, not only can the tray 106 be replaced quickly, but also the mounting operation for mounting the second to fourth semiconductor chips T2 to T4 of the other tray 106 on the substrate 22 can be continued at the time of replacement. As a result, the tact time required for mounting can be greatly reduced.

  In each of the above-described embodiments, the semiconductor chip is described as an example of the electronic component. However, the electronic component is not limited to the semiconductor chip, and the present invention is applied to other electronic components such as a chip-shaped capacitor. be able to.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows 1st Embodiment of this invention. The top view which expands and shows the supply stage in which the conveyor unit was provided integrally. The block diagram which shows the apparatus by which a drive is controlled by a control apparatus and this control apparatus. The 2nd Embodiment of this invention is shown, (a) is a top view of the supply stage in which the conveyor unit was provided integrally, (b) is a side view similarly.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Component supply means, 2 ... Supply stage, T1-T4 ... 1st thru | or 4th semiconductor chip (electronic component), 21 ... Conveyance guide, 22 ... Substrate, 23 ... Substrate conveyance means, 34 ... Third camera, 49 ... Mounting tool, 105 ... Tray stacker, 106 ... Tray.

Claims (4)

A mounting device for mounting electronic components on a substrate,
Substrate transport means for transporting and positioning the substrate;
Component supply means for supplying a tray storing the electronic components to a supply stage;
A mounting means for taking out the electronic component from the tray supplied to the supply stage by the component supply means and mounting the electronic component on the substrate;
The component supply means is
A plurality of tray stackers provided in parallel so that the trays in which different types of electronic components are stored and placed are detachable; and
A plurality of conveyor units arranged side by side in the same direction as the tray stacker on the supply stage , and selectively feeding and conveying the trays of each tray stacker on which different electronic components are stored and mounted to the conveyor unit Tray transport means for collecting and transporting the tray from the conveyor unit that has been emptied to the respective tray stacker;
When the tray of the tray stacker is selectively supplied to the conveyor unit, and when the empty tray is recovered to the tray stacker, the supply stage is driven so that one end of the conveyor unit approaches the tray stacker. When the mounting means takes out the electronic component from the tray and mounts it on the substrate, the supply stage is arranged such that one end of the conveyor unit is separated from the tray stacker and the electronic component on the tray is taken out by the mounting means. Driving means for driving
Mounting apparatus of electronic components, characterized in that it is constituted by.   2. The electronic component mounting apparatus according to claim 1, wherein the plurality of tray stackers are provided integrally with the supply stage.   The tray supplied to the supply stage is picked up by the image pickup means, and the tray transport means stores the empty tray based on the image pickup signal from the image pickup means from the supply stage into the tray stacker, and creates a new one. 2. The electronic component mounting apparatus according to claim 1, wherein a tray is supplied to the supply stage.   The plurality of tray transfer means are arranged in parallel in the same direction as the substrate transfer direction, and the plurality of trays supplied from each tray transfer means to the supply stage are along the substrate transfer direction on the supply stage. The electronic component mounting apparatus according to claim 1, wherein the electronic component mounting apparatus is arranged in a line.

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