JPH0774139A - Washing treatment apparatus of semiconductor wafer - Google Patents

Abstract

PURPOSE:To improve the throughput of a washing treatment apparatus which performs the washing treatment of a semiconductor wafer and make the apparatus compact. CONSTITUTION:Stations 32, 33, 34 and 37 on which carriers containing wafers are placed are provided on a placing part 5. An arranging device which aligns the orientation flats of the wafers with each other is provided on a driving mechanism 51 which can move between the respective stations 32, 33, 34 and 37 freely. While the carrier is transferred to a waiting position for the transfer by a transfer device 7, the orientation flats of the wafers in the carrier are aligned with each other. With this constitution, an exclusive orientation-flat alignment device is not necessary and, accordingly, the through-put can be improved and the space occupied by the apparatus can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer cleaning processing apparatus.

[0002]

2. Description of the Related Art A cleaning process in a manufacturing process of a semiconductor device such as an LSI will be described as an example. Conventionally, in order to remove contaminants such as particles, organic contaminants and metal impurities on the surface of a semiconductor wafer, A cleaning processing apparatus is used, and among them, a wet type cleaning processing apparatus is widely used because it can effectively remove particles and can perform batch processing.

In the cleaning processing apparatus, a storage body called a carrier, which stores a predetermined number of semiconductor wafers, for example, 25 semiconductor wafers, is first carried in and placed by a transfer robot to a predetermined mounting position of a mounting section in the loading section. Placed. Thereafter, the carrier is transferred by a transfer device called a wafer lifter to, for example, JP-A-62-24638 or JP-A-6-26638.
The wafer is transferred to an aligning device for performing a so-called orientation flat alignment, which aligns the orientation flats of the semiconductor wafers in the housing in a predetermined direction as disclosed in Japanese Patent Laid-Open No. 2-54449. Then, after the orientation flat alignment is completed, the carrier is transferred by the transfer device to a wafer holding unit which holds the semiconductor wafer in an aligned state.

In this wafer holder, for example, the holder for directly holding the semiconductor wafer in the holding groove is raised, or conversely, the table on which the carrier is placed is lowered to the holder side. By
The peripheral portion of the semiconductor wafer housed in the carrier is held in an aligned state, and the semiconductor wafer is positioned as it is above the carrier so that the semiconductor wafer is in a standby state. After that, the semiconductor wafer in the transfer standby state is transferred to a cleaning processing tank where various cleaning processing is performed by a transfer device having a gripping device called a wafer chuck, and is subjected to a predetermined cleaning processing in the cleaning processing tank. Attached.

[0005]

However, according to such a conventional technique, the carrier is loaded, placed, transferred to the alignment device, aligned with the orientation flat, transferred to the wafer holding unit, before being transferred by the wafer chuck. It is difficult to realize high throughput because an operation procedure of raising the holder or lowering the table has to be performed. Recently, the size of semiconductor wafers has increased and the number of cleaning processes has increased. As a result, the size of the entire cleaning processing equipment has tended to increase. Therefore, it is required to make various equipment as compact as possible. According to the above-mentioned conventional technique, it is necessary to install, before the cleaning processing tank, dedicated apparatus and devices for performing three different operations, that is, the placing section, the aligning apparatus for aligning the orientation flat, and the wafer holding section. However, the space is required accordingly, which is also not preferable.

The present invention has been made in view of such a problem, and provides a semiconductor wafer cleaning processing apparatus capable of efficiently performing the above-mentioned necessary operations in a stage before the transfer by the wafer chuck of the transfer apparatus without waste. In addition, it is intended to realize high throughput and downsizing of the apparatus.

[0007]

To achieve the above object, according to a first aspect of the present invention, a cleaning treatment tank for accommodating and cleaning semiconductor wafers and a container for accommodating a plurality of the semiconductor wafers are mounted. Mounting part, a holding part for aligning and holding the semiconductor wafer, a transfer device for transferring the container between the mounting part and the holding part, and cleaning the semiconductor wafer of the holding part. In a semiconductor wafer cleaning processing apparatus having a transfer device for transferring to a processing tank, a plurality of mounting positions of the storage bodies are linearly arranged in the mounting part, and the mounting position is set to the mounting position. Alignment for holding the container and providing a moving mechanism for moving and mounting the held container between the respective mounting positions, and further for aligning an orientation flat of the semiconductor wafer in the held container in a predetermined direction The device Characterized by providing a serial moving mechanism, the cleaning apparatus of the semiconductor wafer is provided.

Further, according to claim 2, in order to realize a higher throughput, the above-mentioned placement positions are arranged in parallel in two rows, and the moving mechanism is further extended between the placement positions in these two rows. Provided is a semiconductor wafer cleaning processing apparatus characterized by being configured so as to be movable.

[0009]

According to the first aspect of the present invention, for example, when the container containing the semiconductor wafer is placed at the placement position by the transfer robot, the semiconductor wafer in the container is aligned by the aligning device provided in the moving mechanism. While moving, the storage body is moved to another mounting position by the moving mechanism,
Can be placed. Therefore, after that, it is only necessary to directly transfer the storage bodies to the holding unit by the transfer device, and the process of transferring to the aligning device and the transfer to the holding unit which are separately provided conventionally is omitted.

Since the plurality of mounting portion positions are arranged, it is possible to successively carry in and place other storage bodies in the vacant mounting positions. As described above, the semiconductor wafers are aligned with each other one after another, so that it is possible to transfer the semiconductor wafer to the transfer standby state extremely efficiently.

According to a second aspect, the above-mentioned placement position is 2
Since the moving mechanism is arranged in parallel with each other and the moving mechanism is configured to be movable even between the mounting positions of these two rows, for example, when the storage body is carried in and mounted on the mounting position by a transfer robot. Even if two of these are loaded and placed in parallel, it is possible to align the two containers in series while aligning the orientation flat by the moving mechanism, and the placement positions are in two rows. As a result, it is possible to carry in and mount a larger number of storage bodies than in the first aspect.

Further, when collecting the empty container after the semiconductor wafer is transferred by the transfer device, one of the two mounting positions is in the transfer standby state after the orientation flat alignment is completed. While being used for the body, the other row can be used as a carry-out waiting place for the empty storage bodies to be carried out. Therefore, it is possible to construct an extremely efficient system as a whole.

[0013]

Embodiments of the present invention will now be described with reference to the accompanying drawings. This embodiment is an example applied to a semiconductor wafer (hereinafter referred to as "wafer") cleaning processing apparatus. Explaining the entire apparatus, the entire cleaning processing apparatus 1 includes, as shown in FIG. 1, a carry-in section 2 for accommodating wafers before cleaning processing in carrier units, and a cleaning processing section 3 for performing cleaning processing on the wafers. Of the carry-out section 4 for taking out the wafer after the cleaning process in carrier units,
It is composed of three zones.

A carrier C containing a predetermined number of uncleaned wafers, for example 25, is carried into the carry-in section 2.
A mounting unit 5 for mounting and a transfer device 7 for transferring the mounted carrier C to the holding device 6 are provided. Further, in the cleaning processing section 3, three wafer transfer devices 11, 12, 13 are arranged on the front side (front side in FIG. 1), and these wafer transfer devices 11, 12, 13 are arranged.
Are provided with corresponding wafer chucks 14, 15, and 16, respectively. Further, also in the carry-out section 4, a placing section 8 having substantially the same configuration as the placing section 5, a holding device (not shown) having the same configuration as the holding device 6, and the transfer device 7 are provided.
And a transfer device (not shown) having the same structure as the above.

In the cleaning processing unit 3, the wafer chuck 14 of the wafer transfer device 11 is sequentially installed from the mounting unit 5 side.
Chuck cleaning / drying processing tank 21 for cleaning and drying the wafer, chemical liquid cleaning processing tank 2 for cleaning impurities such as organic contaminants, metal impurities and particles on the wafer surface with a chemical liquid
2. Two water cleaning treatment tanks 23 for cleaning the wafers cleaned in the chemical cleaning processing tank 22 with pure water, for example
4, a chemical cleaning treatment tank 25 for cleaning with a chemical different from the chemical in the chemical cleaning treatment tank 22, and two washing cleaning treatment tanks 26 for cleaning the wafer cleaned in the chemical cleaning treatment tank 25 with, for example, pure water. , 27, a chuck cleaning / drying treatment tank 28 for cleaning and drying the wafer chuck 16 of the wafer transfer device 13, and a drying process for vapor-drying the wafer from which the impurities have been removed by, for example, IPA (isopropyl alcohol). The processing tanks 29 are provided respectively.

The chemical cleaning treatment tanks 22 and 25 are
Each cleaning treatment liquid overflows and circulates, and during this circulation, impurities accumulated in each cleaning treatment liquid are removed.

The loading / unloading section 5 is configured as follows. That is, as shown in FIGS. 2 and 3, a hollow mounting table 31
Stations 32, 33, and 34, which are formed by openings in the lower surface of the carrier C, are formed on the upper surface of the station.
The stations 3 are provided in a line from the front side in order.
Passing portions 35 and 36 each having an opening narrower than the width of the stations 32, 33 and 34 are provided between the stations 2 and 33 and between the stations 33 and 34, respectively.

Furthermore, on the upper surface of the mounting table 31, other stations 37, 38, 39 and passage sections 40, 41 having the same structure as these stations 32, 33, 34 and the like are provided.
Is provided between the stations 32 and 37 on the front surface side in each of the two rows of stations, and a connection passage portion 42 configured by an opening is provided.

Then, each of the stations 32, 33, 3
Locking members 43, which are substantially L-shaped in plan view, are provided at four locations near the corners 4, 37, 38, 39, respectively, to lock the upper edge corners of the carrier C.

On the other hand, a moving mechanism 51 as shown in FIGS. 4 and 5 is provided inside the mounting table 31. Clamp members 54, 55, 56, 57 provided via actuators 53 are provided on the four sides of a rectangular base 52 at the center of the moving mechanism 51, respectively. The clamp members 54 and 56 have the same structure, and have a substantially flat plate shape having step portions 54a and 56a on the upper surface thereof. In addition, the remaining clamp members 55,
57 also have the same structure as each other, and have a substantially U-shape as a whole. By the operation of the actuator 53, each of the clamp members 54, 55, 56,
57 are configured so that they can approach and separate from each side of the base 52, respectively. At the center of the upper surface of the base 52, a roller 60 rotatable by a motor 58 and a timing belt 59 is provided on an up-and-down moving device 61, which constitutes an alignment device for aligning the wafer W. It

The base 52 itself has an elevating mechanism 62.
It is freely movable in the vertical direction (Z direction) by means of the lifting mechanism 62 itself.
A moving base 63 that can move in the continuous direction (Y direction)
It is provided above.

Since the moving mechanism 51 is constructed as described above, the lifting mechanism 62 raises the entire substrate 52 upward from the upper surface of each of the clamp members 54, 55, 56 and 57 mounting table 31, and in that state. The moving base 63 can be appropriately moved with. Therefore, this moving mechanism 51
Are the stations 32, 33, 34, 37, 3
It can be moved and stopped at any position of 8, 39.

As shown in FIG. 2, the transfer device 7 arranged at the rear of the mounting portion 5 has a pair of arms 71 and 72 which can be moved toward and away from each other, and the arms 71 and 72.
Of the lifter 73 for horizontally supporting the above, a Z base 74 for moving the lifter 73 in the vertical direction (Z direction), and the Z base 74 itself moves in the longitudinal direction (X direction) of the aforementioned cleaning processing apparatus. 2 and an X base 75 for holding the carrier C between the arms 71 and 72 while the upper side edges of the carrier C are placed on the arms 71 and 72. Then, it can be transferred to the holding device 6 described above.

The holding device 6 is, as shown in FIG.
A holding portion 83 fixed on the top plate 82 via the pillars 81,
And the movable column 8 that is movable in the Y direction with respect to the top plate 82.
The holding portions 85 supported by 4 are connected to each other in the Y direction. Each of the holding portions 83 and 85 has a form that can pass through the lower opening of the carrier C, and the holding grooves into which the peripheral edge portions of the wafer W are inserted on the upper surfaces of the holding portions 83 and 85, respectively. 86 are formed in a predetermined number, for example, 25 each. Then, the support column 81 and the moving column 8
On the top plate 82 in the vicinity of each base of No. 4, four locking members 87 for locking the corners of the lower end of the carrier C are provided.
It is provided in various places.

The wafer W held by the holding portions 83 and 85 is collectively gripped, and the wafer W is transferred to the chemical solution cleaning processing tank 22 described above.
Are configured as shown in FIGS. That is,
The wafer transfer device 12 includes, for example, the above-mentioned wafer chuck 14 configured by a pair of left and right gripping members 91 and 92 that collectively grips 50 wafers, and a support body 94 that supports the wafer chuck 14. A drive mechanism 95 that moves the support 94 up and down (Z direction) and also moves it in the front and rear direction (Y direction), and this drive mechanism 95.
And a transfer base 96 for moving the cleaning processing unit 3 along the longitudinal direction (X direction) of the cleaning processing unit 3.

The gripping members 91, 92 of the wafer chuck 14 are bilaterally symmetrical, and their rotating shafts 9 are respectively provided.
Numerals 7 and 98 are rotatably supported by the support member 94, so that they can be opened and closed.

With respect to the structure of the grip member 91,
The upper ends of stays 99 and 100 made of aluminum are fixed to the rotating shaft 97, and the upper ends of supports 101 and 102 made of quartz are bolts 103 to the lower ends of the stays 99 and 100, respectively. It is fixed detachably by. Further, between the lower ends of the supports 101 and 102, quartz-made gripping rods 104 and 105 are arranged in parallel in two steps in the upper and lower directions. For example, 50 gripping grooves 106 into which the peripheral edge of the wafer W is inserted are formed on the surfaces of the gripping bars 104 and 105. The stays 99 and 100 are each bent downward by the first bent portion 99a on the upper side, and further bent downward by the second bent portion 99b on the lower side. .

The structure of the gripping member 92 is basically the same as that of the gripping member 91, and the stays 99 'and 100' and the supports 101 'and 102' are respectively the stays 99, 100 and. The support 101,
102 is different from each other only in that they are symmetrically bent or curved. Therefore, each of these gripping members 91, 92
Is stay 99, stay 99 ', and stay 100
And the stay 100 'are configured to intersect each other at substantially the center.

The cleaning processing apparatus 1 to which this embodiment is applied is configured as described above. Next, its operation will be described. First, the carriers C ₁ and C ₂ each containing 25 unprocessed wafers W are stored. By a transfer robot (not shown)
As shown in FIGS. 1 and 7, the stations 32 and 37 in the mounting section 5 are mounted at predetermined positions, that is, at positions where the upper corners thereof are respectively locked by the locking members 43 near the station 32. At this time, the moving mechanism 51 is positioned at the station 32 as shown in FIG.

Then, first, each actuator 53 in the moving mechanism 51 is operated, and as shown in FIG.
The carrier C ₁ is clamped by each clamp member 54, 55, 56, 57. After that, the carrier C ₁ is lifted up from the upper surface of the mounting table 31 by the above-mentioned lifting mechanism 62 in the moving mechanism 51, and this carrier C ₁ is moved to above the station 34 in this state, and then the above-mentioned. The carrier C ₁ is lowered by the elevating mechanism 62 and placed at a predetermined position, that is, a position where the upper corners of the carrier C ₁ are locked by the locking members 43 near the station 34, respectively.

During the movement of the carrier C _{1 from} the station 32 to the station 34, the orienting flat of the wafer W stored in the carrier C ₁ is performed in the moving mechanism 51. In this orientation flat alignment, as shown in FIG. 5, the roller 60 is rotated slightly while being in contact with the peripheral edge of the lower end of the wafer W to align the orientation flat Wf of each wafer W downward. Then, when the orientation flat portion Wf of each wafer W is aligned on the lower side, the roller 60 is raised by the vertical movement device 61 to make contact with the orientation flat portion Wf of each wafer W, and then the orientation flat portion Wf of each wafer W is placed on the upper side. The roller 60 is rotated until it is aligned. By this operation, the orientation flat portion Wf of each wafer W is aligned to the upper side, and the orientation flat alignment is completed.

While aligning the orientation flats of the wafers W in the carrier C ₁ in this manner, the carrier C
_{When 1} is moved to the station 34, the moving mechanism 51 is moved to the station 37, and the carrier C ₁ is moved.
The carrier C ₂ located at the station 37 is moved to the station 33 in the same manner as in the above case.

After that, the arms 71 and 72 of the above-mentioned transfer device 7
These carriers C ₁ and C ₂ are simultaneously clamped by the above, and as shown in FIG. 9, these carriers C ₁ and C ₂ are transferred above the holding portions 83 and 85 of the holding device 6 described above. Then, the arms 71 and 72 are lowered as they are, and the lower ends of the carriers C ₁ and C ₂ are placed at a predetermined position of the top plate 82, that is, a position where the corners of the lower ends are locked by the locking member 87. Then, as shown in FIG. 10, the wafers W stored in the carriers C ₁ and C ₂ are held by the holding portions 83 and 8 respectively.
5, each wafer W is held in each holding portion 83, 85 so that each wafer W is pulled out from each carrier C ₁ , C ₂ by each holding portion 83, 85.

Then, this time, the moving column 84 of the holding portion 85 approaches the support column 81 side, and the holding portions 83, 85 are moved to a state where they are continuously connected in the Y direction, that is, so-called one-sided movement. , The wafers W stored in the carriers C ₁ and C ₂
Will be in an aligned state of 50 consecutive sheets.

After that, the wafer transfer device 11 is held by the holding device 6.
The wafer chuck 14
Thus, the 50 wafers W are gripped, transported to a cleaning processing tank, and the wafer W is subjected to a predetermined cleaning processing.

On the other hand, in the mounting section 5, since the above-mentioned carriers C ₁ and C ₂ are moved to the stations 34 and 33, respectively, the stations 32 and 37 are vacant. The next carriers C ₃ and C ₄ are placed on these stations 32 and 37 by the transfer robot. And like the case of each carrier C ₁ and C _{2 described} above,
While the orientation flats of the wafers W stored in the carriers C ₃ and C ₄ are aligned, the carriers C ₃ and C ₄ are sequentially moved to the stations 34 and 33 by the moving mechanism 51.

In the meantime, the empty carriers C ₁ and C ₂ described above are returned by the transfer device 7 to the stations 39 and 38 of the mounting portion 5, respectively, as shown in FIG.
After that, the carriers C ₁ and C ₂ are moved to the stations 32 and 37 by the moving mechanism 51, respectively, and are unloaded from the stations 32 and 37 by the above-mentioned transfer robot. The carried out carriers C ₁ and C ₂ are placed at predetermined positions on the placing unit 8 of the front unloading unit 4 of the cleaning processing apparatus 1,
By a transfer device (not shown) in the carry-out section 4, the wafer W is transferred to a predetermined holding section, and the wafer W after the cleaning process is transferred into the carriers C ₁ and C ₂ through an operation opposite to the operation in the holding apparatus 6. And then these carriers C ₁ ,
C ₂ is returned to a predetermined position on the placing section 8 and is carried out by the transfer robot.

As can be seen from the series of operations described above, according to this embodiment, from the loading of an unprocessed carrier to
Alignment of wafer W, holding unit 8 by transfer device 7
The transfer to the cleaning tanks 3 and 85 and the transfer to the cleaning tank by the wafer transfer device are performed very efficiently.

Moreover, since the orientation flat alignment of the wafer W is performed during the movement of the transfer mechanism 7 by the drive mechanism 51 to the transfer standby position, there is very little waste and the processing speed is improved.

Further, since the aligning device for aligning the orientation flat, which has been separately provided in the conventional cleaning processing device of this type, does not need to be provided between the placing part 5 and the holding device 6, the space is increased accordingly. Can be saved, and the cleaning processing apparatus 1 as a whole can be made compact.

Further, as described above, the recovery of the empty carrier is also performed efficiently, so that the throughput of the cleaning processing apparatus 1 as a whole is extremely high.

By the way, in the wafer chuck 14 used in the cleaning processing apparatus 1, the stays 99 and 100 and a portion of the support 101 and below which is immersed in the cleaning processing liquid such as a chemical liquid are separate bodies. 101 and 102 can be separated from the stays 99 and 100, respectively. Therefore, the support 101 itself or the supports 101, 1
If the gripping rods 104 and 105 provided between the two are damaged or damaged, they can be easily replaced. Further, since the amount of quartz used is reduced, it is possible to keep the cost of the entire wafer chuck 14 low.

Further, in the conventional wafer chuck, all the members are made of quartz, but the weight of the entire wafer chuck 14 can be reduced by making the stay 99 part made of aluminum as described above. It is easy to handle, and the load on the drive mechanism that operates each part of the wafer chuck 14 is reduced.

Moreover, as shown in FIG. 12, the stays 99, 99 ', 100, 1 of the gripping members 91, 92, respectively.
00 ′ intersects with each other in the middle, so that the gripping rods 104, 104 ′ for directly gripping the wafer W, and the gripping rod 10
5, 105 ′ and the rotating shafts 97, 98 thereof are located on the opposite sides, and the rotation torque required for gripping the wafer W by the closed legs of the wafer chuck 14 is smaller than that of the conventional one. There is.

That is, as shown in FIG. 13, when the force necessary to grip the wafer W at the point A (reaction force of the force corresponding to F ₀ ) is applied by the rotation of the gripping member B, it is conventional. As shown in the figure, the rotation center C of the gripping member B is the point A
It was located just above. Therefore, in order to obtain the force, the rotating torque indicated by F ₁ was required.

In that point, according to the wafer W chuck 14 constructed as described above, as shown in FIG. 14, the force (F ₀ required to hold the wafer W at the point A (holding bar 104) is obtained.
Can be obtained by the rotational torque F ₂ generated by the rotation of the gripping member 92. 13 and 1
Comparing _No. 4 with each other, it is clear that F ₂ <F ₁ , so that the rotational torque required for gripping the wafer W by the closed leg of the wafer chuck 14 may be smaller than the conventional one. Therefore, for example, when the driving mechanisms for rotating the gripping members B and 92 are the same, the wafer chuck wafer 14 adopted in the cleaning processing apparatus 1 is used.
It can be understood that the wafer W can be gripped more strongly by.

Furthermore, the gripping members 91 and 92 are so arranged.
Since the rotating shafts of 1 are located on the opposite sides of each other, the open leg space (so-called open dimension) required for releasing the held wafer W can be smaller than that of the conventional one. Therefore, the size of the cleaning processing tank for cleaning the held wafer W can be reduced accordingly.

Further, in particular, in order to reduce such an opening size, for example, as shown in FIG.
11 can be used. That is, this wafer chuck 1
11, the center of rotation of the gripping members 114, 115 having the gripping bars 112, 113 located on the upper side is located almost directly above the gripping bars 112, 113, but the gripping bars 116, 117 on the lower side are located. With regard to the above, these are provided in gripping members 118 and 119 different from the gripping members 114 and 115, and the gripping members 118 and 119 are bent in the middle,
The rotation center is provided inside the gripping members 114 and 115.

According to the wafer chuck 111 having such a structure, the opening dimension required for the length indicated by L ₁ in FIG. 15 in the related art can be reduced to the length indicated by L ₂ . Therefore,
The wafer W can be released with a smaller opening size than the conventional one, and the size of the cleaning processing tank can be reduced accordingly.

When the gripping members 114, 115 and the gripping members 118, 119 of the wafer chuck 111 are simultaneously rotated, two rotary drive mechanisms are not necessarily required, and an appropriate link member 121 as shown in FIG. , 12
If the gripping member 114 and the gripping member 118 and the gripping member 115 and the gripping member 119 are linked using 2, 123 and 124, it is possible to rotate them simultaneously by the single actuator 125.

Although the above embodiment is an example applied to a wafer cleaning apparatus, the present invention is not limited to this.
The present invention can be applied to other semiconductor processing apparatuses that require orientation flat alignment on the way.

[0052]

According to the first aspect of the present invention, since the container can be directly transferred from the placing section to the holding section, the throughput is improved. Moreover, since the aligning device for aligning the semiconductor wafer orientation is provided in the moving mechanism of the mounting part, it is not necessary to separately provide a dedicated space for the aligning device as in the conventional case, and the entire cleaning processing device can be made compact accordingly. It is possible to

According to the second aspect, it is possible to carry in and place a larger number of storage bodies than those in the first aspect, and also to transfer to the holding portion and carry out empty storage bodies. Since it can be carried out extremely efficiently, it is possible to realize a higher throughput than that of claim 1.

[Brief description of drawings]

FIG. 1 is a perspective view of a wafer cleaning processing apparatus in which an embodiment of the present invention is preferably used.

FIG. 2 is a perspective view around a mounting portion to which the embodiment is applied.

FIG. 3 is a plan view of a mounting portion to which the embodiment is applied.

FIG. 4 is a perspective view of a moving mechanism in the embodiment.

FIG. 5 is a cross-sectional explanatory view of a moving mechanism in the example.

FIG. 6 is a perspective view of a wafer chuck according to an embodiment.

FIG. 7 is an explanatory plan view of a mounting portion for showing the operation of the embodiment.

FIG. 8 is an explanatory plan view of a moving mechanism for showing the operation of the embodiment.

FIG. 9 is an explanatory diagram of a holding unit for showing the operation of the embodiment.

FIG. 10 is an explanatory diagram of the holding unit for showing a state where the wafer is held by the holding unit during the operation of the embodiment.

FIG. 11 is an explanatory plan view of a mounting portion for showing the operation of the embodiment.

12 is an explanatory view schematically showing the wafer chuck of FIG.

FIG. 13 is an explanatory diagram showing the operation of the conventional wafer chuck.

FIG. 14 is an explanatory view showing the operation of the wafer chuck of FIG.

FIG. 15 is an explanatory diagram showing another example of a wafer chuck having a small opening size.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cleaning processing apparatus 5 Mounting part 6 Holding device 7 Transfer device 12 Wafer transfer device 14 Wafer chuck 31 Mounting table 32, 33, 34, 35, 36, 37 Station 43 Locking member 51 Moving mechanism 53 Actuator 54, 55, 56 , 57 Clamping member 60 Roller 61 Vertical movement device 62 Elevating mechanism 63 Moving base 71, 72 Arm 73 Lifter 83, 85 Holding part 86 Holding groove 91, 92 Gripping member C Carrier W Wafer Wf Orient flat part

Claims (2)

[Claims] 1. A cleaning processing tank for housing and cleaning semiconductor wafers, a mounting part on which a container containing a plurality of semiconductor wafers is mounted, and a holding part for aligning and holding the semiconductor wafers. A semiconductor wafer cleaning processing apparatus comprising: a transfer device that transfers the container between the placing part and the holding part; and a transfer device that transfers the semiconductor wafer of the holding part to the cleaning processing tank. A plurality of mounting positions of the storage bodies are linearly arranged in the mounting portion, and hold the storage bodies mounted at the mounting position.
Further, a moving mechanism for moving and placing the held container between the respective mounting positions is provided, and the aligning device for aligning the orientation flat of the semiconductor wafer in the held container in a predetermined direction is provided with the moving mechanism. An apparatus for cleaning a semiconductor wafer, the cleaning processing apparatus comprising: 2. The mounting positions are arranged in parallel in two rows, and the moving mechanism is configured to be movable even between the mounting positions in these two rows. Semiconductor wafer cleaning processing equipment.