TWI424171B - Electronic component testing classifier - Google Patents

Description

Electronic component test sorter

The invention provides an electronic component test sorting machine which can easily discharge water drops when an abnormal situation occurs, and reduce the space occupied by the test device occupying the table top to improve the test quality and reduce the volume of the device.

Nowadays, electronic components are applied to different electronic devices. Since the environment in which the electronic devices are located may be a normal temperature environment, a high temperature environment or a low temperature environment, the manufacturer must ensure the quality of the electronic components after the electronic components are manufactured. Depending on the ambient temperature of the application, the electronic components are transferred to a normal temperature tester or a cold test machine or a thermal test machine to perform a normal temperature test operation or a cold test operation or a thermal test operation in different operating temperature environments, thereby eliminating the Good product.

Please refer to FIG. 1 , which is a schematic diagram of an electronic component cold measuring machine, which is provided with a feeding device 12 , a receiving device 13 , a testing device 14 , a pre-cooling plate 15 and a conveying device 16 on the machine table 11 . The material device 12 is configured to accommodate a plurality of electronic components 17 to be tested, and the receiving device 13 is configured to accommodate a plurality of electronic components 17 to be tested. The testing device 14 is provided with a cold measuring chamber 141 having a low temperature working environment and is cold. A test circuit board 142 having a horizontal test panel 143 is disposed on the machine 11 inside the measuring chamber 141 for testing the electronic component 17, and a lower pressing fixture 144 is disposed on the side of the test socket 143. The following electronic component 17 is used for pre-cooling the electronic component 17 to be tested. The conveying device 16 is provided with at least one pick-and-placer 161 for feeding the device 12, the receiving device 13, and testing. The electronic component to be tested/tested is transported between the device 14 and the pre-cooling disk 15; when performing the cold-testing operation, the pick-and-place device 161 of the conveying device 16 takes out the electronic component 17 to be tested at the feeding device 12, and moves it first. Placed in the pre-cooling tray 15, which is about to be tested electronic component 17 After cooling to the required test temperature (for example, -20 ° C), after the electronic component 17 to be tested is pre-cooled, the pick-and-place device 161 of the transport device 16 transfers the electronic component 17 to be tested to the cold test chamber 141, and juxtaposes The test fixture 143 is placed on the test fixture 143, and the electronic component 17 to be tested is pressed to perform the cold test operation. After the cold test is completed, the pick-up unit 161 of the transport device 16 transfers the electronic component 17 to be tested. When the electronic component 17 performs the test operation in the cold test chamber 141 of the low temperature working environment, the electronic component 17 itself is likely to cause an electronic component when the test program is abnormally executed in a low temperature environment. The surface of the 17 is condensed with water droplets, but the test socket 143 of the testing device 14 is horizontally disposed on the machine table 11, so that the water drops on the electronic component 17 remain in the test socket 143, which not only affects the test yield but also reduces the test circuit board. 142 and the service life of the test socket 143; further, the test device 14 is provided with a plurality of test sockets 143 on the test circuit board 142, so that the test circuit board 142 has a larger area, and when the test circuit board 142 is horizontally disposed on the machine When it is on the 11th, it will be quite occupied. 11 sets of bench space, and can not effectively reduce the size of the device, resulting in lack of space.

Therefore, how to provide an electronic component test sorting machine that can improve the test yield and reduce the size is the standard developed by the industry.

An object of the present invention is to provide an electronic component testing and sorting machine, which is provided with a feeding device, a receiving device, a testing device and a conveying device, and the feeding device accommodates at least one electronic component to be tested. The receiving device is configured to receive at least one completed electronic component, the testing device is provided with at least one test zone capable of performing different temperature tests, and a test circuit board having at least one test socket is disposed in the test zone, and the test is performed The insertion opening of the seat is not facing upward for testing the electronic component, and the conveying device is provided with a carrier mechanism having at least one carrier for carrying the electronic component between the supply and receiving device and the testing device, and is provided with a transfer mechanism having at least one pick-and-place device for transferring electronic components between the supply and receiving device and the stage, and a transfer mechanism having at least one pick-and-place device for reloading between the stage and the test stand Electronic components; thereby, it is possible to use the test socket with the insertion port not facing upwards, and it is easy to discharge the water drops when the abnormal situation occurs, and increase the service life of the test circuit board and the test socket, thereby improving the test quality and saving. The practical benefits of this.

A second object of the present invention is to provide an electronic component test sorting machine, which is provided with a test circuit board having at least one test socket in a test area, and the test socket is not directed upward, for testing electronic components. The utility model can reduce the occupation space occupied by the machine table and achieve the practical benefit of reducing the volume of the device.

The third object of the present invention is to provide an electronic component test sorting machine, which is provided with a test room on a machine table, and has a first temperature control with a temperature controller on one side of the test area. Zone, and visible thermal/cold measurement operation, so that the first temperature control zone forms a preheating zone or precooling zone for preheating/precooling the electronic components to be tested to shorten the heating/cooling of the electronic components Time, in order to facilitate rapid testing, to achieve practical benefits of improved performance.

A fourth object of the present invention is to provide an electronic component test sorting machine, wherein the test device is provided with a second temperature control zone of a thermostat on the other side of the test area, and the second temperature control zone forms a temperature The area is such that the electronic component after the cold measurement is returned to the normal temperature in the temperature recovery zone, and the surface of the electronic component is prevented from condensing water droplets, thereby achieving the practical benefit of improving the use efficiency.

A fifth object of the present invention is to provide an electronic component test sorting machine, which is provided with an indexing mechanism of at least one angular position of the convertible electronic component as needed, and the indexing mechanism can be independently assembled on the machine platform. It can also be assembled on the material transfer mechanism or the transfer mechanism, and then the indexing mechanism can be used to change the angular direction of the electronic component to be tested to conform to the angular orientation of the test socket, and after the test is completed, the electronic component can be converted. In the direction of the corner position, it can be placed in the receiving device to achieve the practical benefit of improving the performance.

In order to make the reviewer further understand the present invention, a preferred embodiment and a drawing will be described in detail as follows: Please refer to Figures 3 and 4, the electronic component test sorting machine of the present invention is attached to the machine 20 At least one feeding device, receiving device, testing device and conveying device are disposed on the machine 20, and in the embodiment, the feeding device 30, the receiving device 40, the open device 50, and the testing device are disposed on the machine table 20. The feeding device 30 is configured to receive at least one electronic component to be tested. In the embodiment, the feeding device 30 is provided with at least one of the first axial displacements (ie, Y). The axial displacement of the tray 31 is for holding a plurality of electronic components to be tested; the receiving device 40 is for accommodating at least one electronic component to be tested. In the embodiment, the receiving device 40 is provided. There is at least one first axial displacement tray 41 for holding a plurality of completed electronic components; the hollow device 50 is for receiving the empty tray 31 of the feeding device 30, and the empty material is The tray 31 is supplemented to the receiving device 40 for holding the electronic components that have been tested; the testing device 60 is provided There is at least one test area, and a test circuit board having at least one test socket is disposed in the test area, and the insertion port of the test socket is not facing upward for testing the electronic component. In the embodiment, the test device 60 is A working chamber 61 having at least one test area 62 is disposed on the machine 20, and a temperature controller 621 is disposed in the test area 62, and the test area 62 is converted into a normal temperature working environment and high temperature as required for visual testing operations. The working environment or the low-temperature working environment and the like, the electronic component is subjected to the test operation in a working environment of different temperatures, and the through hole 622 is defined in the sidewall of the test area 62, and at least one side is disposed on one side of the through hole 622. The test socket 64 is vertically disposed on the test circuit board 63 such that the insertion opening of the test socket 64 faces the side for inserting the electronic component to be tested, and transmits the test result to the central control unit by a tester (not shown) ( The figure is not shown), the central control unit controls the operation of each device, and the first temperature control area 65 of the temperature controller 651 is disposed on the test area 62 side of the working room 61, and the thermal measurement/cold measurement operation is visible. Required to form the first temperature control zone 65 a preheating zone or a pre-cooling zone for preheating/precooling the electronic component to be tested, and the other side of the test zone 62 is provided with a second temperature control zone 66 of the thermostat 661, and the second temperature is The control area 66 forms a temperature return zone for the electronic component to be tested to return to normal temperature; the transport device 70 is provided with a carrier mechanism 71 having at least one carrier 711 for the supply and receiving device 30, 40 and the test device 60 carry electronic components, and is provided with a transfer mechanism 72 having at least one pick-up device for transferring electronic components between the supply and receiving devices 30, 40 and the carrier 711, and When there is at least one pick-and-place device 73, when the pick-and-place device is placed in a horizontal state, the electronic component can be taken and placed on the stage 711, and when the angle of the insertion port of the corresponding test socket 64 is rotated and placed, The electronic component to be tested can be inserted into the test socket 64 for testing. In this embodiment, the carrier mechanism 71 can configure the displacement path of the carrier 711 as needed, for example, the carrier 711 can be directly displaced to the test zone. 62, or the stage 711 is displaced to the first temperature control zone 65 and the test zone 62, or the carrier 711 is displaced to the first temperature control zone 65, The area 62 and the second temperature control area 66 are provided with a carrier mechanism 71 of a plurality of stages 711 in the embodiment, and the stages 711 are in the material transfer mechanism 72, the test area 62, and the first The two temperature control zones 65, 66 cyclic displacement, used to carry the electronic components to be tested / completed, and the transfer mechanism 72 is provided with two for the second and third axial displacement (ie, XZ axial displacement) The first pick-and-place 721 and the second pick-and-place 722, the first pick-and-place 721 is to transfer the electronic component to be tested between the feeding device 30 and each of the stages 711, and the second pick-and-place 722 is attached to The electronic component is transferred between the receiving device 40 and each of the loading stations 711, and a second and three axial displacement shifting device 723 is provided for moving between the feeding device 30 and the empty device 50. The drive tray 73 is provided with a drive source 731 of the turret 732. The drive source can be a motor or a rotary cylinder. In this embodiment, the drive source 731 is a motor and is a motor. A rotating frame 732 is mounted on the rotating shaft, and the first and second panels 733A and 733B are respectively fixed in the horizontal state and the vertical state at both ends of the rotating frame 732, and are rotated to drive the first The second panel 733A, 733B alternates the position, and the first panel 733A is provided with a first driving source 734A, and the first driving source 734A can be a pressure cylinder or a motor and a screw screw set for connecting and driving a plurality of The first movable plate 735A of the third pick-and-place device 736A is telescopically displaced. The first movable plate 735A and the first front plate 733A are provided with a first sliding seat 737A and a first sliding rail 738A. The driving source 734A can also be erected on the upper frame outside the working area without moving along with the first panel 733A. The telescopic rod of the first driving source 734A pushes up the first movable panel 735A in an abutting manner. Displacement, when the first movable plate 735A is reset, it is tension-reset by the tension spring thereon, and is not limited to the foregoing embodiment. The second panel 733B is provided with a second driving source 734B. The second driving source 734B can be a pressure cylinder or a motor and a screw socket set for connecting and driving a plurality of fourth pick-and-place units 736B. The second movable plate 735B is provided with a telescopic displacement, and the second movable plate 735B and the second front plate 733B are provided with a second sliding seat 737B and a second sliding rail 738B. The second driving source 734B can also be erected in the working area. On the outer frame, without the second panel 733B moving, the telescopic rod of the second driving source 734B pushes the second movable plate 735B to extend the displacement in an abutting manner, and the second movable plate 735B is reset. Then, it is stretched and contracted by the tension spring thereon, and is not limited to the foregoing embodiment. Further, the driving source 731 can drive the first and second movable plates 735A, 735B and the third and fourth pick-and-placers 736A, 736B thereon to alternately rotate in a horizontal state and a vertical state, so that the third pick-and-placer 736A or the fourth take-up When the 736B is placed in a horizontal state, the electronic component can be taken and placed on the stage 711, and the third pick-and-placer 736A or the fourth pick-and-placer 736B is placed in a vertical state to insert the electronic component to be tested. The test stand 64; the transport device 70 is further provided with an indexing mechanism for at least one angular direction of the changeable electronic component, and the indexing mechanism can be independently mounted on the machine 20 or can be mounted on the transfer mechanism 72. Or the transfer mechanism 73, and the indexing mechanism can be used to change the angular direction of the electronic component to be tested to conform to the angular orientation of the test socket 64, and after the test is completed, the angular direction of the electronic component is changed. The receiving device is placed in the receiving device 40; when the indexing mechanism is independently assembled on the machine table 20, a plurality of sockets are provided for receiving the electronic components, and the electronic components are controlled to rotate the respective sockets by rotating or synchronously rotating the electronic components. Angle direction, then configure a pick and place shift The mechanism is for transferring the electronic components between the indexing mechanism and the stage 711, and the conveying device 70 can also be provided with a plurality of sockets for mounting the electronic components on the machine table 20, and a shifting device for the pick and place device is arranged. The mechanism further comprises an indexing mechanism on the material-feeding mechanism, and after the pick-up device takes out the electronic components on the socket, the indexing mechanism is used to drive the pick-and-placer and the electronic components thereon to rotate, and the angular position of the electronic component is changed. Direction, when the indexing mechanism is assembled on the loading mechanism 72 or the transfer mechanism 73, the first and second pickers 721, 722 or the third and fourth pickers 736A, 736B can be rotated to change the electronic components. In the embodiment, the conveying device 70 is provided with a first indexing mechanism 74A on the first pick-and-placer 721 of the loading mechanism 72 for changing the angular direction of the electronic component to be tested. A second indexing mechanism 74B is disposed on the second pick-and-placer 722 for transforming the angular position of the electronic component.

The invention can provide the environment temperature of the electronic component to be applied in the future, and select the normal temperature test operation, the thermal test operation or the cold test operation of the electronic component to eliminate the defective product, for example, the electronic component can be turned off when performing the normal temperature test operation. The temperature control units 621, 651, and 661 of the test area 62 and the first and second temperature control areas 65 and 66 enable the test area 62 and the first and second temperature control areas 65 and 66 to form a normal temperature test environment for electronic use. When the component performs a normal temperature test operation, or the electronic component is to perform a thermal test operation, each of the temperature controllers 621 and 651 of the test area 62 and the first temperature control zone 65 may be turned on, so that the first temperature control zone 65 forms a preheating zone. For preheating the electronic components, and forming the test area 62 to form a high temperature test environment for the electronic components to perform high temperature test operations, or for the electronic components to perform the cold test operation, the test area 62 and the first and second temperatures can be turned on. The temperature controllers 621, 651, and 661 of the control areas 65 and 66 form the first temperature control area 65 to form a pre-cooling zone for pre-cooling the electronic components and forming the test area 62 into a low temperature test environment for Electronic components perform cold test operations, and Two temperature-controlled region 66 is formed a warm area for the electronic component to warm to room temperature.

Please refer to FIG. 5 , which is an embodiment of the present invention for performing a cold test operation on an electronic component. The test device 60 controls each of the temperature controllers 621 and 651 of the open test zone 62 and the first and second temperature control zones 65 and 66 . 661, the first temperature control zone 65 forms a pre-cooling zone, the test zone 62 forms a low temperature test working environment, and the second temperature control zone 66 forms a warming zone. The tray 31 of the feeding device 30 is The Y-axis is displaced to the side of the first pick-and-placer 721 of the transfer mechanism 72, and the first pick-and-place 721 of the transfer mechanism 72 is axially displaced to the tray 31 to take out the electronic component 80 to be tested. Then, the first indexing mechanism 74A drives the first pick-and-placer 721 and the electronic component 80 to be tested to rotate, and transforms the angular direction of the electronic component 80 to be tested. At this time, the carrier 711A of the carrying mechanism 71 Displacement to the side of the first pick-and-placer 721, the first pick-and-placer 721 is XZ axially displaced to place the electronic component 80 to be tested in the direction of the converted angular position on the stage 711A; see section 6 The carrier mechanism 711A drives the electronic component 80 to be tested to the first temperature control zone 65, because the first temperature control zone 65 is a pre-cooling. The electronic component 80 to be tested can be pre-cooled, and the electronic component 81 to be tested in the direction of the converted angular position is sequentially carried to the first temperature control zone 65 for pre-cooling. At this time, the first pick-and-placer 721 The XZ axial displacement is used to transfer the electronic component 82 to be tested in the direction of the converted angular position to the stage 711C; see Figures 7, 8, and 9, and the stage 711A carries the pre-cooled test. The electronic component 80 is in the test area 62. Since the test area 62 is a low temperature working environment, the electronic component 80 to be tested can perform a cold test operation in a simulated low temperature environment, and then the transfer mechanism 73 controls the first drive source 734A to drive. The first movable plate 735A is displaced in the Z direction, so that the third pick-and-placer 736A takes out the electronic component 80 to be tested on the stage 711A, and then controls the rotating frame 732 by the driving source 731 to drive the first and second panels 733A and 733B. The first panel 733A and the first movable panel 735A thereon are placed in a horizontal state, and the second panel 733B and the second movable panel 735B thereon are placed in a vertical state, first. The driving source 734A drives the first movable plate 735A to perform X-axis displacement, so that the third pick-and-placer 736A is to be treated. The measured electronic component 80 is placed in the test socket 64 of the test device 60 to perform a test operation. Since the insertion port of the test socket 64 is not facing upward, the water droplets that are not condensed when the cold test operation is abnormal are not performed. Remaining in the test socket 64, thereby improving the test yield and the service life of the test circuit board 63 and the test socket 64. At this time, the stage 711C carries the electronic component 82 to be tested to the first temperature control zone 65 for pre-cooling. The first pick-and-placer 721 places the electronic component 83 to be tested in the direction of the converted angular position on the stage 711D; see Figures 9, 10, 11, and 12, when the test stand 64 performs the test operation of the electronic component 80. When the stage 711A is displaced in the Y-axis direction, the transfer mechanism 73 can control the second driving source 734B to drive the second movable plate 735B to perform Z-axis displacement, so that the fourth pick-and-placer 736B can be taken out on the stage 711A. After the electronic component 80 is tested, the first driving source 734A of the transfer mechanism 73 drives the first movable plate 735A to perform X-axis reverse displacement, so that the third pick-and-placer 736A is in the test socket 64. The measured electronic component 80 is taken out, and then driven by the driving source 731 to drive the turret 732 The first and second panels 733A and 733B are rotated 180 degrees to change the position, so that the first panel 733A and the first movable panel 735A thereon are placed in a vertical state, and the second panel 733B and the second movable panel thereon are disposed. The 735B is placed in a horizontal state, and then the first driving source 734A is controlled to drive the first movable plate 735A to perform Z-axis displacement, so that the third pick-and-placer 736A places the completed electronic component 80 on the stage 711A. The second driving source 734B drives the second movable plate 735B to perform X-axis displacement, so that the fourth pick-and-placer 736B places the electronic component 80A to be tested into the test socket 64 of the testing device 60 to perform the testing operation. Referring to FIG. 13 , the stage 711A carries the tested electronic component 80 to the second temperature control zone 66. Since the second temperature control zone 66 is a temperature return zone, the completed electronic component 80 can be returned. The temperature is normal temperature. At this time, the test socket 64 of the test device 60 performs the test operation of the electronic component 80A. The carrier 711B carries the electronic component 81 to be tested for the transfer mechanism 73 to take the material, and the other carriers are sequentially displaced; Referring to Figures 14 and 15, the carrier mechanism 71 controls the stage 7 carrying the electronic component 80. 11A leaves the second temperature control zone 66, and the stages 711B, 711C sequentially carry the test electronic components 81, 82 to the second temperature control zone 66 for warming, and the second pick-up device 722 is XZ axially displaced. The measured electronic component 80 is taken out from the stage 711A, and then the second pick-and-place mechanism 74B drives the second pick-and-placer 722 and the measurement electronic component 80 thereon to rotate, and the angular direction of the electronic component 80 is changed. According to the test result (such as good electronic component, defective electronic component or secondary electronic component), the completed electronic component 80 is directly transferred to the receiving device 40, and the tray 41 of the receiving device 40 is used as the Y axis. The second pick-and-place device 722 is placed in the displacement to place the completed electronic component 80 to complete the sorting and receiving operation.

Referring to Figures 4 and 16, in another embodiment of the present invention, the machine 20 is provided with a feeding device 30, a receiving device 40, an open device 50, a testing device 60 and a conveying device 70; The material device 30 is provided with at least one tray 31 which can be used for the first axial displacement (ie, the Y-axis displacement) for holding a plurality of electronic components to be tested; the receiving device 40 is provided with at least one a first axial displacement tray 41 for holding a plurality of completed electronic components; the hollow device 50 is for receiving the empty tray 31 of the feeding device 30, and supplementing the empty tray 31 with The receiving device 40 is configured to hold the tested electronic components. The testing device 60 is provided with a working room 61 having at least one test area 62 on the machine 20, and a temperature controller 621 is disposed in the test area 62. For the visual test operation, the test area 62 is converted into a normal temperature working environment, a high temperature working environment or a low temperature working environment, so that the electronic components perform test operations under different temperature working environments, and the test area 62 is on the side wall. A through hole 622 is defined, and at least one test seat 64 is disposed on one side of the through hole 622 and vertically matched The test circuit board 63 is placed such that the insertion opening of the test socket 64 faces the side for inserting the electronic component to be tested, and transmits the test result to the central control unit (not shown) by a tester (not shown). The central control unit controls the operation of each device, and the first temperature control area 65 of the temperature controller 651 is disposed on the test area 62 side of the working room 61, and can be visually required for the thermal/cold measurement operation. A temperature control zone 65 forms a preheating zone or precooling zone for preheating/precooling the electronic component to be tested, and the other side of the test zone 62 is provided with a second temperature control zone of the temperature controller 661. 66, and the second temperature control zone 66 forms a temperature return zone for the electronic component to be tested to return to normal temperature; the transport device 70 is provided with a carrier mechanism 71 of a plurality of stages 711, and each The loading stage 711 is cyclically displaced between the test area 62 and the first and second temperature control areas 65 and 66 for carrying the electronic components to be tested/completed, and the loading mechanism 72 is provided with two for the second. The first pick-and-placer 721 and the second pick-and-placer 722 are three-axis displacement (ie, XZ axial displacement), and the first pick-and-placer 721 is used to transfer the electronic components to be tested. The second pick-and-placer 722 is configured to transfer the electronic components that have been tested, and is provided with a second and three-axis displacement shifter 723 for transferring between the feeding device 30 and the open device 50. An empty tray, and the transfer mechanism 73 is provided with a driving source 731 of a rotating frame 732. The driving source 731 is a motor, and a rotating frame 732 is mounted on the rotating shaft of the motor. The first and second panels 733A and 733B are respectively disposed in a horizontal state and a vertical state, and the first and second panels 733A and 733B are alternately changed in position by rotation, and the first driving source 734A is disposed on the first panel 733A. The first movable plate 735A of the plurality of third pick-and-place devices 736A is coupled to drive the telescopic displacement. The first movable plate 735A and the first front plate 733A are provided with a first sliding seat 737A and a first sliding rail. 738A, the first driving source 734A can also be erected on the upper frame outside the working area without moving along the first panel 733A, and the telescopic rod of the first driving source 734A pushes the first in the top manner. The movable plate 735A is extended and displaced, and the first movable plate 735A is reset by the tensile projectile thereon. The spring tension is reset, and is not limited to the foregoing embodiments. The second panel 733B is provided with a second driving source 734B for connecting the second movable panel 735B of the plurality of fourth pick-and-placers 736B for telescopic displacement, and between the second movable panel 735B and the second panel 733B. The second sliding seat 737B and the second sliding rail 738B are provided, and the second driving source 734B can also be mounted on the upper frame outside the working area without moving along with the second panel 733B. The telescopic rod of the source 734B pushes the second movable plate 735B to extend the displacement in an abutting manner, and the second movable plate 735B is retracted by the tension spring thereon when it is reset, and is not limited to the foregoing embodiment. Further, the driving source 731 can drive the first and second movable plates 735A, 735B and the third and fourth pick-and-placers 736A, 736B thereon to alternately rotate in a horizontal state and a vertical state, so that the third pick-and-placer 736A or the fourth take-up When the 736B is placed in a horizontal state, the electronic component can be taken and placed on the stage 711, and the third pick-and-placer 736A or the fourth pick-and-placer 736B is placed in a vertical state to insert the electronic component to be tested. The test stand 64; the transport device 70 is separately disposed between the feeding device 30, the receiving device 40 and the stage 711 with two at least one bearing 741C and a third indexing mechanism 74C and at least one bearing 741D. The fourth indexing mechanism 74D, in the embodiment, the third indexing mechanism 74C is provided with a plurality of seats 741C that can be synchronously or individually rotated for receiving the electronic components to be tested and changing the angular direction thereof. In accordance with the angular orientation of the test socket 64, the fourth indexing mechanism 74D is provided with a plurality of sockets 741D that can be synchronized or individually rotated, for the electronic components to be tested, and the angular direction thereof is changed to facilitate the harvest. Placed in the receiving device 40; the conveying device 70 is attached to the third indexing mechanism 74C and the fourth indexing position The side of the structure 74D is provided with a transfer mechanism 75 having at least one pick-and-place device for transferring the electronic components to be tested/tested between the third indexing mechanism 74C, the fourth indexing mechanism 74D and the stage 711. In this embodiment, the transfer mechanism 75 is disposed on the side of the third indexing mechanism 74C to provide a fifth pick-and-placer 751 for transferring the converted angle between the third indexing mechanism 74C and the stage 711. The electronic component to be tested in the bit direction is provided with a sixth pick-and-placer 752 on the side of the fourth indexing mechanism 74D for transferring the converted angular position between the fourth indexing mechanism 74D and the stage 711. Complete the electronic components.

Please refer to FIG. 17, which is an embodiment of the present invention for performing a cold test operation on an electronic component. The test device 60 controls the temperature controllers 621 and 651 of the test area 62 and the first and second temperature control zones 65 and 66. 661, the first temperature control zone 65 forms a pre-cooling zone, the test zone 62 forms a low temperature test working environment, and the second temperature control zone 66 forms a warming zone. The tray 31 of the feeding device 30 is The Y-axis is displaced to the side of the first pick-and-placer 721 of the material transfer mechanism 72, and the first pick-and-placer 721 is axially displaced to the tray 31 to take out the electronic component 80 to be tested, and is transferred to the first On the bearing 741C of the three indexing mechanism 74C, the third indexing mechanism 74C drives the sockets 741C to rotate synchronously to change the angular direction of the electronic component 80 to be tested. At this time, the carrier 711A of the carrier mechanism 71 is Displaced to the side of the first pick-and-place 721; refer to FIG. 18, after the third indexing mechanism 74C converts the angular direction of the electronic component 80 to be tested, the fifth pick-and-placer 751 of the transfer mechanism 75 The electronic component 80 to be tested in the direction of the converted angular position is taken out on the third indexing mechanism 74C and transferred to the stage 711A; see FIG. The feeding mechanism 71 drives the stage 711A to carry the electronic component 80 to be tested in the direction of the converted angular position to the first temperature control zone 65. Since the first temperature control zone 65 is a pre-cooling zone, it can be pre-cooled to be tested. The electronic component 80, the stage 711B sequentially carries the electronic component 81 to be tested in the direction of the converted angular position and is pre-cooled to the first temperature control zone 65. At this time, the fifth pick-and-placer 751 is attached to the third indexing mechanism. The electronic component 82 to be tested in the direction of the angular position is taken out from the 74C and transferred to the stage 711C. Referring to Figures 8, 9, and 20, the stage 711A carries the pre-cooled electronic component 80 to be tested. The test area 62, because the test area 62 is a low temperature working environment, can perform the cold test operation in the simulated low temperature environment, and then the transfer mechanism 73 controls the first drive source 734A to drive the first movable plate. The 735A is displaced by the Z-axis, so that the third pick-and-placer 736A takes out the electronic component 80 to be tested on the stage 711A, and then controls the turret 732 by the driving source 731 to drive the first and second panels 733A and 733B to rotate 180 degrees. Changing the position so that the first panel 733A and the first movable panel 735A thereon are placed in a horizontal state, and the second The plate 733B and the second movable plate 735B thereon are placed in a vertical state, and the first driving source 734A drives the first movable plate 735A to perform X-axis displacement, so that the third pick-and-placer 736A will measure the electronic component 80 to be tested. The test operation is performed by being placed in the test seat 64 of the test device 60. Since the insertion port of the test seat 64 is not facing upward, the condensation water does not remain in the test seat 64 when an abnormal condition occurs in the cold test operation. In addition, the test yield and the service life of the test board 63 and the test socket 64 can be improved. At this time, the stage 711C carries the electronic component 82 to be tested to the first temperature control zone 65 for pre-cooling, and the fifth pick-and-place The 751 is taken out from the third indexing mechanism 74C to take out the electronic component 83 to be tested in the direction of the converted angular position, and is transferred to the stage 711D; see Figures 9, 11, 12, 21, when the test socket 64 is executed. During the test operation of the electronic component 80, the stage 711A is displaced in the Y-axis direction, and the transfer mechanism 73 can control the second drive source 734B to drive the second movable plate 735B to perform Z-axis displacement, so that the fourth pick-and-placer 736B is The other electronic component 80A to be tested is taken out from the stage 711A, and when the electronic component 80 is tested, The first driving source 734A of the mechanism 73 drives the first movable plate 735A to perform X-axis reverse displacement, so that the third pick-and-placer 736A takes out the measured electronic component 80 in the test socket 64, and then controls the rotation by the driving source 731. The frame 732 drives the first and second panels 733A, 733B to rotate 180 degrees to change the position, so that the first panel 733A and the first movable plate 735A thereon are placed in a vertical state, and the second panel 733B and the upper panel thereof The second movable plate 735B is placed in a horizontal state, and then the first driving source 734A is controlled to drive the first movable plate 735A to perform Z-axis displacement, so that the third pick-and-placer 736A places the completed electronic component 80 on the stage. On the 711A, the second driving source 734B drives the second movable plate 735B to perform X-axis displacement, so that the fourth pick-and-placer 736B places the electronic component 80A to be tested into the test socket 64 of the testing device 60. The test operation is continued; refer to FIG. 22, the stage 711A carries the tested electronic component 80 to the second temperature control zone 66, and since the second temperature control zone 66 is a return temperature zone, the test can be completed. The electronic component 80 is warmed to normal temperature. At this time, the test socket 64 of the testing device 60 executes the electronic component 80A. In the test operation, the stage 711B carries the electronic component 81 to be tested for the transfer mechanism 73 to take the material, and the other stages are sequentially displaced; referring to FIG. 23, the carrier mechanism 71 controls the stage carrying the tested electronic component 80. 711A leaves the second temperature control zone 66, and the stages 711B, 711C sequentially carry the test electronic components 81, 82 to the second temperature control zone 66 to return to the temperature, and the sixth pick-up 752 is taken out on the stage 711A. The electronic component 80 is measured; referring to FIG. 24, the sixth pick-and-placer 752 is configured to transfer the completed electronic component 80 to the socket 741D of the fourth indexing mechanism 74D, and the fourth indexing mechanism 74D is The respective holders 741D are driven to rotate synchronously to change the angular direction of the electronic component 80. Referring to FIG. 25, after the measured electronic component 80 changes the angular position, the second pick-and-placer 722 is used as the XZ axis. The finished electronic component 80 with the shifted angular position is taken out from the bearing 741D of the fourth indexing mechanism 74D; please refer to Fig. 26, and the second pick-and-placer 722 is based on the test result (such as good electronic components, defective products) Electronic component or electronic component (electronic component) directly transfers the completed electronic component 80 to the receiving device 40 Receipt means 40 of the tray 41 that is, for Y axial displacement to take place for the second electronic device 722 inserted End of test 80, to complete the job classification stowed.

Accordingly, the present invention is a practical and progressive design, but it has not been disclosed that the same products and publications are disclosed, thereby permitting the invention patent application requirements, and applying in accordance with the law.

[Literature]

11. . . Machine

12. . . Feeding device

13. . . Receiving device

14. . . Test device

141. . . Cold room

142. . . Test board

143. . . Test stand

144. . . Pressing fixture

15. . . Pre-cooling tray

16. . . Conveyor

161. . . Pick and place

17. . . Electronic component

[this invention]

20. . . Machine

30. . . Feeding device

31. . . Trays

40. . . Receiving device

41. . . Trays

50. . . Open device

60. . . Test device

61. . . Work room

62. . . Test area

621. . . thermostat

622. . . Through hole

63. . . Test board

64. . . Test stand

65. . . First temperature control zone

651. . . thermostat

66. . . Second temperature control zone

661. . . thermostat

70. . . Conveyor

71. . . Carrier mechanism

711, 711A, 711B, 711C, 711D. . . Loading platform

72. . . Transfer mechanism

721. . . First pick and place

722. . . Second pick and place

723. . . Shifter

73. . . Transfer mechanism

731. . . Drive source

732. . . Turret

733A. . . First panel

733B. . . Second panel

734A. . . First drive source

734B. . . Second drive source

735A. . . First activity board

735B. . . Second activity board

736A. . . Third pick and place

736B. . . Fourth pick and place

737A. . . First slide

737B. . . Second slide

738A. . . First rail

738B. . . Second slide

74A. . . First indexing mechanism

74B. . . Second indexing mechanism

74C. . . Third indexing mechanism

741C. . . Seat

74D. . . Fourth indexing mechanism

741D. . . Seat

75. . . Transfer mechanism

751. . . Fifth pick and place

752. . . Sixth pick and place

80, 80A, 81, 82, 83. . . Electronic component

Figure 1: Schematic diagram of a conventional electronic component cold tester.

Figure 2: Schematic diagram of the use of the test bench.

Fig. 3 is a schematic view showing the configuration of each device of the present invention.

Figure 4: Schematic diagram of the transfer mechanism of the present invention.

Fig. 5 is a schematic view showing the use of the cold test operation of the present invention (1).

Fig. 6 is a schematic view showing the use of the cold test operation of the present invention (2).

Fig. 7 is a schematic view showing the use of the cold test operation of the present invention (3).

Figure 8: Schematic diagram of the use of the electronic component to be tested by the transfer mechanism.

Figure 9: Schematic diagram of the use of the transfer mechanism against the electronic component test.

Fig. 10 is a schematic view showing the use of the cold test operation of the present invention (4).

Figure 11: Schematic diagram of the use of the transfer mechanism to take out and pressure test electronic components.

Figure 12: Schematic diagram of the use of the reloading mechanism to transfer the electronic components to be tested/tested.

Figure 13 is a schematic view showing the use of the cold test operation of the present invention (5).

Figure 14 is a schematic diagram of the use of the cold test operation of the present invention (6).

Fig. 15 is a schematic view showing the use of the cold test operation of the present invention (7).

Figure 16 is a view showing another embodiment of the present invention.

Figure 17 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (1).

Figure 18 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (2).

Figure 19 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (3).

Figure 20 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (4).

Figure 21 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (5).

Figure 22 is a schematic view showing the use of a cold test operation (6) in another embodiment of the present invention.

Figure 23 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (7).

Figure 24 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (VIII).

Figure 25 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (9).

Figure 26 is a schematic view showing the use of a cold test operation according to another embodiment of the present invention (10).

20. . . Machine

30. . . Feeding device

31. . . Trays

40. . . Receiving device

41. . . Trays

50. . . Open device

60. . . Test device

61. . . Work room

62. . . Test area

621. . . thermostat

622. . . Through hole

63. . . Test board

64. . . Test stand

65. . . First temperature control zone

651. . . thermostat

66. . . Second temperature control zone

661. . . thermostat

70. . . Conveyor

71. . . Carrier mechanism

711. . . Loading platform

72. . . Transfer mechanism

721. . . First pick and place

722. . . Second pick and place

723. . . Shifter

73. . . Transfer mechanism

74A. . . First indexing mechanism

74B. . . Second indexing mechanism

Claims (10)

An electronic component test sorting machine comprises: a machine table; a feeding device: configured on the machine platform for accommodating at least one electronic component to be tested; and a receiving device: disposed on the machine platform for accommodating at least one The tested electronic device; the test device is disposed on the machine table and is provided with at least one test area, the test area is provided with a test circuit board having at least one test seat, and the insertion opening of the test seat is not facing upward For testing electronic components; conveying device: disposed on the machine table, and provided with a carrier mechanism having at least one carrier for carrying electronic components between the supply and receiving device and the testing device, a transfer mechanism having at least one pick-and-place device for transferring electronic components, and a transfer mechanism having at least one pick-and-place device for picking and placing electronic components in a horizontal state and corresponding to the rotating arrangement The angle of the test socket insertion port inserts the electronic component to be tested into the test socket for testing; the central control unit is used to control and integrate the operation of each device to perform an automated operation. The electronic component test sorting machine according to claim 1, wherein the test device is provided with a working room with a test area on the machine table, and a temperature controller is arranged in the test area. According to the electronic component testing and classifying machine of claim 2, wherein the testing device is provided with a first temperature control zone with a thermostat on one side of the test area in the working room, and another in the test zone. The second temperature control zone with a thermostat is arranged on the side. According to the electronic component test sorting machine of claim 1, wherein the moving mechanism is provided with two first pick-and-placers and second pick-and-placers for second and third axial displacement, first The pick-and-place device is used to transfer the electronic components to be tested between the feeding device and the stage, and the second pick-and-place device is an electronic component that is transferred between the receiving device and the stage. According to the electronic component test sorting machine of claim 4, the conveying device is further provided with a first indexing mechanism on the first pick-and-place device of the material transferring mechanism for transforming the corner of the electronic component to be tested. In the bit direction, a second indexing mechanism is disposed on the second pick-and-placer for transforming the angular direction of the electronic component. The electronic component test sorting machine according to claim 1, wherein the transfer mechanism is provided with a driving source for driving a rotating frame, and the two ends of the rotating frame are respectively arranged at different angles. The first panel is configured with a first movable panel having a third pick-and-place device, wherein the first movable panel is driven to be displaced by a driving source, and the second panel is configured with a fourth pick-and-placer The second movable panel is driven to be displaced by a driving source. The electronic component test sorting machine according to item 1 of the patent application scope further includes an empty device for accommodating at least one empty tray, and a shifting device for the feeding mechanism for the feeding device and Transfer empty trays between empty units. The electronic component test sorting machine according to claim 1, further comprising at least one indexing mechanism for transforming the angular direction of the electronic component. According to the electronic component testing and sorting machine of claim 8, wherein the conveying device is provided with a third indexing mechanism and a fourth indexing mechanism of the two sockets for transforming the electronic components. The direction of the corner is provided with a fifth pick-and-placer and a sixth pick-and-place transfer mechanism for transferring electronic components between the third and fourth indexing mechanisms and the stage. The electronic component testing and sorting machine according to claim 8 , wherein the conveying device is respectively provided with an indexing mechanism on the third and fourth pick-and-placers of the transfer mechanism for transforming the angular direction of the electronic component .