TWI435341B - - Google Patents

Info

Publication number
TWI435341B
TWI435341B TW101122620A TW101122620A TWI435341B TW I435341 B TWI435341 B TW I435341B TW 101122620 A TW101122620 A TW 101122620A TW 101122620 A TW101122620 A TW 101122620A TW I435341 B TWI435341 B TW I435341B
Authority
TW
Taiwan
Application number
TW101122620A
Other versions
TW201401305A (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW101122620A priority Critical patent/TW201401305A/zh
Priority to CN201210297086.XA priority patent/CN103515042B/zh
Priority to JP2012254991A priority patent/JP5666540B2/ja
Priority to US13/783,931 priority patent/US20130341301A1/en
Priority to EP13159913.6A priority patent/EP2680279B1/en
Priority to KR1020130036182A priority patent/KR101528207B1/ko
Publication of TW201401305A publication Critical patent/TW201401305A/zh
Application granted granted Critical
Publication of TWI435341B publication Critical patent/TWI435341B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/108—Flash, trim or excess removal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Non-Adjustable Resistors (AREA)
  • Details Of Resistors (AREA)
TW101122620A 2012-06-25 2012-06-25 微型金屬片電阻的量產方法 TW201401305A (zh)

Priority Applications (6)

Application Number Priority Date Filing Date Title
TW101122620A TW201401305A (zh) 2012-06-25 2012-06-25 微型金屬片電阻的量產方法
CN201210297086.XA CN103515042B (zh) 2012-06-25 2012-08-21 微型金属片电阻的量产方法
JP2012254991A JP5666540B2 (ja) 2012-06-25 2012-11-21 チップ抵抗器及びその半製品の製造方法
US13/783,931 US20130341301A1 (en) 2012-06-25 2013-03-04 Method for manufacturing a chip resistor
EP13159913.6A EP2680279B1 (en) 2012-06-25 2013-03-19 Method for manufacturing a SMD resistor
KR1020130036182A KR101528207B1 (ko) 2012-06-25 2013-04-03 칩 저항기를 제조하는 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101122620A TW201401305A (zh) 2012-06-25 2012-06-25 微型金屬片電阻的量產方法

Publications (2)

Publication Number Publication Date
TW201401305A TW201401305A (zh) 2014-01-01
TWI435341B true TWI435341B (zh) 2014-04-21

Family

ID=47891530

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101122620A TW201401305A (zh) 2012-06-25 2012-06-25 微型金屬片電阻的量產方法

Country Status (6)

Country Link
US (1) US20130341301A1 (zh)
EP (1) EP2680279B1 (zh)
JP (1) JP5666540B2 (zh)
KR (1) KR101528207B1 (zh)
CN (1) CN103515042B (zh)
TW (1) TW201401305A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553672B (zh) * 2014-10-17 2016-10-11 Preparation method of micro - impedance resistance and its products

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015129161A1 (ja) * 2014-02-27 2015-09-03 パナソニックＩｐマネジメント株式会社 チップ抵抗器
CN105590712A (zh) * 2014-11-15 2016-05-18 旺诠股份有限公司 微阻抗电阻的制作方法及微阻抗电阻
CN105789185B (zh) * 2014-12-24 2018-06-05 厚声工业股份有限公司 厚膜晶片电阻器结构
CN106298116B (zh) * 2015-06-10 2018-07-06 旺诠股份有限公司 金属板微电阻的制造方法
US10083781B2 (en) 2015-10-30 2018-09-25 Vishay Dale Electronics, Llc Surface mount resistors and methods of manufacturing same
US10438729B2 (en) 2017-11-10 2019-10-08 Vishay Dale Electronics, Llc Resistor with upper surface heat dissipation
DE112019004049T5 (de) 2018-08-10 2021-05-27 Rohm Co., Ltd. Widerstand
TWI718971B (zh) * 2020-07-07 2021-02-11 旺詮股份有限公司 大批量產生微型電阻元件的製作方法
TWI718972B (zh) * 2020-07-07 2021-02-11 旺詮股份有限公司 具有精準電阻值之微型電阻元件的製作方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8800853A (nl) * 1988-04-05 1989-11-01 Philips Nv Chipweerstand en werkwijze voor het vervaardigen van een chipweerstand.
JP3229473B2 (ja) * 1993-12-27 2001-11-19 松下電器産業株式会社 チップ抵抗器の製造方法
US5753391A (en) * 1995-09-27 1998-05-19 Micrel, Incorporated Method of forming a resistor having a serpentine pattern through multiple use of an alignment keyed mask
JPH10284525A (ja) * 1997-04-03 1998-10-23 Shinko Electric Ind Co Ltd 半導体装置の製造方法
JPH11274357A (ja) * 1998-03-20 1999-10-08 Sony Corp 電子部品の分割方法および分割装置
JP3444240B2 (ja) * 1998-07-08 2003-09-08 松下電器産業株式会社 チップ形ｐｔｃサーミスタの製造方法
JP2000200701A (ja) * 1999-01-07 2000-07-18 Tateyama Kagaku Kogyo Kk チップ型抵抗器およびその製造方法
TW529772U (en) * 2002-06-06 2003-04-21 Protectronics Technology Corp Surface mountable laminated circuit protection device
JP2004319874A (ja) * 2003-04-18 2004-11-11 Rohm Co Ltd チップ抵抗器およびその製造方法
JP4537103B2 (ja) * 2004-03-30 2010-09-01 コーア株式会社 抵抗用積層合金及びその製造方法
US7119655B2 (en) * 2004-11-29 2006-10-10 Therm-O-Disc, Incorporated PTC circuit protector having parallel areas of effective resistance
CN1822251A (zh) * 2006-03-03 2006-08-23 华新科技股份有限公司 晶片电阻的制造方法
CN101535040A (zh) * 2006-11-16 2009-09-16 三菱树脂株式会社 阻气膜叠层体
DE102006060387A1 (de) * 2006-12-20 2008-06-26 Isabellenhütte Heusler Gmbh & Co. Kg Widerstand, insbesondere SMD-Widerstand, und zugehöriges Herstellungsverfahren
JP5464829B2 (ja) * 2008-04-28 2014-04-09 ローム株式会社 チップ抵抗器およびその製造方法
JP2009302494A (ja) * 2008-05-14 2009-12-24 Rohm Co Ltd チップ抵抗器およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI553672B (zh) * 2014-10-17 2016-10-11 Preparation method of micro - impedance resistance and its products

Also Published As

Publication number Publication date
JP2014007374A (ja) 2014-01-16
TW201401305A (zh) 2014-01-01
CN103515042B (zh) 2016-12-21
KR101528207B1 (ko) 2015-06-11
JP5666540B2 (ja) 2015-02-12
EP2680279B1 (en) 2020-01-01
KR20140000622A (ko) 2014-01-03
EP2680279A1 (en) 2014-01-01
CN103515042A (zh) 2014-01-15
US20130341301A1 (en) 2013-12-26

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees