TWI431075B - 用於可撓性電路之耐燃性覆蓋表層 - Google Patents
用於可撓性電路之耐燃性覆蓋表層 Download PDFInfo
- Publication number
- TWI431075B TWI431075B TW96104912A TW96104912A TWI431075B TW I431075 B TWI431075 B TW I431075B TW 96104912 A TW96104912 A TW 96104912A TW 96104912 A TW96104912 A TW 96104912A TW I431075 B TWI431075 B TW I431075B
- Authority
- TW
- Taiwan
- Prior art keywords
- composition
- phosphonate
- flexible circuit
- flame retardant
- examples
- Prior art date
Links
- 239000000203 mixture Substances 0.000 claims description 69
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 claims description 36
- 229910000679 solder Inorganic materials 0.000 claims description 17
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 14
- 239000003063 flame retardant Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 6
- 239000004952 Polyamide Substances 0.000 claims description 5
- 229920002647 polyamide Polymers 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 229910052736 halogen Inorganic materials 0.000 claims description 4
- 229920001228 polyisocyanate Polymers 0.000 claims description 4
- 239000005056 polyisocyanate Substances 0.000 claims description 4
- 229920005903 polyol mixture Polymers 0.000 claims description 4
- 229920001451 polypropylene glycol Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 11
- 125000003277 amino group Chemical group 0.000 claims 1
- 150000004675 formic acid derivatives Chemical class 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims 1
- 239000010410 layer Substances 0.000 description 26
- 238000012360 testing method Methods 0.000 description 16
- 229920000742 Cotton Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229920001721 polyimide Polymers 0.000 description 6
- 239000000126 substance Substances 0.000 description 5
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000008199 coating composition Substances 0.000 description 3
- 238000002485 combustion reaction Methods 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 1
- 229910017076 Fe Zr Inorganic materials 0.000 description 1
- JAWMENYCRQKKJY-UHFFFAOYSA-N [3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-ylmethyl)-1-oxa-2,8-diazaspiro[4.5]dec-2-en-8-yl]-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]methanone Chemical compound N1N=NC=2CN(CCC=21)CC1=NOC2(C1)CCN(CC2)C(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F JAWMENYCRQKKJY-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000007655 standard test method Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004034 viscosity adjusting agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/18—Fireproof paints including high temperature resistant paints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/14—Macromolecular materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Fireproofing Substances (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/352,125 US7758964B2 (en) | 2006-02-10 | 2006-02-10 | Flame resistant covercoat for flexible circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200806129A TW200806129A (en) | 2008-01-16 |
| TWI431075B true TWI431075B (zh) | 2014-03-21 |
Family
ID=38368922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW96104912A TWI431075B (zh) | 2006-02-10 | 2007-02-09 | 用於可撓性電路之耐燃性覆蓋表層 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7758964B2 (https=) |
| JP (1) | JP5465436B2 (https=) |
| KR (1) | KR20080105039A (https=) |
| CN (1) | CN101395235B (https=) |
| TW (1) | TWI431075B (https=) |
| WO (1) | WO2007095011A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5068919B2 (ja) * | 2003-09-25 | 2012-11-07 | スリーエム イノベイティブ プロパティズ カンパニー | 発泡シート形成性組成物、熱伝導性発泡シート及びその製造方法 |
| US20090124734A1 (en) * | 2007-11-05 | 2009-05-14 | 3M Innovative Properties Company | Halogen-free flame retardant resin composition |
| BRPI0920862A2 (pt) * | 2008-10-07 | 2015-12-22 | 3M Innovative Properties Co | composição, método para fabricação da mesma, e uso da mesma |
| US8231390B2 (en) * | 2010-06-18 | 2012-07-31 | Tyco Electronics Corporation | System and method for controlling impedance in a flexible circuit |
| US9600112B2 (en) * | 2014-10-10 | 2017-03-21 | Apple Inc. | Signal trace patterns for flexible substrates |
| US10849222B2 (en) | 2016-11-14 | 2020-11-24 | Pioneer Circuits, Inc. | High temperature resistant fabric and its use in flexible circuits |
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| BE661824A (https=) | 1964-03-31 | |||
| US4165411A (en) | 1975-06-18 | 1979-08-21 | W. R. Grace & Co. | Flame retardant urethane and method |
| US5110840A (en) * | 1990-01-02 | 1992-05-05 | Blount David H | Flame-retardant polyurethane foam utilizing a phosphorus acid |
| JP3328011B2 (ja) * | 1993-06-25 | 2002-09-24 | ティーディーケイ株式会社 | 磁気記録媒体の製造方法 |
| EP0684597B1 (en) * | 1993-12-01 | 2003-07-09 | TDK Corporation | Production method of magnetic recording medium |
| US5942561A (en) | 1995-03-03 | 1999-08-24 | Tosoh Corporation | Fire-retardant polymer composition |
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| DE19614424A1 (de) | 1996-04-12 | 1997-10-16 | Hoechst Ag | Synergistische Flammschutzmittel-Kombination für Polymere |
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| DE19903707C2 (de) | 1999-01-30 | 2003-05-28 | Clariant Gmbh | Flammwidrige duroplastische Massen |
| TW554036B (en) * | 1999-03-22 | 2003-09-21 | Ciba Sc Holding Ag | Flame-retarding composition and process for the preparation thereof |
| NL1011631C2 (nl) * | 1999-03-22 | 2000-09-27 | Dsm Nv | Vlamdovende samenstelling en werkwijze voor de bereiding ervan. |
| NL1013105C2 (nl) * | 1999-09-21 | 2001-03-22 | Dsm Nv | Vlamdovend mengsel. |
| JP4231976B2 (ja) * | 2000-03-30 | 2009-03-04 | 日本ゼオン株式会社 | 硬化性組成物及び多層回路基板 |
| JP2002057442A (ja) * | 2000-05-30 | 2002-02-22 | Fujikura Ltd | フレキシブルプリント基板の絶縁構造及び製造方法 |
| DE10030658C1 (de) * | 2000-06-23 | 2002-01-03 | Trespa Int Bv | Flammwidrige Harzbeschichtung |
| US6384128B1 (en) | 2000-07-19 | 2002-05-07 | Toray Industries, Inc. | Thermoplastic resin composition, molding material, and molded article thereof |
| NL1016340C2 (nl) * | 2000-10-05 | 2002-04-08 | Dsm Nv | Halogeenvrije vlamvertragende samenstelling en vlamdovende polyamidesamenstelling. |
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| KR20040111516A (ko) * | 2002-04-15 | 2004-12-31 | 니폰 제온 가부시키가이샤 | 니스, 성형물, 전기 절연막, 적층체, 난연제 슬러리, 및난연제 입자 및 니스의 제조방법 |
| TWI278481B (en) | 2002-04-16 | 2007-04-11 | Hitachi Chemical Co Ltd | Thermosetting resin composition, prepreg and laminate using the same |
| DE60325848D1 (de) | 2002-05-16 | 2009-03-05 | Dow Corning | Flammwidrige zusammensetzungen |
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| US20060167143A1 (en) | 2004-11-22 | 2006-07-27 | General Electric Company | Flame Retardant Poly(Arylene Ether)/Polyamide Composition |
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| US7618766B2 (en) * | 2005-12-21 | 2009-11-17 | E. I. Du Pont De Nemours And Company | Flame retardant photoimagable coverlay compositions and methods relating thereto |
| CN101395223A (zh) | 2006-03-09 | 2009-03-25 | 昭和电工株式会社 | 热固性树脂组合物及其用途 |
| JP2007302762A (ja) | 2006-05-10 | 2007-11-22 | Gun Ei Chem Ind Co Ltd | 発泡用樹脂組成物及びその発泡体 |
| JP4244052B2 (ja) | 2006-06-06 | 2009-03-25 | 信越化学工業株式会社 | 塩化ビニル系樹脂組成物およびその成形体 |
| US7820740B2 (en) | 2006-10-02 | 2010-10-26 | Shin-Etsu Chemical Co., Ltd. | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| DE102007015083A1 (de) | 2007-03-29 | 2008-10-02 | Clariant International Limited | Flammgeschützte Klebe- und Dichtmassen |
| US20090104444A1 (en) | 2007-10-19 | 2009-04-23 | 3M Innovative Properties Company | Halogen-free flame retardant adhesive compositions and article containing same |
| US20090124734A1 (en) | 2007-11-05 | 2009-05-14 | 3M Innovative Properties Company | Halogen-free flame retardant resin composition |
-
2006
- 2006-02-10 US US11/352,125 patent/US7758964B2/en not_active Expired - Fee Related
-
2007
- 2007-02-05 WO PCT/US2007/003162 patent/WO2007095011A1/en not_active Ceased
- 2007-02-05 CN CN2007800081670A patent/CN101395235B/zh not_active Expired - Fee Related
- 2007-02-05 JP JP2008554304A patent/JP5465436B2/ja not_active Expired - Fee Related
- 2007-02-05 KR KR1020087019448A patent/KR20080105039A/ko not_active Ceased
- 2007-02-09 TW TW96104912A patent/TWI431075B/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| US20070190337A1 (en) | 2007-08-16 |
| CN101395235A (zh) | 2009-03-25 |
| JP2009526400A (ja) | 2009-07-16 |
| KR20080105039A (ko) | 2008-12-03 |
| WO2007095011A1 (en) | 2007-08-23 |
| CN101395235B (zh) | 2012-07-11 |
| JP5465436B2 (ja) | 2014-04-09 |
| US7758964B2 (en) | 2010-07-20 |
| TW200806129A (en) | 2008-01-16 |
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