JP5465436B2 - フレキシブル回路用難燃性カバーコート組成物 - Google Patents

フレキシブル回路用難燃性カバーコート組成物 Download PDF

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Publication number
JP5465436B2
JP5465436B2 JP2008554304A JP2008554304A JP5465436B2 JP 5465436 B2 JP5465436 B2 JP 5465436B2 JP 2008554304 A JP2008554304 A JP 2008554304A JP 2008554304 A JP2008554304 A JP 2008554304A JP 5465436 B2 JP5465436 B2 JP 5465436B2
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JP
Japan
Prior art keywords
phosphinate
cover coat
flame retardant
composition
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008554304A
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English (en)
Japanese (ja)
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JP2009526400A (ja
JP2009526400A5 (https=
Inventor
デイビッド・ディ・ル
ユミ・ピュン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
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3M Innovative Properties Co
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Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2009526400A publication Critical patent/JP2009526400A/ja
Publication of JP2009526400A5 publication Critical patent/JP2009526400A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/18—Fireproof paints including high temperature resistant paints
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/14—Macromolecular materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Fireproofing Substances (AREA)
  • Paints Or Removers (AREA)
JP2008554304A 2006-02-10 2007-02-05 フレキシブル回路用難燃性カバーコート組成物 Expired - Fee Related JP5465436B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/352,125 2006-02-10
US11/352,125 US7758964B2 (en) 2006-02-10 2006-02-10 Flame resistant covercoat for flexible circuit
PCT/US2007/003162 WO2007095011A1 (en) 2006-02-10 2007-02-05 Flame resistant covercoat for flexible circuit

Publications (3)

Publication Number Publication Date
JP2009526400A JP2009526400A (ja) 2009-07-16
JP2009526400A5 JP2009526400A5 (https=) 2010-03-25
JP5465436B2 true JP5465436B2 (ja) 2014-04-09

Family

ID=38368922

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008554304A Expired - Fee Related JP5465436B2 (ja) 2006-02-10 2007-02-05 フレキシブル回路用難燃性カバーコート組成物

Country Status (6)

Country Link
US (1) US7758964B2 (https=)
JP (1) JP5465436B2 (https=)
KR (1) KR20080105039A (https=)
CN (1) CN101395235B (https=)
TW (1) TWI431075B (https=)
WO (1) WO2007095011A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5068919B2 (ja) * 2003-09-25 2012-11-07 スリーエム イノベイティブ プロパティズ カンパニー 発泡シート形成性組成物、熱伝導性発泡シート及びその製造方法
US20090124734A1 (en) * 2007-11-05 2009-05-14 3M Innovative Properties Company Halogen-free flame retardant resin composition
BRPI0920862A2 (pt) * 2008-10-07 2015-12-22 3M Innovative Properties Co composição, método para fabricação da mesma, e uso da mesma
US8231390B2 (en) * 2010-06-18 2012-07-31 Tyco Electronics Corporation System and method for controlling impedance in a flexible circuit
US9600112B2 (en) * 2014-10-10 2017-03-21 Apple Inc. Signal trace patterns for flexible substrates
US10849222B2 (en) 2016-11-14 2020-11-24 Pioneer Circuits, Inc. High temperature resistant fabric and its use in flexible circuits

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Also Published As

Publication number Publication date
US20070190337A1 (en) 2007-08-16
CN101395235A (zh) 2009-03-25
JP2009526400A (ja) 2009-07-16
KR20080105039A (ko) 2008-12-03
TWI431075B (zh) 2014-03-21
WO2007095011A1 (en) 2007-08-23
CN101395235B (zh) 2012-07-11
US7758964B2 (en) 2010-07-20
TW200806129A (en) 2008-01-16

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