TWI428181B - 金屬合金催化劑組成物 - Google Patents

金屬合金催化劑組成物 Download PDF

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TWI428181B
TWI428181B TW099135388A TW99135388A TWI428181B TW I428181 B TWI428181 B TW I428181B TW 099135388 A TW099135388 A TW 099135388A TW 99135388 A TW99135388 A TW 99135388A TW I428181 B TWI428181 B TW I428181B
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catalyst composition
catalyst
metal alloy
composition according
exchange resin
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TW201119739A (en
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Jose Trejo
Eric J Langenmayr
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Rohm & Haas
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Description

金屬合金催化劑組成物
本發明係關於摻雜有金屬合金之催化劑及其使用方法。特別地,本發明係關於摻雜有具成本效益的金屬合金之離子交換樹脂催化劑之用途及製造方法,其提供與先前所使用的催化劑可相媲美之產率及選擇性。
醛醇縮合反應係涉及藉由將一種羰基化合物之α-碳添加至另一種羰基化合物之羰基碳之羰基化合物(醛或酮)之二聚化(dimerization),以提供β-羥基羰基化合物。於酸性催化劑之存在下縮合兩種酮之情況中,脫水通常發生於二聚化之後以提供α,β-不飽和酮;使用傳統技術將雙鍵還原可用於提供飽和酮加成物。
第6,977,314號美國專利案揭示了一種較之使用傳統單磺化離子交換樹脂催化劑之方法增加自丙酮之縮合反應所得甲基異丁基酮的產率之方法。第6,977,314號美國專利案揭示了多磺化離子交換樹脂之使用,該樹脂具有至少5.0毫當量磺酸基/公克催化劑且裝載金屬,如鈀。所選定之金屬係單獨使用且為昂貴的材料。現需要一種使用摻雜金屬合金同時保持催化劑壽命、選擇性及產率且提升成本效益之方法。
本發明藉由提供適用於生產各式反應產物之裝載有具成本效益之金屬合金之催化劑而解決了先前技術之缺陷。
本發明提供一種異質催化劑組成物,包括:
(a) 離子交換樹脂;以及
(b) 金屬合金,以催化劑之乾重為基準計;
其中,該催化劑組成物與化學反應中之反應物反應。
除非內文中明確另行指明,否則本說明書通篇中之下列術語具有以下意思:術語“交聯聚合物基體”係指經方便地官能化以提供多磺化、單磺化或部分磺化之芳香環之任何交聯聚合物基體,以及經方便地官能化以提供具有胺官能度之芳香環之任何交聯聚合基體;典型地,該交聯聚合物基體係交聯苯乙烯系聚合物,其中芳香環經磺化處理以提供適用於本發明之製程之催化劑。
術語“離子交換樹脂”係指具有離子交換官能度之交聯聚合物基體。
術語“共聚物”係指含有兩種或更多種不同單體單元(包括位置異構體)之聚合物組成物。
術語“交聯共聚物”意指自單體或含有至少1重量%(以總單體重量為基準計)之多乙烯基不飽和單體之單體混合物聚合之聚合物或共聚物。
術語“大孔”意指當藉由BET技術(基於Stephen Brunauer,Paul Hugh Emmett及Edward Teller於1938之公開刊物)測量時得到高於0.1 m2 /g且低於2000 m2 /g之表面積之材料。典型地,本發明之大孔樹脂催化劑具有1 m2 /g至200 m2 /g之表面積。
術語“(甲基)丙烯酸烷基酯”係指相應的丙烯酸酯或甲基丙烯酸酯;類似地,術語“(甲基)丙烯酸系”係指丙烯酸或甲基丙烯酸,以及其相應的衍生物,如酯或醯胺。
術語“摻雜”係指將金屬材料(metallic species)添加至聚合物支撐物。
術語“浸染(impregnated)”係指金屬可於聚合支撐物中錯合或呈金屬結構。
術語“金屬合金”與‘金屬奈米簇’或‘金屬奈米合金’同義。此處金屬合金係組合於單一奈米尺寸簇中之兩種或更多種金屬。該金屬合金之奈米簇尺寸自1至250 nm。再者,該金屬合金係含有兩種或多種元素之呈(1)固體、(2)金屬間化合物或(3)金屬相之混合物之金屬產物。
除非另行說明,所有指稱的百分數將表示為以涉及之聚合物或組成物之總重量為基準計之重量百分數(%)。本發明所使用之縮寫如下:g=公克,μm=微米,cm=釐米;mm=毫米,m=米,nm=奈米,ml=毫升,meq/g=毫當量/公克,L=公升,1 bar壓力=105 帕斯卡或105 帕,1 bar=1 MPa,LHSV=線時空速(h-1 )=液體之流速(ml/h)/管柱中催化劑之體積(ml),長寬比=長/寬。
除非另行說明,所列之範圍應解釋為包括上下限值且可組合,溫度表示為攝氏度(℃)。
適用於本發明之反應製程之非限制性實施例及其於一階段反應之連續組合包括異構化;水合;醛醇縮合;脫水;氫解;硝酸還原;碳-碳耦合(即Heck及Suzuki反應);氧化;氫甲醯化;選擇性還原烯烴、酮、醇、炔烴及酸。由本發明之經催化之反應所製得之產物包括,但不限於過氧化氫、1,4丁二醇、醋酸乙烯酯、烷基酚、甲基異丁基酮(MIBK)、天然洗滌劑醇。
適用於本發明之反應製程之摻雜有金屬合金之異質催化劑係具有磺化官能度之離子交換樹脂;即支撐催化劑位置之交聯聚合物基體含有每一芳香環含有大於0個磺酸基之芳香環。典型地,至少10%、或者至少15%以及再或者至少20%之芳香環包含每一芳香環含有大於1個磺酸基。離子交換樹脂可為強鹼性陰離子交換樹脂或強酸性陽離子交換樹脂。或者,適用於本發明之反應製程之摻雜有金屬合金之異質催化劑係具有胺官能度之離子交換樹脂,即支撐催化劑位置之交聯聚合物基體含有芳香環,該芳香環含有位於芳香環上之1個胺基。
適用於本發明之反應製程之摻雜有金屬合金之異質催化劑可為凝膠或大孔珠、膜片、板、膜或纖維。本發明之適當的摻雜有金屬合金之異質催化劑具有自10μm至1000μm,或者自500μm至1000μm,再或者自750μm至1000μm之平均粒徑;具有1.0至7.0 meq/g,或者5.1至6.5 meq/g,再或者5.2至6.0 meq/g(以離子交換樹脂之乾重為基準計)之磺酸基;典型地具有0至2000,或者0.1至2000,再或者1至700,又或者10至600平方米/公克(m2 /g)之表面積;以及0.1至0.9,或者0.2至0.7,再或者0.25至0.5立方釐米孔/公克聚合物(cm3 /g)之總孔隙率;典型地,交聯劑於樹脂之比率為總催化劑組成物之0.5至80%、5至30%、10至20%;持水量為80至30%,或者70至40,再或者55至45%;持重量為0.5至7.0 meq/Kg,或者1至6 meq/Kg,再或者2至5 meq/Kg;平均孔徑為50至2,500埃單位,或者150至1000埃單位。根據IUPAC(International Union of Pure and Applied Chemistry)系統命名法定義的孔隙率如下:微孔率=小於20埃單位之孔;中孔率=20至500埃單位之孔;大孔率=大於500埃單位之孔。
本發明之催化劑裝載0.1至25%,或者0.5至15%,再或者1.0至10.0%金屬合金(以離子交換樹脂之乾重為基準計)。理想地,可將金屬合金裝載於離子交換樹脂顆粒之外殼上或均勻分散而遍佈於該顆粒。對於該金屬合金本身而言,其典型地包含0.5至100%金屬,或者80至100%金屬,再或者90至100%金屬組份。本發明之金屬合金組成物之金屬以奈米簇尺寸為1至150 nm,或者1至50 nm,再或者1至10 nm存在。
該摻雜有金屬合金之離子交換樹脂典型地自交聯大孔共聚物製備,如揭示於第4,382,124號美國專利案者,其中係藉由在致孔劑(亦稱為“相增量劑(phase extender)”或“沈澱劑”,即單體之溶劑而聚合物之非溶劑)之存在下之懸浮聚合反應將孔隙引入共聚物珠中。
典型的交聯大孔共聚物製備可包括如含有懸浮助劑(如分散劑、保護膠體及緩衝劑)之連續水相溶液之製備,之後與單體混合物混合,該單體混合物含有1至85%多乙烯基芳香族(polyvinyl aromatic)單體、自由基引發劑及典型地每份單體有0.2至5,或者0.3至3,再或者0.4至1份的致孔劑(如甲苯、二甲苯、(C4 -C10 )烷醇、(C6 -C12 )飽和烴或聚烷二醇)。之後,將單體與致孔劑之混合物於升高之溫度下聚合,之後藉由各式方法將致孔劑自所得的聚合物珠去除;例如,可藉由蒸餾或溶劑洗滌去除甲苯、二甲苯及(C4 -C10 )烷醇,藉由水洗去除聚烷二醇。之後藉由傳統方法(如脫水後乾燥)分離出所得的大孔共聚物。
可用於製備交聯共聚物之適當的多乙烯基芳香族單體包括,如一種或多種選自二乙烯基苯、三乙烯基苯、二乙烯基甲苯、二乙烯基萘及二乙烯基二甲苯所組成群組之單體;應理解前述每種交聯劑之各式位置異構體之任一種係適當者;或者該多乙烯基芳香族單體為二乙烯基苯。典型地,該交聯共聚物包含1至85%,或者5至55%,再或者10至25%之多乙烯芳香族單體單元。
視需要地,除了多乙烯基芳香族交聯劑,亦可使用非芳香族交聯單體,如乙二醇二丙烯酸酯、乙二醇二甲基丙烯酸酯、三羥甲基丙烷三丙烯酸酯、三羥甲基丙烷三甲基丙烯酸酯、二乙二醇二乙醚及三乙烯基環己烷。當使用時,該非芳香族交聯單體作為聚合單元典型地構成0至10%,或者0至5%,再或者0至2%之大孔聚合物(以用於形成大孔共聚物之總單體重量為基準計)。
可用於製備交聯共聚物之適當的單不飽和乙烯基芳香族單體包括,如苯乙烯、α-甲基苯乙烯、經(C1 -C4 )烷基取代之苯乙烯、經鹵素取代之苯乙烯(如二溴苯乙烯及三溴苯乙烯)、乙烯基萘及乙烯基蒽;或者該單不飽和乙烯基芳香族單體係選自一種或多種苯乙烯及經(C1 -C4 )烷基取代之苯乙烯所組成群組之基團。適當的經(C1 -C4 )烷基取代之苯乙烯包括,如乙基乙烯基苯、乙烯基甲苯、二乙基苯乙烯、乙基甲基苯乙烯及二甲基苯乙烯;應理解前述每一乙烯基芳香族單體之各式位置異構體之任一種係適當者。
或者該共聚物包含15至99%,或者75至90%之單不飽和乙烯基芳香族單體單元。
視需要地,除了乙烯基芳香族單體,亦可使用非芳香族單不飽和乙烯基單體,如脂肪族不飽和單體,如乙烯基氯、丙烯腈、(甲基)丙烯酸及(甲基)丙烯酸烷基酯。當使用時,該非芳香族單不飽和乙烯基單體作為聚合單元典型地構成0至10%,或者0至5%,再或者0至2%之大孔共聚物(以用於形成大孔共聚物之總單體重量為基準計)。
適用於製備大孔共聚物之致孔劑包括疏水性致孔劑,如(C7 -C10 )芳香族烴及(C6 -C12 )飽和烴;以及親水性致孔劑,如(C4 -C10 )烷醇及聚烷二醇。適當的(C7 -C10 )芳香族烴包括,如一種或多種的甲苯、乙基苯、鄰二甲苯、間二甲苯及對二甲苯;應理解前述每一烴之各式位置異構體之任一種係適當者。或者該芳香族烴為甲苯或二甲苯、或二甲苯之混合物、或甲苯與二甲苯之混合物。適當的(C6 -C12 )飽和烴包括,如一種或多種己烷、庚烷及異辛烷;或者該飽和烴為異辛烷。適當的(C4 -C10 )烷醇包括,如一種或多種異丁基醇、第三戊基醇、正戊基醇、異戊基醇、甲基異丁基原醇(4-甲基-2-戊醇)、己醇及辛醇;或者該醇係選自一種或多種(C5 -C8 )烷醇,如甲基異丁基原醇及辛醇。
適用於製備共聚物之聚合反應引發劑包括單體可溶引發劑,如過氧化物、氫過氧化物及相關的引發劑;例如過氧化苯甲醯、第三丁基過氧化氫、過氧化異丙苯(cumene peroxide)、過氧化四氫萘(tetralin peroxide)、過氧化乙醯、過氧化己醯、過辛酸第三丁酯(亦稱為第三丁基過氧化-2-乙基己酸酯)、過辛酸第三戊酯、過苯甲酸第三丁酯、二過鄰苯二甲酸第三丁酯、過氧化二碳酸二環己基酯、過氧化二碳酸二(4-第三丁基環己基)酯及過氧化甲乙酮。亦有用的為偶氮引發劑,如偶氮二異丁腈、偶氮二異丁醯胺、2,2’-偶氮-雙(2,4-二甲基戊腈)、偶氮-雙(α-甲基丁腈)及二甲基-、二乙基-或二丁基-偶氮-雙(甲基戊酸酯)。較佳的過氧化物引發劑為二醯基過氧化物(如過氧化苯甲醯)以及過氧酯(如過辛酸第三丁酯及過苯甲酸第三丁酯);再或者,該引發劑為過氧化苯甲醯。過氧化物引發劑之典型的用量為0.3%至5%,或者0.5至3%,再或者0.7至2%(以乙烯基單體之總重量為基準計)。
或者,該交聯共聚物係選自二乙烯基苯共聚物、苯乙烯-二乙烯基苯共聚物、二乙烯基苯-乙基乙烯基苯共聚物及苯乙烯-乙基乙烯基苯-二乙烯基苯共聚物所組成之群組,該等共聚物係用來作為用於本發明之製程之離子交換樹脂催化劑之基體。
該等交聯共聚物可根據本領域具有通常知識者習知之傳統多磺化反應製程以強酸官能基官能化(如以三氧化硫(SO3 )、發煙硫酸(含有三氧化硫之濃硫酸)及氯磺酸磺化);或者單磺化陽離子交換樹脂聚合物亦可經傳統聚磺化處理而提供陽離子交換樹脂催化劑。
或者該等交聯共聚物可根據本領域具有通常知識者習知之傳統製程以強或弱鹼官能基官能化(如鍵聯至該樹脂之單、二或三烷基胺基)。胺取代基可為1種、2種或3種,而結構可為:-CH3 、-(CH2 )n-CH3 (n>0可自n=1至n=8)、-[(CH2 -CH2 )-O-]p-(CH2 -CH3 )(p>1)、-CH2 -CH2 OH、N-甲基葡糖胺、二伸乙基胺(diethylenamine)、三伸乙基胺(triethylenamine)官能基。
該摻雜有金屬合金之離子交換樹脂催化劑典型地以下述兩種方法之其中一種裝載所欲之金屬合金:a)藉由混合兩種或更多種金屬以於該離子交換聚合物結構中形成合金而於該離子交換聚合物中形成奈米合金,或b)使用離子交換聚合物金屬氧化物奈米複合材料及將金屬合金催化金屬支撐於支撐表面上,再還原。形成合金時金屬之選擇係重要的考慮因素。
典型地,摻雜有金屬合金之離子交換樹脂催化劑藉由使溶液接觸批式或管柱式離子交換樹脂而進行裝載,該溶液具兩種或更多種下列者之組合:金屬鹽或金屬錯合物。作為實施例,該催化劑可包含兩種金屬鹽、或一種金屬鹽以及一種金屬錯合物、或兩種金屬錯合物。此外,金屬合金可呈金屬合金鹽形式提供。於該情況下,再將裝載後的陽離子交換樹脂潤洗而無殘留的鹽或酸。選擇金屬合金鹽的量以使金屬或金屬離子最終的含量為離子交換樹脂之0.1至20%載荷,或者約0.5至10%載荷,再或者約1.0至5.0%載荷,且該含量可藉由傳統分析測試方法測定。
適於用來作為適用於本發明之製程之催化劑的一部分之金屬離子包括,如鈀(Pd)、鉑(Pt)、銠(Rh)、銥(Ir)、釕(Ru)、銅(Cu)、鎳(Ni)、鋅(Zn)、鋁(Al)、金(Au)、鈦(Ti)、釩(V)、鉻(Cr)、錳(Mn)、鐵(Fe)、鈷(Co)、矽(Si)、銀(Ag)、鉛(Pb)、錫(Sn)、鈮(Nb)、鉬(Mo)、汞(Hg)、銻(Sb)、鎢(W)、鉿(Hf)、鎘(Cd)、錫(Sn)、鋯(Zr)、鋨(Os)及砷(As)。本發明涵蓋可將兩種或更多種單獨的金屬或金屬錯合物用於該合金組成物中。例如,合金可為二金屬或三金屬。此外,可將多於3種單獨的金屬或多種金屬之錯合物用於該合金組成物中。本發明之金屬合金之適當的實例包括,但不限於Ni-Pt、Pd-Pt、Ni-Cu、Ni-Ag、Cu-Pd、Cu-Pt、Pd-Ag、Pd-Au、Pt-Au、Pt-Au、Fe-Co、Fe-Ni、Co-Ni、Fe-Ag、Fe-Ag、Co-Ag、Co-Pd、Co-Rh、Co-Pd、Co-Rh、Ni-Rh、Cu-Ru、Fe-Pt、Co-Pt、Fe-Au、Co-Au、W-Au、Ni-Al、Cu-Zn、Ni-Zn、Ni-Pd、Ni-Pt、Pd-Pt、Ni-Au、Cu-Pd、Cu-Pt、Pd-Au、Pt-Au、Co-Ni、Co-Pt、Ru-Pd、Ru-Pt、Rh-Pt、Re-Ir、Mo-Pt、Fe-Zn及Cu-Zn。本發明之特別有用的組合包括,但不限於Pd-Au、Pd-Ag、Fe-Co、Fe-Ni、Fe-Zn、Ni-Cu、Ni-Al、Cu-Cr、Cu-Zn、Ni-Zn及Fe-Cu。
該離子交換樹脂可藉由各式方法裝載金屬合金。一種實例為當例如陽離子交換樹脂裝載金屬合金藉由以下方法實現:使金屬鹽之水溶液通過陽離子交換樹脂之管柱直至所欲水平之金屬合金被樹脂留下,之後以水徹底清洗以去除殘留鹽及裝載製程過程中生成的酸。
於另一實施態樣中,本發明之催化劑使用硼還原樹脂製造。該樹脂之實例係揭示於第4,311,811號美國專利案。將該樹脂與含有兩種或更多種可還原之金屬之溶液接觸。當樹脂與該溶液接觸時,金屬鹽進入樹脂結構並還原為0價金屬合金。裝載於該樹脂之金屬可為以樹脂乾重計0.01%至55%,或者自5至25%,再或者自8至15%。
或者,該催化劑藉由還原含有金屬離子之離子交換樹脂以將金屬合金沈積於催化劑中而製備。於該情況下,裝載金屬之樹脂可藉由將該裝載金屬之樹脂曝露於氫氣(典型地於室溫下使用肼以及低分壓氫氣,如小於1 bar)而進行‘活化’(還原至0價態金屬)。典型的還原反應使用如氫氣、硼氫化鈉、肼、乙二醇作為反應之還原劑。之後可將該樹脂進行熱處理。
或者,活化可於室溫、40℃至200℃,較佳60℃至150℃,最佳80℃至100℃及/或於約2至50 bar氫氣壓下進行。之後,含有還原形式之金屬合金之裝載催化劑可視需要用於催化反應,例如縮合反應。或者,可在剛要用於縮合反應之前將該裝載樹脂(金屬為離子形式)‘活化’成還原金屬形式。如當將Pd、Pt、Rh、Ir或Ru用於該催化劑之金屬合金組份時,可在用於縮合反應之前將該裝載樹脂活化至還原金屬形式。於某些情況中,樹脂裝載催化劑可經碳化。碳化係指催化劑於還原條件下熱解及加熱至600至1000℃的溫渡而得到碳質珠結構。
本發明之催化劑可用於廣泛種類催化反應。該等縮合反應包括,如異構化、水合、醛醇縮合、脫水、氫解、硝酸還原、碳-碳耦合(即Heck及Suzuki反應)、氧化、氫甲醯化及選擇性還原烯烴、酮、醇、芳香族及炔烴反應。
理想地,在反應製程過程中,反應溫度保持於50℃至800℃,或者75℃至600℃,再或者75℃至175℃。壓力保持於1至150 bar,或者20至100 bar,再或者30至80 bar。LHSV(液體時空速)自0.1至20 h-1 ,或者自2至20 h-1 ,再或者自5至20 h-1 。反應系統中反應器構型可為任一種本領域之具有通常知識者熟知之構型。該等構型包括,但不限於填充柱、混合式反應器、連續攪拌反應器(CSTR)、環管反應器以及移動床反應器。此外,它們可為系統中之氣體、液體或氣體及液體之組合之流道。該反應可成批式或連續進行。
作為非限制性實施例,於一實施態樣中,摻雜有金屬合金之磺化樹脂催化劑為容置於容器中之珠子之物理形式,該等珠子形成催化劑床。將酮反應物之饋料流於氫氣(作為單獨的饋料流)之存在下與催化劑床接觸足夠的時間及於使酮之縮合反應發生之溫度。將含有反應產物(飽和酮加成物)、副產物(不飽和酮加成物)及任何可能存在之未反應酮反應物之縮合後之液流自催化劑床分離,藉由傳統分離方法(如蒸餾)將所欲之酮加成物自該液流回收。本領域具有通常知識者有能力選擇適當的條件,如(1)批式操作,例如,其中催化劑床於氫氣之存在下裝載液流,之後,在所欲之反應發生後將液流自催化劑去除,或者(2)更佳的為連續操作,例如,其中將液流連續饋送入管柱反應器之一端(同時饋入氫氣),饋送速度可於催化劑床中提供足夠長的駐留時間以使所欲之反應發生,並且縮合後之液流自該催化劑床之另一端連續地去除。類似地,反應設備、反應物流通過催化劑床之向上流或向下流之選擇、反應時間及溫度、特定的反應物、回收酮加成物之方法基於本發明所提供之指導以及本領域具有通常知識者之可用知識輕易地選擇。
典型地,選擇管柱反應器內部之溫度及壓力以使於催化劑床之酮反應物處於其沸點。酮反應物之溫度/壓力的各式變化係用於提供反應溫度與條件之所欲之組合,從而縮合反應以液相於催化劑床進行。可變化條件以於催化劑床提供氣相條件;然而,較佳地,該等條件可使縮合反應以液相進行。
本發明之摻雜有金屬合金磺化樹脂催化劑可用於縮合反應,其中酮反應物與氫氣於批式反應條件下或於連續反應條件下接觸。於本發明之一實施態樣中,該製程係基於催化蒸餾製程之連續製程,其中緊接於再沸器段上,係將酮反應物引入管柱反應器之底部;於該情況下,自蒸餾設備之再沸器部分連續取回產物餾分或產物流以用於進一步處理(請見第6,008,416號美國專利案,其進一步整體及具體地說明催化蒸餾製程)。或者,將欲進行縮合反應之酮反應物向下饋送入催化劑床,氫氣流以相同方向穿過反應區。然而,可使用引入反應物饋料流之其他變形,如順流及逆流氫氣流、氾流製程及氣相製程。
對於連續製程,正如LHSV(液體時空速)或每單位時間相對於體積之反應物液體流速所示,催化劑相對於反應物之用量典型地與該反應之產出速度有關。典型地,高LHSV理想地用於最大化設備之用途及產物之生成;然而,滿足該目標必須權衡原料之轉化率及對所欲之產物之選擇率。若LHSV太低,則所欲之產物之生產速度(空間產率)減少且該製程可能不經濟。若LHSV太高,則催化劑活性不足以提供所欲水平之轉化(該製程變得“動力學受限”)。適當的LHSV值典型地自0.5至10 h-1 ,或者1至8 h-1 ,再或者自2.5至6 h-1
典型地,酮反應物於催化劑之存在下與氫氣接觸,溫度為110至170℃,氫氣壓力為1至100 bar。用於進行本發明之催化縮合反應之適當的溫度為110至170℃,或者自120至160℃,再或者自130至150℃。通常而言,保持酮反應物與氫氣之反應區之氫氣壓力於1至100 bar,或者5至60 bar,再或者10至40 bar。典型地,縮合反應於0.1至1,或者0.15至0.5之氫氣/酮反應物莫耳比進行。
於本發明之另一實施態樣中,該製程可為批式製程,其中將酮反應物引入至催化性蒸餾設備(與上述設備類似)之反應器管柱之再沸器區段。之後,當酮加成物之所欲之產物組成物於再沸器區實現時,終止該製程。或者縮合反應可於批式壓力釜反應器中進行一段具體時間,再藉由蒸餾或其他傳統方法冷卻及回收所欲之酮加成物。
實施例1
將商業上可獲得自Rohm and Haas Company之50 g強酸陽離子交換樹脂(AmberlystTM 35樹脂)與含有50/50(w/w)鎳及鋅鹽溶液之20 ml溶液混合。在與樹脂混合之前以HNO3 調節該水溶液之pH至1.2。以機械攪拌混合樹脂-液體漿液4小時。4小時後,將剩餘液體排掉並將該樹脂於50℃進行布氏(Buchner)乾燥並於烘箱乾燥24小時。再將樹脂充填入管柱反應器並充入氮氣。充入氮氣之後,以150 ml/min之流速通入氫氣/氬氣(15/85)之氣體混合物,壓力為350 psi且加熱至550℃。將該材料熱解3小時,冷卻至室溫、充入氮氣並包裝用於進一步使用。
實施例2
將30 ml上述催化劑充填入包裝床管柱反應器中。使環己烯與氫氣混合物通過該管柱。氫氣於正常條件下的流速為250 ml/min,環己烯之流速為1 ml/min。用於管柱之壓力為400 psi,溫度為110℃。通過管柱後所得產物達成對環己烯之99%選擇性。

Claims (11)

  1. 一種為凝膠珠或大孔珠形式的催化劑組成物,其中該珠包括離子交換樹脂;且其中該催化劑組成物包括金屬合金。
  2. 如申請專利範圍第1項所述之催化劑組成物,其中,該金屬合金包含至少兩種選自下列之金屬:鈀(Pd)、鉑(Pt)、銠(Rh)、銥(Ir)、釕(Ru)、銅(Cu)、鎳(Ni)、鋅(Zn)、鋁(Al)、金(Au)、鈦(Ti)、釩(V)、鉻(Cr)、錳(Mn)、鐵(Fe)、鈷(Co)、矽(Si)、銀(Ag)、鉛(Pb)、錫(Sn)、鈮(Nb)、鉬(Mo)、汞(Hg)、銻(Sb)、鎢(W)、鉿(Hf)、鎘(Cd)、錫(Sn)、鋯(Zr)、鋨(Os)及砷(As)。
  3. 如申請專利範圍第2項所述之催化劑組成物,其中,該離子交換樹脂係經磺化,且該離子交換樹脂含有該至少兩種金屬。
  4. 如申請專利範圍第2項所述之催化劑組成物,其中,該至少兩種金屬之至少一種為多種金屬之錯合物。
  5. 如申請專利範圍第1項所述之催化劑組成物,其係包含以該催化劑之乾重為基準計之0.1至25%金屬合金。
  6. 如申請專利範圍第1項所述之催化劑組成物,其中,該金屬合金包含1至250nm之金屬簇尺寸。
  7. 如申請專利範圍第1項所述之催化劑組成物,其中,該珠為具有以該催化劑之乾重為基準計之0.1至0.9 cm3 /g之總孔隙率及10至100m2 /g之表面積之大孔珠。
  8. 如申請專利範圍第1項所述之催化劑組成物,其中,該珠為凝膠珠。
  9. 如申請專利範圍第1項所述之催化劑組成物,其中,該珠為具有50至700埃之總孔徑及以該催化劑組成物之乾重為基準計之350至1900m2 /g之表面積之聚合物吸附劑珠。
  10. 如申請專利範圍第1項所述之催化劑組成物,其中,該催化劑組成物被熱解。
  11. 如申請專利範圍第1項所述之催化劑組成物,其中,該離子交換樹脂包括包含1至85%之多乙烯芳香族單體單元之共聚物。
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