TWI422592B - Olefin compounds, epoxy resins, hardened resin compositions and hardened products thereof, LED devices - Google Patents
Olefin compounds, epoxy resins, hardened resin compositions and hardened products thereof, LED devices Download PDFInfo
- Publication number
- TWI422592B TWI422592B TW099110496A TW99110496A TWI422592B TW I422592 B TWI422592 B TW I422592B TW 099110496 A TW099110496 A TW 099110496A TW 99110496 A TW99110496 A TW 99110496A TW I422592 B TWI422592 B TW I422592B
- Authority
- TW
- Taiwan
- Prior art keywords
- parts
- acid
- epoxy resin
- resin composition
- curable resin
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/74—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring
- C07C69/75—Esters of carboxylic acids having an esterified carboxyl group bound to a carbon atom of a ring other than a six-membered aromatic ring of acids with a six-membered ring
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D303/00—Compounds containing three-membered rings having one oxygen atom as the only ring hetero atom
- C07D303/02—Compounds containing oxirane rings
- C07D303/38—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals
- C07D303/40—Compounds containing oxirane rings with hydrocarbon radicals, substituted by carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals by ester radicals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/22—Cyclic ethers having at least one atom other than carbon and hydrogen outside the ring
- C08G65/24—Epihalohydrins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/16—Systems containing only non-condensed rings with a six-membered ring the ring being unsaturated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Epoxy Resins (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009091585 | 2009-04-03 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201036986A TW201036986A (en) | 2010-10-16 |
TWI422592B true TWI422592B (zh) | 2014-01-11 |
Family
ID=42828406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099110496A TWI422592B (zh) | 2009-04-03 | 2010-04-02 | Olefin compounds, epoxy resins, hardened resin compositions and hardened products thereof, LED devices |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5367065B2 (ko) |
KR (1) | KR20120003877A (ko) |
CN (1) | CN102388016B (ko) |
TW (1) | TWI422592B (ko) |
WO (1) | WO2010114122A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102332174B1 (ko) * | 2014-04-15 | 2021-12-01 | 미쯔비시 가스 케미칼 컴파니, 인코포레이티드 | 섬유강화 복합재료 |
JP6724389B2 (ja) * | 2016-01-28 | 2020-07-15 | 東洋インキScホールディングス株式会社 | 圧力容器の製造方法 |
CA3067213A1 (en) * | 2017-06-13 | 2018-12-20 | Arkema, Inc. | Methods for making cyclohexene oxide-containing esters |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200628541A (en) * | 2004-12-16 | 2006-08-16 | Daicel Chem | Thermosetting epoxy resin composition and its use |
WO2007029448A1 (ja) * | 2005-09-02 | 2007-03-15 | Konica Minolta Medical & Graphic, Inc. | 活性光線硬化型インクジェットインク |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3797348B2 (ja) * | 2003-02-24 | 2006-07-19 | コニカミノルタホールディングス株式会社 | 活性エネルギー線硬化組成物 |
JP3852458B2 (ja) * | 2003-04-22 | 2006-11-29 | コニカミノルタエムジー株式会社 | 活性光線硬化型インクジェットインク組成物、活性エネルギー線硬化組成物と、それを用いた画像形成方法、インクジェット記録装置 |
US7244473B2 (en) * | 2003-04-22 | 2007-07-17 | Konica Minolta Medical & Graphic, Inc. | Active ray curable ink-jet composition, image forming method using the same, ink-jet recording apparatus, and triarylsulfonium salt compound |
JP2005029632A (ja) * | 2003-07-09 | 2005-02-03 | Konica Minolta Medical & Graphic Inc | インクジェット用インク組成物、画像形成方法及びエポキシ化合物 |
JP2005263897A (ja) * | 2004-03-17 | 2005-09-29 | Konica Minolta Medical & Graphic Inc | インクジェット用インク組成物及び画像形成方法 |
JP4590997B2 (ja) * | 2004-09-15 | 2010-12-01 | コニカミノルタホールディングス株式会社 | ディスプレイ用基板フィルムおよび有機エレクトロルミネッセンス素子 |
JP5283834B2 (ja) * | 2006-06-29 | 2013-09-04 | 株式会社ダイセル | 脂環式多価エポキシ化合物及びその製造法 |
-
2010
- 2010-04-02 TW TW099110496A patent/TWI422592B/zh not_active IP Right Cessation
- 2010-04-02 JP JP2011507308A patent/JP5367065B2/ja not_active Expired - Fee Related
- 2010-04-02 CN CN2010800160941A patent/CN102388016B/zh not_active Expired - Fee Related
- 2010-04-02 KR KR1020117023121A patent/KR20120003877A/ko not_active Application Discontinuation
- 2010-04-02 WO PCT/JP2010/056074 patent/WO2010114122A1/ja active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200628541A (en) * | 2004-12-16 | 2006-08-16 | Daicel Chem | Thermosetting epoxy resin composition and its use |
WO2007029448A1 (ja) * | 2005-09-02 | 2007-03-15 | Konica Minolta Medical & Graphic, Inc. | 活性光線硬化型インクジェットインク |
Also Published As
Publication number | Publication date |
---|---|
WO2010114122A1 (ja) | 2010-10-07 |
JPWO2010114122A1 (ja) | 2012-10-11 |
KR20120003877A (ko) | 2012-01-11 |
TW201036986A (en) | 2010-10-16 |
CN102388016B (zh) | 2013-11-06 |
JP5367065B2 (ja) | 2013-12-11 |
CN102388016A (zh) | 2012-03-21 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |