TWI421141B - 雷射加工方法與雷射加工裝置以及太陽能電池板製造方法 - Google Patents

雷射加工方法與雷射加工裝置以及太陽能電池板製造方法 Download PDF

Info

Publication number
TWI421141B
TWI421141B TW099144050A TW99144050A TWI421141B TW I421141 B TWI421141 B TW I421141B TW 099144050 A TW099144050 A TW 099144050A TW 99144050 A TW99144050 A TW 99144050A TW I421141 B TWI421141 B TW I421141B
Authority
TW
Taiwan
Prior art keywords
substrate
laser
glass substrate
laser processing
held
Prior art date
Application number
TW099144050A
Other languages
English (en)
Chinese (zh)
Other versions
TW201136693A (en
Inventor
Yuichi Shimoda
Makoto Maruyama
Mitsuyoshi Koizumi
Original Assignee
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Tech Corp filed Critical Hitachi High Tech Corp
Publication of TW201136693A publication Critical patent/TW201136693A/zh
Application granted granted Critical
Publication of TWI421141B publication Critical patent/TWI421141B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)
TW099144050A 2009-12-24 2010-12-15 雷射加工方法與雷射加工裝置以及太陽能電池板製造方法 TWI421141B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009292319A JP2011131229A (ja) 2009-12-24 2009-12-24 レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法

Publications (2)

Publication Number Publication Date
TW201136693A TW201136693A (en) 2011-11-01
TWI421141B true TWI421141B (zh) 2014-01-01

Family

ID=44293687

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099144050A TWI421141B (zh) 2009-12-24 2010-12-15 雷射加工方法與雷射加工裝置以及太陽能電池板製造方法

Country Status (4)

Country Link
JP (1) JP2011131229A (ko)
KR (1) KR101232582B1 (ko)
CN (1) CN102133688A (ko)
TW (1) TWI421141B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701090B (zh) * 2019-01-17 2020-08-11 日月光半導體製造股份有限公司 面板處理設備與方法及多段吸附裝置

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014080442A1 (ja) * 2012-11-21 2014-05-30 オー・エム・シー株式会社 レーザ溶接方法とその装置
JP6444311B2 (ja) * 2013-11-06 2018-12-26 東芝三菱電機産業システム株式会社 電極接合装置および電極接合方法
CN105364250A (zh) * 2015-11-20 2016-03-02 中冶南方（武汉）自动化有限公司 一种自动焊锡系统及其控制方法
CN105397305B (zh) * 2015-11-24 2017-12-12 深圳市海目星激光科技有限公司 一种基于编码器计数的高速高精度极耳切割的方法和设备
JP6987206B2 (ja) * 2017-02-10 2021-12-22 東京エレクトロン株式会社 塗布装置、および塗布方法
JP6805017B2 (ja) * 2017-02-10 2020-12-23 東京エレクトロン株式会社 塗布装置、および塗布方法
CN108649103B (zh) * 2018-05-16 2019-11-01 江苏悦阳光伏科技有限公司 一种非晶硅太阳能电池生产工艺
KR20230003090A (ko) * 2020-07-01 2023-01-05 주식회사 히타치하이테크 반송 용기 및 반송 방법

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11785A (ja) * 1997-06-11 1999-01-06 Matsushita Electric Ind Co Ltd レーザー加工機の被加工物位置決め装置
JP2004111793A (ja) * 2002-09-20 2004-04-08 Renesas Technology Corp レーザーマーキング装置及び方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090330A (en) * 1997-02-06 2000-07-18 Matsushita Electric Industrial Co., Ltd. Laser processing method
JP3711189B2 (ja) * 1997-05-23 2005-10-26 大日本スクリーン製造株式会社 基板搬送装置
US6547121B2 (en) 2000-06-28 2003-04-15 Advanced Micro Devices, Inc. Mechanical clamper for heated substrates at die attach
JP4170201B2 (ja) * 2003-12-01 2008-10-22 日立ビアメカニクス株式会社 基板加工装置
JP4884370B2 (ja) * 2005-02-23 2012-02-29 東レエンジニアリング株式会社 脆性材料製板切断方法およびその装置
JP4815444B2 (ja) * 2005-08-12 2011-11-16 芝浦メカトロニクス株式会社 脆性材料の割断加工システム及びその方法
WO2007037118A1 (ja) * 2005-09-28 2007-04-05 Shibaura Mechatronics Corporation 脆性材料のレーザ割断装置、レーザ割断システム及びその方法
JP4675786B2 (ja) * 2006-01-20 2011-04-27 株式会社東芝 レーザー割断装置、割断方法
JP2007246298A (ja) * 2006-03-13 2007-09-27 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
JP4231538B1 (ja) * 2007-12-12 2009-03-04 株式会社片岡製作所 レーザ加工機
JP2009147240A (ja) 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
CN201338159Y (zh) * 2008-08-28 2009-11-04 孙红安 激光切割机的焦距自动跟踪调节装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11785A (ja) * 1997-06-11 1999-01-06 Matsushita Electric Ind Co Ltd レーザー加工機の被加工物位置決め装置
JP2004111793A (ja) * 2002-09-20 2004-04-08 Renesas Technology Corp レーザーマーキング装置及び方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI701090B (zh) * 2019-01-17 2020-08-11 日月光半導體製造股份有限公司 面板處理設備與方法及多段吸附裝置

Also Published As

Publication number Publication date
JP2011131229A (ja) 2011-07-07
KR101232582B1 (ko) 2013-02-12
TW201136693A (en) 2011-11-01
CN102133688A (zh) 2011-07-27
KR20110074438A (ko) 2011-06-30

Similar Documents

Publication Publication Date Title
TWI421141B (zh) 雷射加工方法與雷射加工裝置以及太陽能電池板製造方法
JP2011156574A (ja) レーザ加工用フォーカス装置、レーザ加工装置及びソーラパネル製造方法
KR101211104B1 (ko) 레이저 가공 방법 및 레이저 가공 장치
EP3316039B1 (en) Wafer alignment method and apparatus for overlay measurement
JP2008203280A (ja) 欠陥検査装置
KR101454823B1 (ko) 외관 검사 장치
KR20070058354A (ko) 반도체 웨이퍼의 위치 결정 방법 및 이것을 이용한 장치
TWI414384B (zh) 雷射加工方法、雷射加工裝置及太陽電池板製造方法
WO2014027375A1 (ja) 板ガラスの検査ユニット及び製造設備
KR20160010386A (ko) 표면 결함 검사 장치
TWI381899B (zh) 雷射加工方法、雷射加工裝置以及太陽能面板製造方法
JP2011177771A (ja) レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法
JP5268749B2 (ja) 基板状態検査方法及びレーザ加工装置並びにソーラパネル製造方法
JP2011177770A (ja) レーザ加工システム及びソーラパネル製造方法
JP5349352B2 (ja) レーザ光状態検査方法及び装置、レーザ加工方法及び装置並びにソーラパネル製造方法
JPH11264803A (ja) 透明板状体の欠陥検出方法および装置
JP5371514B2 (ja) レーザ光状態検査方法及び装置並びにソーラパネル製造方法
JP5383365B2 (ja) レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法
JP4224268B2 (ja) 電子回路部品装着機、ならびにそれの装着位置精度検査方法および装置
JP5371534B2 (ja) レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
TWI699624B (zh) 基板處理裝置及元件製造方法
JP2011161492A (ja) レーザ加工状態検査方法及び装置レーザ加工方法及び装置並びにソーラパネル製造方法
JP2014072268A (ja) ソーラパネルの製造方法、およびソーラパネル製造装置
KR101533826B1 (ko) 표면 결함 검사 장치
JP2011067865A (ja) レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees