JP2011131229A - レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法 - Google Patents

レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法 Download PDF

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Publication number
JP2011131229A
JP2011131229A JP2009292319A JP2009292319A JP2011131229A JP 2011131229 A JP2011131229 A JP 2011131229A JP 2009292319 A JP2009292319 A JP 2009292319A JP 2009292319 A JP2009292319 A JP 2009292319A JP 2011131229 A JP2011131229 A JP 2011131229A
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JP
Japan
Prior art keywords
substrate
glass substrate
laser processing
laser
held
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009292319A
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English (en)
Japanese (ja)
Inventor
Yuichi Shimoda
勇一 下田
Makoto Maruyama
誠 丸山
Mitsuyoshi Koizumi
光義 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi High Tech Corp
Original Assignee
Hitachi High Technologies Corp
Hitachi High Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi High Technologies Corp, Hitachi High Tech Corp filed Critical Hitachi High Technologies Corp
Priority to JP2009292319A priority Critical patent/JP2011131229A/ja
Priority to KR1020100125970A priority patent/KR101232582B1/ko
Priority to TW099144050A priority patent/TWI421141B/zh
Priority to CN2010106008687A priority patent/CN102133688A/zh
Publication of JP2011131229A publication Critical patent/JP2011131229A/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)
JP2009292319A 2009-12-24 2009-12-24 レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法 Pending JP2011131229A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009292319A JP2011131229A (ja) 2009-12-24 2009-12-24 レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法
KR1020100125970A KR101232582B1 (ko) 2009-12-24 2010-12-10 레이저 가공 방법, 레이저 가공 장치 및 솔라 패널의 제조 방법
TW099144050A TWI421141B (zh) 2009-12-24 2010-12-15 雷射加工方法與雷射加工裝置以及太陽能電池板製造方法
CN2010106008687A CN102133688A (zh) 2009-12-24 2010-12-17 激光加工方法与激光加工装置以及太阳能电池板制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009292319A JP2011131229A (ja) 2009-12-24 2009-12-24 レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法

Publications (1)

Publication Number Publication Date
JP2011131229A true JP2011131229A (ja) 2011-07-07

Family

ID=44293687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009292319A Pending JP2011131229A (ja) 2009-12-24 2009-12-24 レーザ加工方法及びレーザ加工装置並びにソーラパネル製造方法

Country Status (4)

Country Link
JP (1) JP2011131229A (ko)
KR (1) KR101232582B1 (ko)
CN (1) CN102133688A (ko)
TW (1) TWI421141B (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014080442A1 (ja) * 2012-11-21 2014-05-30 オー・エム・シー株式会社 レーザ溶接方法とその装置
CN105364250A (zh) * 2015-11-20 2016-03-02 中冶南方（武汉）自动化有限公司 一种自动焊锡系统及其控制方法
CN105397305A (zh) * 2015-11-24 2016-03-16 深圳市海目星激光科技有限公司 一种基于编码器计数的高速高精度极耳切割的方法和设备
JP2018126717A (ja) * 2017-02-10 2018-08-16 東京エレクトロン株式会社 塗布装置、および塗布方法
JP2021045750A (ja) * 2017-02-10 2021-03-25 東京エレクトロン株式会社 塗布装置、および塗布方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102150219B1 (ko) * 2013-11-06 2020-09-01 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 전극 접합 장치 및 전극 접합 방법
CN108649103B (zh) * 2018-05-16 2019-11-01 江苏悦阳光伏科技有限公司 一种非晶硅太阳能电池生产工艺
TWI701090B (zh) * 2019-01-17 2020-08-11 日月光半導體製造股份有限公司 面板處理設備與方法及多段吸附裝置
EP4177182A4 (en) * 2020-07-01 2024-02-28 Hitachi High Tech Corp TRANSPORT CONTAINER AND TRANSPORT METHOD

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007020835A1 (ja) * 2005-08-12 2007-02-22 Shibaura Mechatronics Corporation 脆性材料の割断加工システム及びその方法
WO2007037118A1 (ja) * 2005-09-28 2007-04-05 Shibaura Mechatronics Corporation 脆性材料のレーザ割断装置、レーザ割断システム及びその方法
JP2007246298A (ja) * 2006-03-13 2007-09-27 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
WO2009075137A1 (ja) * 2007-12-12 2009-06-18 Kataoka Corporation レーザ加工機

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090330A (en) * 1997-02-06 2000-07-18 Matsushita Electric Industrial Co., Ltd. Laser processing method
JP3711189B2 (ja) * 1997-05-23 2005-10-26 大日本スクリーン製造株式会社 基板搬送装置
JP3727441B2 (ja) * 1997-06-11 2005-12-14 松下電器産業株式会社 レーザー加工機の被加工物位置決め装置
US6547121B2 (en) 2000-06-28 2003-04-15 Advanced Micro Devices, Inc. Mechanical clamper for heated substrates at die attach
JP2004111793A (ja) * 2002-09-20 2004-04-08 Renesas Technology Corp レーザーマーキング装置及び方法
JP4170201B2 (ja) * 2003-12-01 2008-10-22 日立ビアメカニクス株式会社 基板加工装置
WO2006090632A1 (ja) * 2005-02-23 2006-08-31 Toray Engineering Co., Ltd. 脆性材料製板切断方法およびその装置
JP4675786B2 (ja) * 2006-01-20 2011-04-27 株式会社東芝 レーザー割断装置、割断方法
JP2009147240A (ja) 2007-12-18 2009-07-02 Dainippon Printing Co Ltd 基板支持装置、基板支持方法、基板加工装置、基板加工方法、表示装置構成部材の製造方法
CN201338159Y (zh) * 2008-08-28 2009-11-04 孙红安 激光切割机的焦距自动跟踪调节装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007020835A1 (ja) * 2005-08-12 2007-02-22 Shibaura Mechatronics Corporation 脆性材料の割断加工システム及びその方法
WO2007037118A1 (ja) * 2005-09-28 2007-04-05 Shibaura Mechatronics Corporation 脆性材料のレーザ割断装置、レーザ割断システム及びその方法
JP2007246298A (ja) * 2006-03-13 2007-09-27 Shibuya Kogyo Co Ltd 脆性材料の割断方法とその装置
WO2009075137A1 (ja) * 2007-12-12 2009-06-18 Kataoka Corporation レーザ加工機

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014080442A1 (ja) * 2012-11-21 2014-05-30 オー・エム・シー株式会社 レーザ溶接方法とその装置
JPWO2014080442A1 (ja) * 2012-11-21 2017-01-05 オー・エム・シー株式会社 レーザ溶接方法とその装置
CN105364250A (zh) * 2015-11-20 2016-03-02 中冶南方（武汉）自动化有限公司 一种自动焊锡系统及其控制方法
CN105397305A (zh) * 2015-11-24 2016-03-16 深圳市海目星激光科技有限公司 一种基于编码器计数的高速高精度极耳切割的方法和设备
JP2018126717A (ja) * 2017-02-10 2018-08-16 東京エレクトロン株式会社 塗布装置、および塗布方法
JP2021045750A (ja) * 2017-02-10 2021-03-25 東京エレクトロン株式会社 塗布装置、および塗布方法

Also Published As

Publication number Publication date
TW201136693A (en) 2011-11-01
CN102133688A (zh) 2011-07-27
TWI421141B (zh) 2014-01-01
KR101232582B1 (ko) 2013-02-12
KR20110074438A (ko) 2011-06-30

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