TWI419303B - 光電半導體組件及顯示裝置 - Google Patents
光電半導體組件及顯示裝置 Download PDFInfo
- Publication number
- TWI419303B TWI419303B TW099108085A TW99108085A TWI419303B TW I419303 B TWI419303 B TW I419303B TW 099108085 A TW099108085 A TW 099108085A TW 99108085 A TW99108085 A TW 99108085A TW I419303 B TWI419303 B TW I419303B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor component
- lens body
- optoelectronic semiconductor
- radiation
- lens
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/13—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H10H20/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009015313.6A DE102009015313B4 (de) | 2009-03-27 | 2009-03-27 | Anzeigeeinrichtung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201104829A TW201104829A (en) | 2011-02-01 |
| TWI419303B true TWI419303B (zh) | 2013-12-11 |
Family
ID=42315698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099108085A TWI419303B (zh) | 2009-03-27 | 2010-03-19 | 光電半導體組件及顯示裝置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8698385B2 (enExample) |
| EP (1) | EP2412022B1 (enExample) |
| JP (1) | JP5744001B2 (enExample) |
| KR (1) | KR101683934B1 (enExample) |
| CN (1) | CN102365739B (enExample) |
| DE (1) | DE102009015313B4 (enExample) |
| TW (1) | TWI419303B (enExample) |
| WO (1) | WO2010108761A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011013052A1 (de) * | 2011-03-04 | 2012-09-06 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauelements |
| WO2012146316A1 (en) * | 2011-04-27 | 2012-11-01 | Lux Et Libertas B.V. | Led module for a display |
| DE102011107895B4 (de) | 2011-07-18 | 2020-11-05 | Heraeus Noblelight Gmbh | Optoelektronisches Modul mit Linsensystem |
| DE102011114641B4 (de) * | 2011-09-30 | 2021-08-12 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements |
| CN104040716B (zh) * | 2012-01-17 | 2018-06-22 | 亮锐控股有限公司 | 以大角度发射光的半导体发光器件灯 |
| JP6553143B2 (ja) * | 2012-05-09 | 2019-07-31 | ローム株式会社 | 半導体発光装置 |
| CN103791252B (zh) * | 2012-10-30 | 2017-05-03 | 欧司朗股份有限公司 | 发光模块和包括该发光模块的照明装置和灯箱 |
| DE102012110403A1 (de) | 2012-10-30 | 2014-04-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US9470395B2 (en) | 2013-03-15 | 2016-10-18 | Abl Ip Holding Llc | Optic for a light source |
| CA2911523C (en) | 2013-05-10 | 2018-10-02 | Abl Ip Holding Llc | Silicone optics |
| US9625119B2 (en) * | 2014-07-31 | 2017-04-18 | Excelitas Canada, Inc. | Non-uniform lens array for illumination profile modification |
| DE102014112681A1 (de) | 2014-09-03 | 2016-03-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil und Blitzlicht |
| DE102015112042B4 (de) | 2015-07-23 | 2021-07-01 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Leuchtvorrichtung |
| US10930828B2 (en) * | 2016-09-27 | 2021-02-23 | Lumileds Llc | Non-rotationally symmetric lens for non-rotationally symmetric light source resulting in rotationally symmetric beam pattern |
| EP3796063B1 (en) * | 2019-09-17 | 2022-10-26 | Axis AB | Lens member for a lens arrangement of a camera device |
| CN115966561A (zh) | 2021-09-30 | 2023-04-14 | 日亚化学工业株式会社 | 发光装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060066218A1 (en) * | 2004-09-27 | 2006-03-30 | Enplas Corporation | Emission device, surface light source device, display and light flux control member |
| TWI287117B (en) * | 2006-05-25 | 2007-09-21 | Ind Tech Res Inst | Light guide lens and light emitting diode package structure having the light guide lens |
| TW200817636A (en) * | 2006-10-04 | 2008-04-16 | Osram Opto Semiconductors Gmbh | Optical element for light-emitting diode, light-emitting diode, LED arrangement and method for manufacturing LED arrangement |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5803579A (en) | 1996-06-13 | 1998-09-08 | Gentex Corporation | Illuminator assembly incorporating light emitting diodes |
| JP3399266B2 (ja) | 1996-12-13 | 2003-04-21 | 豊田合成株式会社 | 全色発光型発光ダイオードランプ |
| JP3292133B2 (ja) | 1997-04-14 | 2002-06-17 | 日亜化学工業株式会社 | Led表示器及びそれを用いた表示装置 |
| US7302181B2 (en) | 2003-02-25 | 2007-11-27 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Single lens multiple light source device |
| US20050062396A1 (en) | 2003-04-24 | 2005-03-24 | Heston Yang | Multi-hooded pixel |
| US7066623B2 (en) | 2003-12-19 | 2006-06-27 | Soo Ghee Lee | Method and apparatus for producing untainted white light using off-white light emitting diodes |
| GB0409877D0 (en) * | 2004-04-30 | 2004-06-09 | Univ Manchester | Preparation of nanoparticle materials |
| US7352011B2 (en) | 2004-11-15 | 2008-04-01 | Philips Lumileds Lighting Company, Llc | Wide emitting lens for LED useful for backlighting |
| JP2007080526A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
| US20070102718A1 (en) | 2005-11-07 | 2007-05-10 | Akira Takekuma | Lens in light emitting device |
| US7832878B2 (en) * | 2006-03-06 | 2010-11-16 | Innovations In Optics, Inc. | Light emitting diode projection system |
| DE102006050880A1 (de) | 2006-06-30 | 2008-04-17 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauteil und Beleuchtungseinrichtung |
| DE102006046233A1 (de) | 2006-09-26 | 2008-04-03 | Iav Gmbh Ingenieurgesellschaft Auto Und Verkehr | Verfahren und Vorrichtung zum Betrieb einer Verbrennungskraftmaschine |
| JP2008123847A (ja) | 2006-11-13 | 2008-05-29 | Sony Corp | 面状光源装置及び液晶表示装置組立体 |
| US8540922B2 (en) * | 2007-08-27 | 2013-09-24 | Hewlett-Packard Development Company, L.P. | Laser patterning of a carbon nanotube layer |
| DE102008007723A1 (de) | 2008-02-06 | 2009-08-20 | Osram Gesellschaft mit beschränkter Haftung | Beleuchtungsmodul, Leuchte und Verfahren zur Beleuchtung |
-
2009
- 2009-03-27 DE DE102009015313.6A patent/DE102009015313B4/de not_active Expired - Fee Related
-
2010
- 2010-03-01 JP JP2012501223A patent/JP5744001B2/ja not_active Expired - Fee Related
- 2010-03-01 EP EP10706229.1A patent/EP2412022B1/de not_active Not-in-force
- 2010-03-01 KR KR1020117025265A patent/KR101683934B1/ko not_active Expired - Fee Related
- 2010-03-01 CN CN201080015254.0A patent/CN102365739B/zh not_active Expired - Fee Related
- 2010-03-01 WO PCT/EP2010/052564 patent/WO2010108761A1/de not_active Ceased
- 2010-03-01 US US13/202,252 patent/US8698385B2/en active Active
- 2010-03-19 TW TW099108085A patent/TWI419303B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060066218A1 (en) * | 2004-09-27 | 2006-03-30 | Enplas Corporation | Emission device, surface light source device, display and light flux control member |
| TWI287117B (en) * | 2006-05-25 | 2007-09-21 | Ind Tech Res Inst | Light guide lens and light emitting diode package structure having the light guide lens |
| TW200817636A (en) * | 2006-10-04 | 2008-04-16 | Osram Opto Semiconductors Gmbh | Optical element for light-emitting diode, light-emitting diode, LED arrangement and method for manufacturing LED arrangement |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20110137380A (ko) | 2011-12-22 |
| KR101683934B1 (ko) | 2016-12-07 |
| EP2412022A1 (de) | 2012-02-01 |
| US8698385B2 (en) | 2014-04-15 |
| CN102365739A (zh) | 2012-02-29 |
| DE102009015313B4 (de) | 2022-02-24 |
| JP2012522359A (ja) | 2012-09-20 |
| JP5744001B2 (ja) | 2015-07-01 |
| WO2010108761A1 (de) | 2010-09-30 |
| EP2412022B1 (de) | 2018-11-21 |
| TW201104829A (en) | 2011-02-01 |
| US20120001208A1 (en) | 2012-01-05 |
| CN102365739B (zh) | 2014-02-12 |
| DE102009015313A1 (de) | 2010-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI419303B (zh) | 光電半導體組件及顯示裝置 | |
| KR101563378B1 (ko) | 광 부품 및 조명 장치 | |
| JP6265796B2 (ja) | 発光モジュール | |
| US11275237B2 (en) | Apparatus for presenting an image | |
| JP6025309B2 (ja) | 光源装置および液晶表示装置 | |
| US8564004B2 (en) | Complex primary optics with intermediate elements | |
| KR101039881B1 (ko) | 발광소자 및 그를 이용한 라이트 유닛 | |
| CN110119031B (zh) | 立体显示装置以及空中立体显示装置 | |
| JP2009542017A5 (enExample) | ||
| US20120217519A1 (en) | Method and structure for encapsulating solid-state light emitting chip and light sources using the encapsulation structure | |
| JP2009506559A (ja) | 発光モジュールたとえば光学式投影装置において使用するための発光モジュールおよび光学式投影装置 | |
| JP2017139464A (ja) | 発光素子及びその製造方法 | |
| KR20180132018A (ko) | 빔 성형 구조를 가진 발광 디바이스 및 그 제조 방법 | |
| US20170229621A1 (en) | Light emitting device with beam shaping structure and manufacturing method of the same | |
| US7482633B2 (en) | Multi-source optical transmitter and photonic visualization device | |
| US11152423B2 (en) | Optical assembly and display device comprising an arrangement of luminescence diode chips | |
| TWI442538B (zh) | 發光媒體 | |
| US9465143B2 (en) | Lens optical element and display apparatus | |
| KR20070102089A (ko) | 발광 소자 모듈 및 그 제조 방법 | |
| JP7259038B2 (ja) | オプトエレクトロニクス照明装置および製造方法 | |
| JP7049599B2 (ja) | 表示装置 | |
| CN216818374U (zh) | 一种显示装置及显示器 | |
| CN115188779B (zh) | 一种cmos图像芯片、相机及其调试方法 | |
| US8040040B2 (en) | Light source and method of providing a bundle of light | |
| JP2025020099A (ja) | マイクロled表示デバイス |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |