JP7259038B2 - オプトエレクトロニクス照明装置および製造方法 - Google Patents
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Description
2 ピクセル
3 透明または半透明のキャリア基板
4 半導体照明装置
5.1~5.3 マイクロLED
6 主要放射方向
7 観察方向
8 ビーム変形要素
9.1,9.2 マイクロ光学系
10 プリズムプロファイル
11 フリーフォームコーン
12 接着剤層
13 ディフューザ
14 後方散乱性面要素
15 反射層
16.n 散乱粒子
20 共通のビーム変形要素
22 偏光子およびλ/4板で構成される層構造体
23.1,23.2 スペーサ
23.3 スペーサ
24.1,24.2 反射率の低いコーティング
25 導光要素
26 光アイソレータ
27.1,27.2 組み合わせられた屈折反射マイクロ光学系
28 ナノオプティクス導波体
Claims (14)
- オプトエレクトロニクス照明装置であって、
透明または半透明のキャリア基板(3)を備えるピクセル(2)を含んでおり、前記透明または半透明のキャリア基板(3)上に、前記ピクセル(2)の部分面にわたって延在している少なくとも1つのマイクロLED(5.1,5.2,5.3)を備える半導体照明装置(4)が配置されており、
前記半導体照明装置(4)の主要放射方向(6)は、観察方向(7)において、前記透明または半透明のキャリア基板(3)の後方に配置されている、後方散乱性面要素(14)に向けられており、
前記半導体照明装置(4)はビーム変形要素(8)を含んでおり、
ピクセルマイクロ制御ユニットが、前記透明または半透明のキャリア基板(3)上に配置されるとともに、前記ピクセル(2)の部分面にわたって延在しており、
前記ピクセルマイクロ制御ユニットと前記マイクロLED(5.1,5.2,5.3)との間の制御線路は、透明または半透明の材料で構成されている、
オプトエレクトロニクス照明装置。 - 前記マイクロLED(5.1,5.2,5.3)は垂直放射型に構成されており、かつ/または前記ビーム変形要素(8)は、前記半導体照明装置(4)の発散を増大させるマイクロ光学系(9.1,9.2)を含んでいる、請求項1記載のオプトエレクトロニクス照明装置。
- 前記マイクロ光学系(9.1,9.2)は、プリズムプロファイル(10)および/またはフリーフォームコーン(11)および/またはレンズレットアレイを含んでいる、請求項2記載のオプトエレクトロニクス照明装置。
- 前記マイクロLED(5.1,5.2,5.3)は側面放射型に構成されており、かつ/または前記ビーム変形要素(8)は、組み合わせられた屈折反射マイクロ光学系(27.1,27.2)を含んでいる、請求項1記載のオプトエレクトロニクス照明装置。
- 前記ビーム変形要素(8)は表面に散乱粒子(16.n)を有している、請求項1から4までのいずれか1項記載のオプトエレクトロニクス照明装置。
- 前記半導体照明装置(4)はディフューザ(13)および/または波長変換器を含んでいる、請求項1から5までのいずれか1項記載のオプトエレクトロニクス照明装置。
- 前記半導体照明装置(4)は、異なる放射スペクトルを有する複数のマイクロLED(5.1,5.2,5.3)および/またはスペクトル的に異なる、割り当てられた波長変換器を含んでいる、請求項1から6までの少なくとも1項記載のオプトエレクトロニクス照明装置。
- 前記半導体照明装置(4)内の複数の前記マイクロLED(5.1,5.2,5.3)に、共通のビーム変形要素(8)が割り当てられている、請求項7記載のオプトエレクトロニクス照明装置。
- 前記半導体照明装置(4)内の少なくとも1つのマイクロLED(5.1,5.2,5.3)、有利には各マイクロLED(5.1,5.2,5.3)に、別個のビーム変形要素が割り当てられている、請求項7記載のオプトエレクトロニクス照明装置。
- 前記後方散乱性面要素(14)は平坦な表面を有しており、かつ/または特にスペクトル放射を一様化するために、反射率の低いコーティング(24.1,24.2)が、前記後方散乱性面要素(14)の、スペクトル的に不均一に照明され得る部分領域上に設けられている、請求項1から9までの少なくとも1項記載のオプトエレクトロニクス照明装置。
- 前記後方散乱性面要素(14)は、拡散散乱性に構成されている、請求項1から10までの少なくとも1項記載のオプトエレクトロニクス照明装置。
- 前記後方散乱性面要素(14)は、指向性反射性に構成されており、前記透明または半透明のキャリア基板(3)上に、偏光子とλ/4板とを備える層構造体(22)が配置されている、請求項1から11までの少なくとも1項記載のオプトエレクトロニクス照明装置。
- オプトエレクトロニクス照明装置であって、
透明または半透明のキャリア基板(3)を備えるピクセル(2)を含んでおり、前記透明または半透明のキャリア基板(3)上に、前記ピクセル(2)の部分面にわたって延在している少なくとも1つのマイクロLED(5.1,5.2,5.3)を備える半導体照明装置(4)が配置されており、
前記半導体照明装置(4)の主要放射方向(6)は、観察方向(7)において、前記透明または半透明のキャリア基板(3)の後方に配置されている、後方散乱性面要素(14)に向けられており、
特に請求項1から12までの少なくとも1項記載の照明装置であって、
前記透明または半透明のキャリア基板(3)と前記後方散乱性面要素(14)との間にスペーサ(23.1)が配置されており、前記スペーサ(23.1)は、付加的に、隣接するピクセルに対する光アイソレータとして機能する、
オプトエレクトロニクス照明装置。 - 請求項1から13までの少なくとも1項記載のオプトエレクトロニクス照明装置の製造方法であって、
透明または半透明のキャリア基板(3)上に、ピクセルマイクロ制御ユニットと、ピクセル(2)を形成するための、前記ピクセルマイクロ制御ユニットから始まる制御線路とを設け、
少なくとも1つのマイクロLED(5.1,5.2,5.3)と少なくとも1つのビーム変形要素(8)とを結合して、半導体照明装置(4)を形成し、前記半導体照明装置(4)を、前記透明または半透明のキャリア基板(3)上に固定し、前記制御線路と電気的に接触接続させ、前記半導体照明装置(4)は前記ピクセル(2)の部分面にわたって延在しており、
スペーサ(23.1,23.2)を前記透明または半透明のキャリア基板(3)上に配置し、
後方散乱性面要素(14)が、観察方向(7)において、前記透明のキャリア基板(3)の後方に配置されており、前記半導体照明装置(4)の主要放射方向(6)が前記後方散乱性面要素(14)の方を向いているように、後続の製造ステップにおいて、実装された、前記透明または半透明のキャリア基板(3)を前記後方散乱性面要素(14)と結合する、
オプトエレクトロニクス照明装置の製造方法。
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DE102018132542.8 | 2018-12-17 | ||
PCT/EP2019/085639 WO2020127257A1 (de) | 2018-12-17 | 2019-12-17 | Optoelektronische leuchtvorrichtung und herstellungsverfahren |
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