CN102365739B - 光电子半导体器件和显示装置 - Google Patents

光电子半导体器件和显示装置 Download PDF

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Publication number
CN102365739B
CN102365739B CN201080015254.0A CN201080015254A CN102365739B CN 102365739 B CN102365739 B CN 102365739B CN 201080015254 A CN201080015254 A CN 201080015254A CN 102365739 B CN102365739 B CN 102365739B
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CN
China
Prior art keywords
radiation
opto
electronic semiconductor
semiconductor module
lenticular body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CN201080015254.0A
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English (en)
Chinese (zh)
Other versions
CN102365739A (zh
Inventor
P.布里克
M.维特曼
S.韦伯-拉布西尔伯
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Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
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Publication date
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Publication of CN102365739A publication Critical patent/CN102365739A/zh
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Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/13—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H10H20/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201080015254.0A 2009-03-27 2010-03-01 光电子半导体器件和显示装置 Expired - Fee Related CN102365739B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009015313.6A DE102009015313B4 (de) 2009-03-27 2009-03-27 Anzeigeeinrichtung
DE102009015313.6 2009-03-27
PCT/EP2010/052564 WO2010108761A1 (de) 2009-03-27 2010-03-01 Optoelektronisches halbleiterbauteil und anzeigeeinrichtung

Publications (2)

Publication Number Publication Date
CN102365739A CN102365739A (zh) 2012-02-29
CN102365739B true CN102365739B (zh) 2014-02-12

Family

ID=42315698

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080015254.0A Expired - Fee Related CN102365739B (zh) 2009-03-27 2010-03-01 光电子半导体器件和显示装置

Country Status (8)

Country Link
US (1) US8698385B2 (enExample)
EP (1) EP2412022B1 (enExample)
JP (1) JP5744001B2 (enExample)
KR (1) KR101683934B1 (enExample)
CN (1) CN102365739B (enExample)
DE (1) DE102009015313B4 (enExample)
TW (1) TWI419303B (enExample)
WO (1) WO2010108761A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011013052A1 (de) * 2011-03-04 2012-09-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauelements
WO2012146316A1 (en) * 2011-04-27 2012-11-01 Lux Et Libertas B.V. Led module for a display
DE102011107895B4 (de) 2011-07-18 2020-11-05 Heraeus Noblelight Gmbh Optoelektronisches Modul mit Linsensystem
DE102011114641B4 (de) * 2011-09-30 2021-08-12 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
CN104040716B (zh) * 2012-01-17 2018-06-22 亮锐控股有限公司 以大角度发射光的半导体发光器件灯
JP6553143B2 (ja) * 2012-05-09 2019-07-31 ローム株式会社 半導体発光装置
CN103791252B (zh) * 2012-10-30 2017-05-03 欧司朗股份有限公司 发光模块和包括该发光模块的照明装置和灯箱
DE102012110403A1 (de) 2012-10-30 2014-04-30 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
US9625119B2 (en) * 2014-07-31 2017-04-18 Excelitas Canada, Inc. Non-uniform lens array for illumination profile modification
DE102014112681A1 (de) 2014-09-03 2016-03-03 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Blitzlicht
DE102015112042B4 (de) 2015-07-23 2021-07-01 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische Leuchtvorrichtung
US10930828B2 (en) * 2016-09-27 2021-02-23 Lumileds Llc Non-rotationally symmetric lens for non-rotationally symmetric light source resulting in rotationally symmetric beam pattern
EP3796063B1 (en) * 2019-09-17 2022-10-26 Axis AB Lens member for a lens arrangement of a camera device
CN115966561A (zh) 2021-09-30 2023-04-14 日亚化学工业株式会社 发光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6523976B1 (en) * 1996-06-13 2003-02-25 Gentex Corporation Led assembly
EP1641052A2 (en) * 2004-09-27 2006-03-29 Enplas Corporation Emission device, surface light source device, display and light flux control member
US20070206390A1 (en) * 2006-03-06 2007-09-06 Brukilacchio Thomas J Light emitting diode projection system
US20070273984A1 (en) * 2006-05-25 2007-11-29 Industrial Technology Research Institute Light Guide Lens and Light Emitting Diode Package Structure having the Light Guide Lens
DE102006047233A1 (de) * 2006-10-04 2008-04-10 Osram Opto Semiconductors Gmbh Optisches Element für eine Leuchtdiode, Leuchtdiode, LED-Anordnung und Verfahren zur Herstellung einer LED-Anordnung

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3399266B2 (ja) 1996-12-13 2003-04-21 豊田合成株式会社 全色発光型発光ダイオードランプ
JP3292133B2 (ja) 1997-04-14 2002-06-17 日亜化学工業株式会社 Ｌｅｄ表示器及びそれを用いた表示装置
US7302181B2 (en) 2003-02-25 2007-11-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Single lens multiple light source device
US20050062396A1 (en) 2003-04-24 2005-03-24 Heston Yang Multi-hooded pixel
US7066623B2 (en) 2003-12-19 2006-06-27 Soo Ghee Lee Method and apparatus for producing untainted white light using off-white light emitting diodes
GB0409877D0 (en) * 2004-04-30 2004-06-09 Univ Manchester Preparation of nanoparticle materials
US7352011B2 (en) 2004-11-15 2008-04-01 Philips Lumileds Lighting Company, Llc Wide emitting lens for LED useful for backlighting
JP2007080526A (ja) * 2005-09-09 2007-03-29 Matsushita Electric Works Ltd 発光装置
US20070102718A1 (en) 2005-11-07 2007-05-10 Akira Takekuma Lens in light emitting device
DE102006050880A1 (de) 2006-06-30 2008-04-17 Osram Opto Semiconductors Gmbh Optoelektronisches Bauteil und Beleuchtungseinrichtung
DE102006046233A1 (de) 2006-09-26 2008-04-03 Iav Gmbh Ingenieurgesellschaft Auto Und Verkehr Verfahren und Vorrichtung zum Betrieb einer Verbrennungskraftmaschine
JP2008123847A (ja) 2006-11-13 2008-05-29 Sony Corp 面状光源装置及び液晶表示装置組立体
US8540922B2 (en) * 2007-08-27 2013-09-24 Hewlett-Packard Development Company, L.P. Laser patterning of a carbon nanotube layer
DE102008007723A1 (de) 2008-02-06 2009-08-20 Osram Gesellschaft mit beschränkter Haftung Beleuchtungsmodul, Leuchte und Verfahren zur Beleuchtung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6523976B1 (en) * 1996-06-13 2003-02-25 Gentex Corporation Led assembly
EP1641052A2 (en) * 2004-09-27 2006-03-29 Enplas Corporation Emission device, surface light source device, display and light flux control member
US20070206390A1 (en) * 2006-03-06 2007-09-06 Brukilacchio Thomas J Light emitting diode projection system
US20070273984A1 (en) * 2006-05-25 2007-11-29 Industrial Technology Research Institute Light Guide Lens and Light Emitting Diode Package Structure having the Light Guide Lens
DE102006047233A1 (de) * 2006-10-04 2008-04-10 Osram Opto Semiconductors Gmbh Optisches Element für eine Leuchtdiode, Leuchtdiode, LED-Anordnung und Verfahren zur Herstellung einer LED-Anordnung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2007-80526A 2007.03.29

Also Published As

Publication number Publication date
KR20110137380A (ko) 2011-12-22
TWI419303B (zh) 2013-12-11
KR101683934B1 (ko) 2016-12-07
EP2412022A1 (de) 2012-02-01
US8698385B2 (en) 2014-04-15
CN102365739A (zh) 2012-02-29
DE102009015313B4 (de) 2022-02-24
JP2012522359A (ja) 2012-09-20
JP5744001B2 (ja) 2015-07-01
WO2010108761A1 (de) 2010-09-30
EP2412022B1 (de) 2018-11-21
TW201104829A (en) 2011-02-01
US20120001208A1 (en) 2012-01-05
DE102009015313A1 (de) 2010-09-30

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