TWI415166B - 功能區之轉移方法、ｌｅｄ陣列、ｌｅｄ列印頭、及ｌｅｄ列印機 - Google Patents
功能區之轉移方法、ｌｅｄ陣列、ｌｅｄ列印頭、及ｌｅｄ列印機 Download PDFInfo
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- TWI415166B TWI415166B TW098137295A TW98137295A TWI415166B TW I415166 B TWI415166 B TW I415166B TW 098137295 A TW098137295 A TW 098137295A TW 98137295 A TW98137295 A TW 98137295A TW I415166 B TWI415166 B TW I415166B
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
- B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
- B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008282679A JP5390832B2 (ja) | 2008-11-04 | 2008-11-04 | 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201023243A TW201023243A (en) | 2010-06-16 |
| TWI415166B true TWI415166B (zh) | 2013-11-11 |
Family
ID=41655085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW098137295A TWI415166B (zh) | 2008-11-04 | 2009-11-03 | 功能區之轉移方法、ｌｅｄ陣列、ｌｅｄ列印頭、及ｌｅｄ列印機 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8507360B2 (https=) |
| EP (1) | EP2182552A2 (https=) |
| JP (1) | JP5390832B2 (https=) |
| KR (1) | KR101182181B1 (https=) |
| CN (1) | CN101740493B (https=) |
| TW (1) | TWI415166B (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5590837B2 (ja) | 2009-09-15 | 2014-09-17 | キヤノン株式会社 | 機能性領域の移設方法 |
| TWI452691B (zh) * | 2011-04-25 | 2014-09-11 | Univ Nat Cheng Kung | 半導體結構及其製作方法和磊晶半成品的製作方法 |
| CN103633013B (zh) * | 2012-08-21 | 2016-06-29 | 中芯国际集成电路制造(上海)有限公司 | 硅通孔封装结构的形成方法 |
| KR101328006B1 (ko) * | 2013-06-21 | 2013-11-13 | 한국과학기술원 | 유연성 질화갈륨 발광다이오드 소자 제조방법 및 이에 따라 제조된 유연성 질화갈륨 발광다이오드 소자 |
| TWI566427B (zh) * | 2013-07-05 | 2017-01-11 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| KR101763675B1 (ko) | 2013-07-05 | 2017-08-14 | 에피스타 코포레이션 | 발광소자 및 그 제조방법 |
| KR102139681B1 (ko) | 2014-01-29 | 2020-07-30 | 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. | 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법 |
| US10566494B2 (en) * | 2015-12-23 | 2020-02-18 | Goertek Inc. | Micro-LED transfer method and manufacturing method |
| CN106057723A (zh) * | 2016-08-16 | 2016-10-26 | 厦门市三安光电科技有限公司 | 微元件的转移方法、装置及电子设备 |
| TWI681472B (zh) * | 2017-04-10 | 2020-01-01 | 英屬開曼群島商錼創科技股份有限公司 | 傳輸微小元件的方法 |
| US10632727B2 (en) | 2017-04-10 | 2020-04-28 | PlayNitride Inc. | Method of transferring micro devices |
| US10874539B2 (en) | 2017-05-05 | 2020-12-29 | Becker Orthopedic Appliance Company | Configurable orthosis and method of definitive orthotic design, fabrication and validation |
| US10186549B1 (en) * | 2017-09-20 | 2019-01-22 | Asm Technology Singapore Pte Ltd | Gang bonding process for assembling a matrix of light-emitting elements |
| JP7205490B2 (ja) * | 2017-12-13 | 2023-01-17 | ソニーグループ株式会社 | 発光モジュールの製造方法 |
| TW202008558A (zh) * | 2018-07-23 | 2020-02-16 | 飛傳科技股份有限公司 | 晶片轉移之方法及其晶片轉移系統 |
| TWI823087B (zh) * | 2021-05-05 | 2023-11-21 | 友達光電股份有限公司 | 巨量轉移晶片的裝置 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003174041A (ja) * | 2001-12-06 | 2003-06-20 | Seiko Epson Corp | 素子の実装方法、電子機器、フラットパネルディスプレイ、システムインパッケージ型ｉｃおよびオプティカルエレクトリカルｉｃ |
| US20040128829A1 (en) * | 2002-10-08 | 2004-07-08 | Seiko Epson Corporation | Circuit board, method of manufacturing the same, transfer chip, transfer source subtrate, electro-optical device, and electronic apparatus |
| JP2005012034A (ja) * | 2003-06-20 | 2005-01-13 | Oki Data Corp | 半導体薄膜の製造方法及び半導体装置の製造方法 |
| TW200746450A (en) * | 2006-04-05 | 2007-12-16 | Silicon Genesis Corp | Method and structure for fabricating solar cells using a layer transfer process |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4543487B2 (ja) | 2000-03-16 | 2010-09-15 | 富士ゼロックス株式会社 | 光プリンタヘッドの点灯方法 |
| JP3906653B2 (ja) * | 2000-07-18 | 2007-04-18 | ソニー株式会社 | 画像表示装置及びその製造方法 |
| JP4370796B2 (ja) | 2003-04-08 | 2009-11-25 | セイコーエプソン株式会社 | 半導体装置、半導体装置の製造方法及び電子機器 |
| US6913985B2 (en) | 2003-06-20 | 2005-07-05 | Oki Data Corporation | Method of manufacturing a semiconductor device |
| JP2005108943A (ja) * | 2003-09-29 | 2005-04-21 | Oki Data Corp | 半導体ウェハ及びこれを用いた半導体装置の製造方法 |
| JP4672329B2 (ja) * | 2003-10-22 | 2011-04-20 | 株式会社沖データ | 半導体装置、及び、それを用いたｌｅｄプリントヘッド、画像形成装置、半導体装置の製造方法 |
| JP4468107B2 (ja) | 2004-08-09 | 2010-05-26 | シャープ株式会社 | 半導体装置の製造方法、半導体装置及び半導体回路基板 |
| JP5171016B2 (ja) * | 2006-10-27 | 2013-03-27 | キヤノン株式会社 | 半導体部材、半導体物品の製造方法、その製造方法を用いたｌｅｄアレイ |
| JP5276412B2 (ja) * | 2008-11-04 | 2013-08-28 | キヤノン株式会社 | 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ |
-
2008
- 2008-11-04 JP JP2008282679A patent/JP5390832B2/ja not_active Expired - Fee Related
-
2009
- 2009-10-29 EP EP09013627A patent/EP2182552A2/en not_active Withdrawn
- 2009-11-03 US US12/611,770 patent/US8507360B2/en not_active Expired - Fee Related
- 2009-11-03 KR KR1020090105295A patent/KR101182181B1/ko not_active Expired - Fee Related
- 2009-11-03 TW TW098137295A patent/TWI415166B/zh not_active IP Right Cessation
- 2009-11-04 CN CN2009102115348A patent/CN101740493B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003174041A (ja) * | 2001-12-06 | 2003-06-20 | Seiko Epson Corp | 素子の実装方法、電子機器、フラットパネルディスプレイ、システムインパッケージ型ｉｃおよびオプティカルエレクトリカルｉｃ |
| US20040128829A1 (en) * | 2002-10-08 | 2004-07-08 | Seiko Epson Corporation | Circuit board, method of manufacturing the same, transfer chip, transfer source subtrate, electro-optical device, and electronic apparatus |
| JP2005012034A (ja) * | 2003-06-20 | 2005-01-13 | Oki Data Corp | 半導体薄膜の製造方法及び半導体装置の製造方法 |
| TW200746450A (en) * | 2006-04-05 | 2007-12-16 | Silicon Genesis Corp | Method and structure for fabricating solar cells using a layer transfer process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101740493A (zh) | 2010-06-16 |
| TW201023243A (en) | 2010-06-16 |
| JP2010114104A (ja) | 2010-05-20 |
| EP2182552A2 (en) | 2010-05-05 |
| CN101740493B (zh) | 2012-09-05 |
| JP5390832B2 (ja) | 2014-01-15 |
| US20100109024A1 (en) | 2010-05-06 |
| KR20100050413A (ko) | 2010-05-13 |
| KR101182181B1 (ko) | 2012-09-12 |
| US8507360B2 (en) | 2013-08-13 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |