JP5390832B2 - 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ - Google Patents

機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ Download PDF

Info

Publication number
JP5390832B2
JP5390832B2 JP2008282679A JP2008282679A JP5390832B2 JP 5390832 B2 JP5390832 B2 JP 5390832B2 JP 2008282679 A JP2008282679 A JP 2008282679A JP 2008282679 A JP2008282679 A JP 2008282679A JP 5390832 B2 JP5390832 B2 JP 5390832B2
Authority
JP
Japan
Prior art keywords
substrate
layer
region
functional region
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008282679A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010114104A5 (https=
JP2010114104A (ja
Inventor
隆夫 米原
康好 高井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008282679A priority Critical patent/JP5390832B2/ja
Priority to EP09013627A priority patent/EP2182552A2/en
Priority to US12/611,770 priority patent/US8507360B2/en
Priority to TW098137295A priority patent/TWI415166B/zh
Priority to KR1020090105295A priority patent/KR101182181B1/ko
Priority to CN2009102115348A priority patent/CN101740493B/zh
Publication of JP2010114104A publication Critical patent/JP2010114104A/ja
Publication of JP2010114104A5 publication Critical patent/JP2010114104A5/ja
Application granted granted Critical
Publication of JP5390832B2 publication Critical patent/JP5390832B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01Manufacture or treatment
    • H10H20/011Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018Bonding of wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
JP2008282679A 2008-11-04 2008-11-04 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ Expired - Fee Related JP5390832B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2008282679A JP5390832B2 (ja) 2008-11-04 2008-11-04 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ
EP09013627A EP2182552A2 (en) 2008-11-04 2009-10-29 Transfer method of functional region, led array, led printer head, and led printer
TW098137295A TWI415166B (zh) 2008-11-04 2009-11-03 功能區之轉移方法、led陣列、led列印頭、及led列印機
KR1020090105295A KR101182181B1 (ko) 2008-11-04 2009-11-03 기능성 영역의 이설 방법, led어레이, led프린터 헤드 및 led프린터
US12/611,770 US8507360B2 (en) 2008-11-04 2009-11-03 Transfer method of functional region, LED array, LED printer head, and LED printer
CN2009102115348A CN101740493B (zh) 2008-11-04 2009-11-04 功能区域的移设方法和led阵列、打印机头及打印机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008282679A JP5390832B2 (ja) 2008-11-04 2008-11-04 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ

Publications (3)

Publication Number Publication Date
JP2010114104A JP2010114104A (ja) 2010-05-20
JP2010114104A5 JP2010114104A5 (https=) 2011-12-22
JP5390832B2 true JP5390832B2 (ja) 2014-01-15

Family

ID=41655085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008282679A Expired - Fee Related JP5390832B2 (ja) 2008-11-04 2008-11-04 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ

Country Status (6)

Country Link
US (1) US8507360B2 (https=)
EP (1) EP2182552A2 (https=)
JP (1) JP5390832B2 (https=)
KR (1) KR101182181B1 (https=)
CN (1) CN101740493B (https=)
TW (1) TWI415166B (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5590837B2 (ja) 2009-09-15 2014-09-17 キヤノン株式会社 機能性領域の移設方法
TWI452691B (zh) * 2011-04-25 2014-09-11 Univ Nat Cheng Kung 半導體結構及其製作方法和磊晶半成品的製作方法
CN103633013B (zh) * 2012-08-21 2016-06-29 中芯国际集成电路制造(上海)有限公司 硅通孔封装结构的形成方法
KR101328006B1 (ko) * 2013-06-21 2013-11-13 한국과학기술원 유연성 질화갈륨 발광다이오드 소자 제조방법 및 이에 따라 제조된 유연성 질화갈륨 발광다이오드 소자
TWI566427B (zh) * 2013-07-05 2017-01-11 晶元光電股份有限公司 發光元件及其製造方法
KR101763675B1 (ko) 2013-07-05 2017-08-14 에피스타 코포레이션 발광소자 및 그 제조방법
KR102139681B1 (ko) 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
US10566494B2 (en) * 2015-12-23 2020-02-18 Goertek Inc. Micro-LED transfer method and manufacturing method
CN106057723A (zh) * 2016-08-16 2016-10-26 厦门市三安光电科技有限公司 微元件的转移方法、装置及电子设备
TWI681472B (zh) * 2017-04-10 2020-01-01 英屬開曼群島商錼創科技股份有限公司 傳輸微小元件的方法
US10632727B2 (en) 2017-04-10 2020-04-28 PlayNitride Inc. Method of transferring micro devices
US10874539B2 (en) 2017-05-05 2020-12-29 Becker Orthopedic Appliance Company Configurable orthosis and method of definitive orthotic design, fabrication and validation
US10186549B1 (en) * 2017-09-20 2019-01-22 Asm Technology Singapore Pte Ltd Gang bonding process for assembling a matrix of light-emitting elements
JP7205490B2 (ja) * 2017-12-13 2023-01-17 ソニーグループ株式会社 発光モジュールの製造方法
TW202008558A (zh) * 2018-07-23 2020-02-16 飛傳科技股份有限公司 晶片轉移之方法及其晶片轉移系統
TWI823087B (zh) * 2021-05-05 2023-11-21 友達光電股份有限公司 巨量轉移晶片的裝置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4543487B2 (ja) 2000-03-16 2010-09-15 富士ゼロックス株式会社 光プリンタヘッドの点灯方法
JP3906653B2 (ja) * 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
JP2003174041A (ja) 2001-12-06 2003-06-20 Seiko Epson Corp 素子の実装方法、電子機器、フラットパネルディスプレイ、システムインパッケージ型icおよびオプティカルエレクトリカルic
JP3918708B2 (ja) * 2002-10-08 2007-05-23 セイコーエプソン株式会社 回路基板及びその製造方法、転写チップ、転写元基板、電気光学装置、電子機器
JP4370796B2 (ja) 2003-04-08 2009-11-25 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法及び電子機器
US6913985B2 (en) 2003-06-20 2005-07-05 Oki Data Corporation Method of manufacturing a semiconductor device
JP4315742B2 (ja) * 2003-06-20 2009-08-19 株式会社沖データ 半導体薄膜の製造方法及び半導体装置の製造方法
JP2005108943A (ja) * 2003-09-29 2005-04-21 Oki Data Corp 半導体ウェハ及びこれを用いた半導体装置の製造方法
JP4672329B2 (ja) * 2003-10-22 2011-04-20 株式会社沖データ 半導体装置、及び、それを用いたledプリントヘッド、画像形成装置、半導体装置の製造方法
JP4468107B2 (ja) 2004-08-09 2010-05-26 シャープ株式会社 半導体装置の製造方法、半導体装置及び半導体回路基板
CN101512721A (zh) 2006-04-05 2009-08-19 硅源公司 利用层转移工艺制造太阳能电池的方法和结构
JP5171016B2 (ja) * 2006-10-27 2013-03-27 キヤノン株式会社 半導体部材、半導体物品の製造方法、その製造方法を用いたledアレイ
JP5276412B2 (ja) * 2008-11-04 2013-08-28 キヤノン株式会社 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ

Also Published As

Publication number Publication date
CN101740493A (zh) 2010-06-16
TW201023243A (en) 2010-06-16
JP2010114104A (ja) 2010-05-20
EP2182552A2 (en) 2010-05-05
TWI415166B (zh) 2013-11-11
CN101740493B (zh) 2012-09-05
US20100109024A1 (en) 2010-05-06
KR20100050413A (ko) 2010-05-13
KR101182181B1 (ko) 2012-09-12
US8507360B2 (en) 2013-08-13

Similar Documents

Publication Publication Date Title
JP5390832B2 (ja) 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ
JP5276412B2 (ja) 機能性領域の移設方法、ledアレイ、ledプリンタヘッド、及びledプリンタ
US8415230B2 (en) Method for transferring functional regions, LED array, LED printer head, and LED printer
KR101168881B1 (ko) 기능성 영역의 이설방법, led 어레이, led 프린터 헤드, 및 led 프린터
EP2082439B1 (en) Semiconductor member and semiconductor device manufacturing method
JP5590837B2 (ja) 機能性領域の移設方法
JP2013219374A (ja) 半導体装置の製造方法、半導体装置及びそれを用いた光プリントヘッド、及び画像形成装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111104

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111104

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121031

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130116

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130425

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130709

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20130717

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20130912

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131011

R151 Written notification of patent or utility model registration

Ref document number: 5390832

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R151

RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D03

LAPS Cancellation because of no payment of annual fees