CN101740493B - 功能区域的移设方法和led阵列、打印机头及打印机 - Google Patents

功能区域的移设方法和led阵列、打印机头及打印机 Download PDF

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Publication number
CN101740493B
CN101740493B CN2009102115348A CN200910211534A CN101740493B CN 101740493 B CN101740493 B CN 101740493B CN 2009102115348 A CN2009102115348 A CN 2009102115348A CN 200910211534 A CN200910211534 A CN 200910211534A CN 101740493 B CN101740493 B CN 101740493B
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substrate
layer
functional region
functional
region
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CN101740493A (zh
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米原隆夫
高井康好
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Canon Inc
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Canon Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/435—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material
    • B41J2/447—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources
    • B41J2/45—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of radiation to a printing material or impression-transfer material using arrays of radiation sources using light-emitting diode [LED] or laser arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
CN2009102115348A 2008-11-04 2009-11-04 功能区域的移设方法和led阵列、打印机头及打印机 Expired - Fee Related CN101740493B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008282679A JP5390832B2 (ja) 2008-11-04 2008-11-04 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ
JP2008-282679 2008-11-04

Publications (2)

Publication Number Publication Date
CN101740493A CN101740493A (zh) 2010-06-16
CN101740493B true CN101740493B (zh) 2012-09-05

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CN2009102115348A Expired - Fee Related CN101740493B (zh) 2008-11-04 2009-11-04 功能区域的移设方法和led阵列、打印机头及打印机

Country Status (6)

Country Link
US (1) US8507360B2 (https=)
EP (1) EP2182552A2 (https=)
JP (1) JP5390832B2 (https=)
KR (1) KR101182181B1 (https=)
CN (1) CN101740493B (https=)
TW (1) TWI415166B (https=)

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* Cited by examiner, † Cited by third party
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JP5590837B2 (ja) 2009-09-15 2014-09-17 キヤノン株式会社 機能性領域の移設方法
TWI452691B (zh) * 2011-04-25 2014-09-11 Univ Nat Cheng Kung 半導體結構及其製作方法和磊晶半成品的製作方法
CN103633013B (zh) * 2012-08-21 2016-06-29 中芯国际集成电路制造(上海)有限公司 硅通孔封装结构的形成方法
KR101328006B1 (ko) * 2013-06-21 2013-11-13 한국과학기술원 유연성 질화갈륨 발광다이오드 소자 제조방법 및 이에 따라 제조된 유연성 질화갈륨 발광다이오드 소자
TWI566427B (zh) * 2013-07-05 2017-01-11 晶元光電股份有限公司 發光元件及其製造方法
KR101763675B1 (ko) 2013-07-05 2017-08-14 에피스타 코포레이션 발광소자 및 그 제조방법
KR102139681B1 (ko) 2014-01-29 2020-07-30 휴렛-팩커드 디벨롭먼트 컴퍼니, 엘.피. 발광소자 어레이 모듈 및 발광소자 어레이 칩들을 제어하는 방법
US10566494B2 (en) * 2015-12-23 2020-02-18 Goertek Inc. Micro-LED transfer method and manufacturing method
CN106057723A (zh) * 2016-08-16 2016-10-26 厦门市三安光电科技有限公司 微元件的转移方法、装置及电子设备
TWI681472B (zh) * 2017-04-10 2020-01-01 英屬開曼群島商錼創科技股份有限公司 傳輸微小元件的方法
US10632727B2 (en) 2017-04-10 2020-04-28 PlayNitride Inc. Method of transferring micro devices
US10874539B2 (en) 2017-05-05 2020-12-29 Becker Orthopedic Appliance Company Configurable orthosis and method of definitive orthotic design, fabrication and validation
US10186549B1 (en) * 2017-09-20 2019-01-22 Asm Technology Singapore Pte Ltd Gang bonding process for assembling a matrix of light-emitting elements
JP7205490B2 (ja) * 2017-12-13 2023-01-17 ソニーグループ株式会社 発光モジュールの製造方法
TW202008558A (zh) * 2018-07-23 2020-02-16 飛傳科技股份有限公司 晶片轉移之方法及其晶片轉移系統
TWI823087B (zh) * 2021-05-05 2023-11-21 友達光電股份有限公司 巨量轉移晶片的裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1447958A (zh) * 2000-07-18 2003-10-08 索尼株式会社 图像显示装置及制造图像显示装置的方法

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JP4543487B2 (ja) 2000-03-16 2010-09-15 富士ゼロックス株式会社 光プリンタヘッドの点灯方法
JP2003174041A (ja) 2001-12-06 2003-06-20 Seiko Epson Corp 素子の実装方法、電子機器、フラットパネルディスプレイ、システムインパッケージ型ｉｃおよびオプティカルエレクトリカルｉｃ
JP3918708B2 (ja) * 2002-10-08 2007-05-23 セイコーエプソン株式会社 回路基板及びその製造方法、転写チップ、転写元基板、電気光学装置、電子機器
JP4370796B2 (ja) 2003-04-08 2009-11-25 セイコーエプソン株式会社 半導体装置、半導体装置の製造方法及び電子機器
US6913985B2 (en) 2003-06-20 2005-07-05 Oki Data Corporation Method of manufacturing a semiconductor device
JP4315742B2 (ja) * 2003-06-20 2009-08-19 株式会社沖データ 半導体薄膜の製造方法及び半導体装置の製造方法
JP2005108943A (ja) * 2003-09-29 2005-04-21 Oki Data Corp 半導体ウェハ及びこれを用いた半導体装置の製造方法
JP4672329B2 (ja) * 2003-10-22 2011-04-20 株式会社沖データ 半導体装置、及び、それを用いたｌｅｄプリントヘッド、画像形成装置、半導体装置の製造方法
JP4468107B2 (ja) 2004-08-09 2010-05-26 シャープ株式会社 半導体装置の製造方法、半導体装置及び半導体回路基板
CN101512721A (zh) 2006-04-05 2009-08-19 硅源公司 利用层转移工艺制造太阳能电池的方法和结构
JP5171016B2 (ja) * 2006-10-27 2013-03-27 キヤノン株式会社 半導体部材、半導体物品の製造方法、その製造方法を用いたｌｅｄアレイ
JP5276412B2 (ja) * 2008-11-04 2013-08-28 キヤノン株式会社 機能性領域の移設方法、ｌｅｄアレイ、ｌｅｄプリンタヘッド、及びｌｅｄプリンタ

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
CN1447958A (zh) * 2000-07-18 2003-10-08 索尼株式会社 图像显示装置及制造图像显示装置的方法

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* Cited by examiner, † Cited by third party
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JP特开2003-174041A 2003.06.20

Also Published As

Publication number Publication date
CN101740493A (zh) 2010-06-16
TW201023243A (en) 2010-06-16
JP2010114104A (ja) 2010-05-20
EP2182552A2 (en) 2010-05-05
TWI415166B (zh) 2013-11-11
JP5390832B2 (ja) 2014-01-15
US20100109024A1 (en) 2010-05-06
KR20100050413A (ko) 2010-05-13
KR101182181B1 (ko) 2012-09-12
US8507360B2 (en) 2013-08-13

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