TWI414802B - - Google Patents

Info

Publication number
TWI414802B
TWI414802B TW100126932A TW100126932A TWI414802B TW I414802 B TWI414802 B TW I414802B TW 100126932 A TW100126932 A TW 100126932A TW 100126932 A TW100126932 A TW 100126932A TW I414802 B TWI414802 B TW I414802B
Authority
TW
Taiwan
Prior art keywords
semiconductor devices
tray unit
plate member
sections
bottom plate
Prior art date
Application number
TW100126932A
Other languages
English (en)
Chinese (zh)
Other versions
TW201205099A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW201205099A publication Critical patent/TW201205099A/zh
Application granted granted Critical
Publication of TWI414802B publication Critical patent/TWI414802B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW100126932A 2010-07-30 2011-07-29 Tray unit and semiconductor device inspecting apparatus TW201205099A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010171857 2010-07-30
JP2010292784A JP4765127B1 (ja) 2010-07-30 2010-12-28 トレーユニットおよび半導体デバイスの検査装置

Publications (2)

Publication Number Publication Date
TW201205099A TW201205099A (en) 2012-02-01
TWI414802B true TWI414802B (ja) 2013-11-11

Family

ID=44693557

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100126932A TW201205099A (en) 2010-07-30 2011-07-29 Tray unit and semiconductor device inspecting apparatus

Country Status (3)

Country Link
JP (1) JP4765127B1 (ja)
TW (1) TW201205099A (ja)
WO (1) WO2012014899A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568056B (zh) * 2014-05-12 2017-01-21 燦美工程股份有限公司 基板檢查裝置及方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9156293B2 (en) 2012-06-18 2015-10-13 Cimpress Schweiz Gmbh Manufacturing tray with customized inlays for processing different types of articles of manufacture
US9114645B2 (en) 2012-06-18 2015-08-25 Cimpress Schweiz Gmbh System and method for printing on multiple different articles of manufacture by the same printing system in a conveyor system
US9656481B2 (en) 2012-06-18 2017-05-23 Cimpress Schweiz Gmbh Integrated imprinting system and trays for selectively processing items on tray
EP2871059A1 (en) * 2013-11-07 2015-05-13 Vistaprint Schweiz GmbH Conveyance printing system and method for printing on multiple different types of articles of manufacture
US10031178B2 (en) * 2015-04-21 2018-07-24 Keysight Technologies, Inc. Portable vacuum chamber and an associated automated test system and method for the testing of electronic devices
KR102393040B1 (ko) * 2015-11-27 2022-05-03 (주)테크윙 전자부품 테스트용 결합장치
JP6178969B1 (ja) * 2016-08-19 2017-08-16 合同会社Ｐｌｅｓｏｎ トレー交換式バーンイン試験ユニット
JP6842355B2 (ja) * 2017-04-28 2021-03-17 株式会社アドバンテスト 電子部品試験装置用のキャリア
JP6471401B1 (ja) * 2017-10-31 2019-02-20 合同会社Ｐｌｅｓｏｎ 半導体ウエハーの試験ユニット
TWI694263B (zh) * 2019-03-07 2020-05-21 雍智科技股份有限公司 老化測試電路板模組
JP7523794B2 (ja) 2020-01-29 2024-07-29 株式会社クオルテック 半導体素子試験装置
CN115692242A (zh) * 2021-07-22 2023-02-03 细美事有限公司 测试分选机的托盘升降装置以及测试分选机
CN116679183A (zh) * 2023-08-03 2023-09-01 深圳市诺泰芯装备有限公司 一种igbt产品的测试方法及装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572269A (ja) * 1991-09-10 1993-03-23 Hitachi Electron Eng Co Ltd Ｉｃテスターの測定治具
CN1705095A (zh) * 2004-06-03 2005-12-07 新泻精密株式会社 半导体检查装置及其所使用的被检查部件托盘
US20080036482A1 (en) * 2006-08-09 2008-02-14 Fujitsu Limited Carrier tray for use with prober
TW200824032A (en) * 2006-10-27 2008-06-01 Advantest Corp Customer tray and electronic component testing apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07260879A (ja) * 1994-03-25 1995-10-13 Advantest Corp Ｉｃ試験装置のテストヘッド用インターフェイス
JP3825504B2 (ja) * 1996-07-12 2006-09-27 株式会社日本マイクロニクス 集積回路チップ用トレー
JP2000304808A (ja) * 1999-04-23 2000-11-02 Matsushita Electric Ind Co Ltd 半導体装置の検査装置
JP4715601B2 (ja) * 2006-04-07 2011-07-06 住友電気工業株式会社 電気接続部品
WO2010021038A1 (ja) * 2008-08-20 2010-02-25 株式会社アドバンテスト 電子部品ハンドリング装置および電子部品試験システム

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572269A (ja) * 1991-09-10 1993-03-23 Hitachi Electron Eng Co Ltd Ｉｃテスターの測定治具
CN1705095A (zh) * 2004-06-03 2005-12-07 新泻精密株式会社 半导体检查装置及其所使用的被检查部件托盘
US20080036482A1 (en) * 2006-08-09 2008-02-14 Fujitsu Limited Carrier tray for use with prober
TW200824032A (en) * 2006-10-27 2008-06-01 Advantest Corp Customer tray and electronic component testing apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI568056B (zh) * 2014-05-12 2017-01-21 燦美工程股份有限公司 基板檢查裝置及方法

Also Published As

Publication number Publication date
WO2012014899A1 (ja) 2012-02-02
TW201205099A (en) 2012-02-01
JP2012047717A (ja) 2012-03-08
JP4765127B1 (ja) 2011-09-07

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees