TWI409110B - Cleanliness and clean method - Google Patents

Cleanliness and clean method Download PDF

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Publication number
TWI409110B
TWI409110B TW097136668A TW97136668A TWI409110B TW I409110 B TWI409110 B TW I409110B TW 097136668 A TW097136668 A TW 097136668A TW 97136668 A TW97136668 A TW 97136668A TW I409110 B TWI409110 B TW I409110B
Authority
TW
Taiwan
Prior art keywords
bonding
sheet
conductive sheet
processing chamber
voltage
Prior art date
Application number
TW097136668A
Other languages
English (en)
Chinese (zh)
Other versions
TW201008670A (en
Inventor
池永和幸
手束勉
古瀨宗雄
Original Assignee
日立全球先端科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立全球先端科技股份有限公司 filed Critical 日立全球先端科技股份有限公司
Publication of TW201008670A publication Critical patent/TW201008670A/zh
Application granted granted Critical
Publication of TWI409110B publication Critical patent/TWI409110B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning In General (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
TW097136668A 2008-08-26 2008-09-24 Cleanliness and clean method TWI409110B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008216343A JP5038259B2 (ja) 2008-08-26 2008-08-26 クリーニング装置およびクリーニング方法

Publications (2)

Publication Number Publication Date
TW201008670A TW201008670A (en) 2010-03-01
TWI409110B true TWI409110B (zh) 2013-09-21

Family

ID=41723171

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097136668A TWI409110B (zh) 2008-08-26 2008-09-24 Cleanliness and clean method

Country Status (4)

Country Link
US (2) US8006340B2 (https=)
JP (1) JP5038259B2 (https=)
KR (1) KR101071368B1 (https=)
TW (1) TWI409110B (https=)

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TWD234773S (zh) 2023-11-01 2024-11-11 日商黑崎播磨股份有限公司 (日本) 捲帶材搬運用導引構件

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JP6812264B2 (ja) * 2017-02-16 2021-01-13 東京エレクトロン株式会社 真空処理装置、及びメンテナンス装置
WO2019219163A1 (en) * 2018-05-14 2019-11-21 Applied Materials, Inc. Cleaning device for attracting particles in a substrate processing system, processing system for processing a substrate, and method of operation of a cleaning device
CN108937745B (zh) * 2018-07-25 2021-01-01 来斯奥集成家居股份有限公司 一种用于瓷砖地板的贴纸用水清除机构
WO2021086691A1 (en) * 2019-11-01 2021-05-06 Lam Research Corporation Systems and methods for cleaning a showerhead
CN111822420B (zh) * 2020-07-15 2022-06-24 郑州龙华机电工程有限公司 一种基于物联网的电力设备检修系统
CN114308907B (zh) * 2022-02-23 2023-11-28 深圳市震华等离子体智造有限公司 一种用于精密分析仪器的等离子清洗装置

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US6969309B2 (en) * 1998-09-01 2005-11-29 Micron Technology, Inc. Microelectronic substrate assembly planarizing machines and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies
US20040082289A1 (en) * 2000-02-17 2004-04-29 Butterfield Paul D. Conductive polishing article for electrochemical mechanical polishing
JP2007019443A (ja) * 2005-07-06 2007-01-25 Creative Technology:Kk 導電性ウエハ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD234773S (zh) 2023-11-01 2024-11-11 日商黑崎播磨股份有限公司 (日本) 捲帶材搬運用導引構件

Also Published As

Publication number Publication date
US8006340B2 (en) 2011-08-30
KR20100024872A (ko) 2010-03-08
US20100050349A1 (en) 2010-03-04
US20100294315A1 (en) 2010-11-25
JP5038259B2 (ja) 2012-10-03
KR101071368B1 (ko) 2011-10-07
TW201008670A (en) 2010-03-01
JP2010056113A (ja) 2010-03-11
US8024831B2 (en) 2011-09-27

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