TWI408515B - 曝光設備及裝置製造方法 - Google Patents
曝光設備及裝置製造方法 Download PDFInfo
- Publication number
- TWI408515B TWI408515B TW097121541A TW97121541A TWI408515B TW I408515 B TWI408515 B TW I408515B TW 097121541 A TW097121541 A TW 097121541A TW 97121541 A TW97121541 A TW 97121541A TW I408515 B TWI408515 B TW I408515B
- Authority
- TW
- Taiwan
- Prior art keywords
- exposure
- aberration
- optical system
- reticle
- projection optical
- Prior art date
Links
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- 238000005259 measurement Methods 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- 238000004088 simulation Methods 0.000 claims description 5
- 206010010071 Coma Diseases 0.000 claims description 3
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- 238000003384 imaging method Methods 0.000 abstract description 24
- 238000012937 correction Methods 0.000 description 55
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007165312A JP5406437B2 (ja) | 2007-06-22 | 2007-06-22 | 露光装置及びデバイス製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200907605A TW200907605A (en) | 2009-02-16 |
| TWI408515B true TWI408515B (zh) | 2013-09-11 |
Family
ID=40136118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097121541A TWI408515B (zh) | 2007-06-22 | 2008-06-10 | 曝光設備及裝置製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8625069B2 (enExample) |
| JP (1) | JP5406437B2 (enExample) |
| KR (1) | KR100971561B1 (enExample) |
| TW (1) | TWI408515B (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2219077A1 (en) | 2009-02-12 | 2010-08-18 | Carl Zeiss SMT AG | Projection exposure method, projection exposure system and projection objective |
| JP2013115348A (ja) | 2011-11-30 | 2013-06-10 | Canon Inc | 投影光学系の結像特性の変動量の算出方法、露光装置およびデバイス製造方法 |
| DE102012205096B3 (de) | 2012-03-29 | 2013-08-29 | Carl Zeiss Smt Gmbh | Projektionsbelichtungsanlage mit mindestens einem Manipulator |
| JP6070283B2 (ja) * | 2013-03-04 | 2017-02-01 | 株式会社リコー | 撮像装置、露出制御方法およびプログラム |
| JP6474655B2 (ja) * | 2014-09-30 | 2019-02-27 | エイブリック株式会社 | レチクル透過率測定方法、投影露光装置および投影露光方法 |
| CN107278279B (zh) * | 2015-02-23 | 2020-07-03 | 株式会社尼康 | 基板处理系统及基板处理方法、以及组件制造方法 |
| DE102015209051B4 (de) * | 2015-05-18 | 2018-08-30 | Carl Zeiss Smt Gmbh | Projektionsobjektiv mit Wellenfrontmanipulator sowie Projektionsbelichtungsverfahren und Projektionsbelichtungsanlage |
| JP7054365B2 (ja) | 2018-05-25 | 2022-04-13 | キヤノン株式会社 | 評価方法、露光方法、および物品製造方法 |
| JP7178932B2 (ja) * | 2019-03-12 | 2022-11-28 | キヤノン株式会社 | 露光装置、および物品製造方法 |
| JP7213757B2 (ja) * | 2019-05-31 | 2023-01-27 | キヤノン株式会社 | 露光装置、および物品製造方法 |
| JP6924235B2 (ja) * | 2019-09-19 | 2021-08-25 | キヤノン株式会社 | 露光方法、露光装置、物品製造方法、および半導体デバイスの製造方法 |
| CN114132048A (zh) * | 2021-12-13 | 2022-03-04 | 深圳市先地图像科技有限公司 | 一种利用激光直接成像设备曝光网版的方法及相关设备 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5721608A (en) * | 1993-04-06 | 1998-02-24 | Nikon Corporation | Projection exposure method and apparatus |
| US5917581A (en) * | 1995-12-11 | 1999-06-29 | Nikon Corporation | Projection exposure method and apparatus therefor |
| TW200508811A (en) * | 2003-05-28 | 2005-03-01 | Nikon Corp | Exposure method, exposure device, and device manufacturing method |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58179834A (ja) | 1982-04-14 | 1983-10-21 | Canon Inc | 投影露光装置及び方法 |
| JPS6119129A (ja) * | 1984-07-05 | 1986-01-28 | Nippon Kogaku Kk <Nikon> | 投影光学装置 |
| US5105075A (en) * | 1988-09-19 | 1992-04-14 | Canon Kabushiki Kaisha | Projection exposure apparatus |
| JPH02297918A (ja) * | 1989-05-12 | 1990-12-10 | Nikon Corp | 投影光学装置 |
| JP3291818B2 (ja) * | 1993-03-16 | 2002-06-17 | 株式会社ニコン | 投影露光装置、及び該装置を用いる半導体集積回路製造方法 |
| US6753948B2 (en) * | 1993-04-27 | 2004-06-22 | Nikon Corporation | Scanning exposure method and apparatus |
| JP2828226B2 (ja) | 1995-10-30 | 1998-11-25 | 株式会社ニコン | 投影露光装置及び方法 |
| JPH09148228A (ja) | 1995-11-16 | 1997-06-06 | Nikon Corp | 露光装置 |
| US6522386B1 (en) * | 1997-07-24 | 2003-02-18 | Nikon Corporation | Exposure apparatus having projection optical system with aberration correction element |
| JPH11195602A (ja) * | 1997-10-07 | 1999-07-21 | Nikon Corp | 投影露光方法及び装置 |
| US6235438B1 (en) * | 1997-10-07 | 2001-05-22 | Nikon Corporation | Projection exposure method and apparatus |
| JPH11258498A (ja) * | 1998-03-13 | 1999-09-24 | Nikon Corp | 投影レンズ及び走査型露光装置 |
| JP2001102291A (ja) * | 1999-09-30 | 2001-04-13 | Nikon Corp | 露光方法及び装置、並びに前記方法で使用されるマスク |
| JP2001297961A (ja) * | 2000-04-12 | 2001-10-26 | Canon Inc | 露光装置 |
| TW500987B (en) * | 2000-06-14 | 2002-09-01 | Asm Lithography Bv | Method of operating an optical imaging system, lithographic projection apparatus, device manufacturing method, and device manufactured thereby |
| WO2002052620A1 (en) * | 2000-12-22 | 2002-07-04 | Nikon Corporation | Wavefront aberration measuring instrument, wavefront aberration measuring method, exposure apparatus, and method for manufacturing microdevice |
| JP4230676B2 (ja) | 2001-04-27 | 2009-02-25 | 株式会社東芝 | 露光装置の照度むらの測定方法、照度むらの補正方法、半導体デバイスの製造方法及び露光装置 |
| JP5143331B2 (ja) * | 2003-05-28 | 2013-02-13 | 株式会社ニコン | 露光方法及び露光装置、並びにデバイス製造方法 |
| KR100806036B1 (ko) | 2003-11-13 | 2008-02-26 | 동부일렉트로닉스 주식회사 | 반도체 웨이퍼 노광 방법 |
| JP2005183747A (ja) * | 2003-12-22 | 2005-07-07 | Matsushita Electric Ind Co Ltd | 露光方法 |
| US7221430B2 (en) * | 2004-05-11 | 2007-05-22 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP2007206643A (ja) | 2006-02-06 | 2007-08-16 | Canon Inc | 光学素子駆動装置、露光装置およびデバイス製造方法 |
| US8237914B2 (en) * | 2006-12-01 | 2012-08-07 | Asml Netherlands B.V. | Process, apparatus, and device for determining intra-field correction to correct overlay errors between overlapping patterns |
| NL1036546A1 (nl) * | 2008-02-26 | 2009-08-27 | Asml Netherlands Bv | Lithographic method to apply a pattern to a substrate and Lithographic Apparatus. |
| JP2010210760A (ja) * | 2009-03-09 | 2010-09-24 | Canon Inc | 投影光学系、露光装置及びデバイス製造方法 |
| JP6316725B2 (ja) | 2014-10-03 | 2018-04-25 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
-
2007
- 2007-06-22 JP JP2007165312A patent/JP5406437B2/ja not_active Expired - Fee Related
-
2008
- 2008-06-10 TW TW097121541A patent/TWI408515B/zh not_active IP Right Cessation
- 2008-06-18 US US12/141,216 patent/US8625069B2/en not_active Expired - Fee Related
- 2008-06-20 KR KR1020080058100A patent/KR100971561B1/ko not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5721608A (en) * | 1993-04-06 | 1998-02-24 | Nikon Corporation | Projection exposure method and apparatus |
| US5917581A (en) * | 1995-12-11 | 1999-06-29 | Nikon Corporation | Projection exposure method and apparatus therefor |
| TW200508811A (en) * | 2003-05-28 | 2005-03-01 | Nikon Corp | Exposure method, exposure device, and device manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| US20080316447A1 (en) | 2008-12-25 |
| KR100971561B1 (ko) | 2010-07-20 |
| KR20080112970A (ko) | 2008-12-26 |
| JP5406437B2 (ja) | 2014-02-05 |
| TW200907605A (en) | 2009-02-16 |
| US8625069B2 (en) | 2014-01-07 |
| JP2009004632A (ja) | 2009-01-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |