TWI406736B - 具有燒結體研磨部位之工具及其製造方法 - Google Patents

具有燒結體研磨部位之工具及其製造方法 Download PDF

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Publication number
TWI406736B
TWI406736B TW095131436A TW95131436A TWI406736B TW I406736 B TWI406736 B TW I406736B TW 095131436 A TW095131436 A TW 095131436A TW 95131436 A TW95131436 A TW 95131436A TW I406736 B TWI406736 B TW I406736B
Authority
TW
Taiwan
Prior art keywords
polishing
super
sintered
abrasive tool
sintered body
Prior art date
Application number
TW095131436A
Other languages
English (en)
Chinese (zh)
Other versions
TW200714416A (en
Inventor
Hiroshi Ishizuka
Original Assignee
Hiroshi Ishizuka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hiroshi Ishizuka filed Critical Hiroshi Ishizuka
Publication of TW200714416A publication Critical patent/TW200714416A/zh
Application granted granted Critical
Publication of TWI406736B publication Critical patent/TWI406736B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457—Parallel ribs and/or grooves
    • Y10T428/24579—Parallel ribs and/or grooves with particulate matter
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW095131436A 2005-08-25 2006-08-25 具有燒結體研磨部位之工具及其製造方法 TWI406736B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005243529 2005-08-25
JP2006209236 2006-07-31

Publications (2)

Publication Number Publication Date
TW200714416A TW200714416A (en) 2007-04-16
TWI406736B true TWI406736B (zh) 2013-09-01

Family

ID=37771687

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131436A TWI406736B (zh) 2005-08-25 2006-08-25 具有燒結體研磨部位之工具及其製造方法

Country Status (12)

Country Link
US (1) US20090215366A1 (ja)
EP (1) EP1944125B1 (ja)
JP (1) JP5033630B2 (ja)
KR (1) KR101293461B1 (ja)
CN (2) CN101693353A (ja)
AU (1) AU2006282293B2 (ja)
BR (1) BRPI0615020A2 (ja)
CA (1) CA2620407A1 (ja)
IL (1) IL189314A (ja)
RU (1) RU2430827C2 (ja)
TW (1) TWI406736B (ja)
WO (1) WO2007023949A1 (ja)

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* Cited by examiner, † Cited by third party
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JP2009113133A (ja) * 2007-11-05 2009-05-28 Hiroshi Ishizuka Ｃｍｐパッド・コンディショナー
CA2797096C (en) * 2010-04-27 2018-07-10 3M Innovative Properties Company Ceramic shaped abrasive particles, methods of making the same, and abrasive articles containing the same
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
JP5809880B2 (ja) * 2011-08-25 2015-11-11 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
KR20170018102A (ko) * 2011-12-30 2017-02-15 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자 및 이의 형성방법
EP2879838B1 (en) * 2012-08-02 2023-09-13 3M Innovative Properties Company Abrasive articles with precisely shaped features and method of making thereof
CN102862121B (zh) * 2012-09-17 2015-05-20 上海华力微电子有限公司 一种cmp研磨垫修整结构
ES2756849T3 (es) * 2013-08-07 2020-04-27 Reishauer Ag Herramienta rectificadora y procedimiento para su fabricación
WO2015029987A1 (ja) * 2013-08-26 2015-03-05 株式会社東京精密 ダイシングブレード
KR20160071416A (ko) * 2013-10-18 2016-06-21 쓰리엠 이노베이티브 프로퍼티즈 컴파니 코팅된 연마 용품 및 그의 제조 방법
KR102304574B1 (ko) * 2014-03-21 2021-09-27 엔테그리스, 아이엔씨. 세장형 절삭 에지를 갖는 화학 기계 평탄화 패드 컨디셔너
TWI609742B (zh) * 2015-04-20 2018-01-01 中國砂輪企業股份有限公司 研磨工具
CN108698202B (zh) * 2016-02-22 2021-06-04 联合材料公司 磨料工具
CN106078516B (zh) * 2016-06-21 2018-09-04 大连理工大学 一种cmp抛光垫修整器
EP3621771A1 (en) 2017-05-12 2020-03-18 3M Innovative Properties Company Tetrahedral abrasive particles in abrasive articles
EP3713711A4 (en) * 2017-11-21 2021-08-18 3M Innovative Properties Company COATED GRINDING WHEEL AND METHOD OF MANUFACTURING AND USING THEREOF
CN111372728B (zh) 2017-11-21 2022-08-09 3M创新有限公司 涂覆研磨盘及其制备和使用方法
JP6899490B2 (ja) 2017-11-21 2021-07-07 スリーエム イノベイティブ プロパティズ カンパニー 被覆研磨ディスク並びにその製造方法及び使用方法
KR102026250B1 (ko) * 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
MX2020011232A (es) * 2018-04-27 2020-11-11 Sumitomo Electric Industries Granos abrasivos policristalinos y muela abrasiva que comprenden los mismos.
TWI735795B (zh) * 2018-08-24 2021-08-11 宋健民 拋光墊修整器及化學機械平坦化的方法
KR102440315B1 (ko) * 2020-05-11 2022-09-06 한국생산기술연구원 패턴구조를 갖는 화학기계적 연마용 패드 및 이의 제조방법
DK180350B1 (da) * 2019-09-18 2021-01-22 Flex Trim As Slibeelement til brug i roterende slibe- eller pudseværktøj
CN112677062B (zh) * 2019-10-18 2022-12-09 江苏韦尔博新材料科技有限公司 一种打磨钢材磨盘的专用磨粒地貌、其金刚石磨盘与制备方法

Citations (5)

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JPH1071559A (ja) * 1996-05-23 1998-03-17 Asahi Daiyamondo Kogyo Kk ドレッサ及びその製造方法
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
TW482708B (en) * 1998-03-23 2002-04-11 Hiroshi Hashimoto Tool with ultra-fine cutting blade and processing tool with ultra-fine cutting blade
TW200730302A (en) * 2005-05-16 2007-08-16 jian-min Song Superhard cutters and associated methods

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JPS5739106A (en) * 1980-08-14 1982-03-04 Hiroshi Ishizuka Production of diamond ultrahard alloy composite
JPS58199776A (ja) * 1982-05-12 1983-11-21 住友電気工業株式会社 工具用ダイヤモンド焼結体及びその製造方法
JPS6184303A (ja) * 1984-09-28 1986-04-28 Ishizuka Kenkyusho:Kk 複合焼結体の製造法
JP2601284B2 (ja) * 1987-09-01 1997-04-16 株式会社石塚研究所 焼結ダイヤモンド複合体、及びその製造方法
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US5049165B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
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JPH08243927A (ja) * 1995-03-02 1996-09-24 Fuji Xerox Co Ltd 研削工具とその製造方法及び研削装置
US5560754A (en) * 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
JPH09254042A (ja) * 1996-03-15 1997-09-30 Symtec:Kk 溝切り用砥石およびその製造方法
JPH10138120A (ja) * 1996-10-31 1998-05-26 Kyocera Corp ドレッシング用治具
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
JP2000190200A (ja) * 1998-12-25 2000-07-11 Mitsubishi Materials Silicon Corp 研磨布のシ―ズニング治具
JP4332980B2 (ja) * 1999-03-18 2009-09-16 株式会社デンソー ハニカム構造体成形用金型の製造方法
JP2001088028A (ja) * 1999-09-17 2001-04-03 Koremura Toishi Seisakusho:Kk ロータリードレッサー
KR100387954B1 (ko) * 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
TW436375B (en) * 1999-11-16 2001-05-28 Asia Ic Mic Process Inc Formation method for dresser of chemical mechanical polishing pad
JP2001347454A (ja) * 2000-06-09 2001-12-18 Koremura Toishi Seisakusho:Kk ドレッサーとその製造方法
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix

Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH1071559A (ja) * 1996-05-23 1998-03-17 Asahi Daiyamondo Kogyo Kk ドレッサ及びその製造方法
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
TW482708B (en) * 1998-03-23 2002-04-11 Hiroshi Hashimoto Tool with ultra-fine cutting blade and processing tool with ultra-fine cutting blade
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
TW200730302A (en) * 2005-05-16 2007-08-16 jian-min Song Superhard cutters and associated methods

Also Published As

Publication number Publication date
EP1944125A1 (en) 2008-07-16
CN101247923A (zh) 2008-08-20
RU2008110905A (ru) 2009-09-27
WO2007023949A1 (ja) 2007-03-01
RU2430827C2 (ru) 2011-10-10
CN101247923B (zh) 2010-12-08
EP1944125A4 (en) 2009-12-16
KR101293461B1 (ko) 2013-08-07
CN101693353A (zh) 2010-04-14
AU2006282293A1 (en) 2007-03-01
EP1944125B1 (en) 2012-01-25
KR20080037693A (ko) 2008-04-30
JPWO2007023949A1 (ja) 2009-03-05
JP5033630B2 (ja) 2012-09-26
US20090215366A1 (en) 2009-08-27
BRPI0615020A2 (pt) 2009-08-04
AU2006282293B2 (en) 2011-06-23
TW200714416A (en) 2007-04-16
CA2620407A1 (en) 2007-03-01
IL189314A0 (en) 2008-06-05
IL189314A (en) 2013-01-31

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MM4A Annulment or lapse of patent due to non-payment of fees