BRPI0615020A2 - ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma - Google Patents
ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesmaInfo
- Publication number
- BRPI0615020A2 BRPI0615020A2 BRPI0615020-9A BRPI0615020A BRPI0615020A2 BR PI0615020 A2 BRPI0615020 A2 BR PI0615020A2 BR PI0615020 A BRPI0615020 A BR PI0615020A BR PI0615020 A2 BRPI0615020 A2 BR PI0615020A2
- Authority
- BR
- Brazil
- Prior art keywords
- polishing
- tool
- manufacturing
- sintered
- sintered body
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/21—Circular sheet or circular blank
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/2457—Parallel ribs and/or grooves
- Y10T428/24579—Parallel ribs and/or grooves with particulate matter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24612—Composite web or sheet
Abstract
FERRAMENTA COM SUPERFìCIE DE POLIMENTO DE CORPO SINTERIZADA E MéTODO DE FABRICAçãO DA MESMA. Uma ferramenta de polimento eficientemente processável, particularmente usada para um condicionador de disco de polimento CMP, capaz de solucionar problemas na força de fixação para fixar grãos abrasivos a uma chapa de base e problemas na superfície polida não uniforme e um método de efetivamente fabricar a ferramenta de polimento. A ferramenta de polimento (1) compreende uma peça de polimento feita de um corpo sinterizado de grãos super-abrasivos integralmente sinterizado com o material de revestimento de um carbureto cimentado. A peça de polimento compreende uma pluralidade de unidades de polimento (2) com peças de topo. As peças de topo são posicionadas sobre um plano aproximadamente igual. As unidades de polimento (2) são formadas por meio da formação de um grupo de ranhuras lineares (3) na peça de polimento.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005243529 | 2005-08-25 | ||
JP2006209236 | 2006-07-31 | ||
PCT/JP2006/316737 WO2007023949A1 (ja) | 2005-08-25 | 2006-08-25 | 焼結体研磨部を持つ工具およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
BRPI0615020A2 true BRPI0615020A2 (pt) | 2009-08-04 |
Family
ID=37771687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI0615020-9A BRPI0615020A2 (pt) | 2005-08-25 | 2006-08-25 | ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma |
Country Status (12)
Country | Link |
---|---|
US (1) | US20090215366A1 (pt) |
EP (1) | EP1944125B1 (pt) |
JP (1) | JP5033630B2 (pt) |
KR (1) | KR101293461B1 (pt) |
CN (2) | CN101247923B (pt) |
AU (1) | AU2006282293B2 (pt) |
BR (1) | BRPI0615020A2 (pt) |
CA (1) | CA2620407A1 (pt) |
IL (1) | IL189314A (pt) |
RU (1) | RU2430827C2 (pt) |
TW (1) | TWI406736B (pt) |
WO (1) | WO2007023949A1 (pt) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009113133A (ja) * | 2007-11-05 | 2009-05-28 | Hiroshi Ishizuka | Cmpパッド・コンディショナー |
WO2011139562A2 (en) * | 2010-04-27 | 2011-11-10 | 3M Innovative Properties Company | Ceramic shaped abrasive particles, methods of making the same, and abrasive articles containing the same |
US20120171935A1 (en) * | 2010-12-20 | 2012-07-05 | Diamond Innovations, Inc. | CMP PAD Conditioning Tool |
JP5809880B2 (ja) * | 2011-08-25 | 2015-11-11 | 新日鉄住金マテリアルズ株式会社 | 研磨布用ドレッサー |
KR102187425B1 (ko) | 2011-12-30 | 2020-12-09 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자 및 이의 형성방법 |
CN102862121B (zh) * | 2012-09-17 | 2015-05-20 | 上海华力微电子有限公司 | 一种cmp研磨垫修整结构 |
ES2756849T3 (es) * | 2013-08-07 | 2020-04-27 | Reishauer Ag | Herramienta rectificadora y procedimiento para su fabricación |
JP5976228B2 (ja) * | 2013-08-26 | 2016-08-23 | 株式会社東京精密 | ダイシングブレード |
WO2015057562A1 (en) * | 2013-10-18 | 2015-04-23 | 3M Innovative Properties Company | Coated abrasive article and method of making the same |
WO2015143278A1 (en) * | 2014-03-21 | 2015-09-24 | Entegris, Inc. | Chemical mechanical planarization pad conditioner with elongated cutting edges |
TWI609742B (zh) * | 2015-04-20 | 2018-01-01 | 中國砂輪企業股份有限公司 | 研磨工具 |
US11819979B2 (en) | 2016-02-22 | 2023-11-21 | A.L.M.T. Corp. | Abrasive tool |
CN106078516B (zh) * | 2016-06-21 | 2018-09-04 | 大连理工大学 | 一种cmp抛光垫修整器 |
CN110650819B (zh) * | 2017-05-12 | 2022-08-09 | 3M创新有限公司 | 磨料制品中的四面体磨料颗粒 |
JP2021504171A (ja) | 2017-11-21 | 2021-02-15 | スリーエム イノベイティブ プロパティズ カンパニー | 被覆研磨ディスク並びにその製造方法及び使用方法 |
US11607775B2 (en) | 2017-11-21 | 2023-03-21 | 3M Innovative Properties Company | Coated abrasive disc and methods of making and using the same |
WO2019102329A1 (en) * | 2017-11-21 | 2019-05-31 | 3M Innovative Properties Company | Coated abrasive disc and methods of making and using the same |
KR102026250B1 (ko) * | 2018-02-05 | 2019-09-27 | 에스케이실트론 주식회사 | 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법 |
MX2020011232A (es) * | 2018-04-27 | 2020-11-11 | Sumitomo Electric Industries | Granos abrasivos policristalinos y muela abrasiva que comprenden los mismos. |
TWI735795B (zh) * | 2018-08-24 | 2021-08-11 | 宋健民 | 拋光墊修整器及化學機械平坦化的方法 |
KR102440315B1 (ko) * | 2020-05-11 | 2022-09-06 | 한국생산기술연구원 | 패턴구조를 갖는 화학기계적 연마용 패드 및 이의 제조방법 |
CN112677062B (zh) * | 2019-10-18 | 2022-12-09 | 江苏韦尔博新材料科技有限公司 | 一种打磨钢材磨盘的专用磨粒地貌、其金刚石磨盘与制备方法 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5739106A (en) * | 1980-08-14 | 1982-03-04 | Hiroshi Ishizuka | Production of diamond ultrahard alloy composite |
JPS58199776A (ja) * | 1982-05-12 | 1983-11-21 | 住友電気工業株式会社 | 工具用ダイヤモンド焼結体及びその製造方法 |
JPS6184303A (ja) * | 1984-09-28 | 1986-04-28 | Ishizuka Kenkyusho:Kk | 複合焼結体の製造法 |
JP2601284B2 (ja) * | 1987-09-01 | 1997-04-16 | 株式会社石塚研究所 | 焼結ダイヤモンド複合体、及びその製造方法 |
US4925457B1 (en) * | 1989-01-30 | 1995-09-26 | Ultimate Abrasive Syst Inc | Method for making an abrasive tool |
US5049165B1 (en) * | 1989-01-30 | 1995-09-26 | Ultimate Abrasive Syst Inc | Composite material |
US4954139A (en) * | 1989-03-31 | 1990-09-04 | The General Electric Company | Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces |
JPH08243927A (ja) * | 1995-03-02 | 1996-09-24 | Fuji Xerox Co Ltd | 研削工具とその製造方法及び研削装置 |
US5560754A (en) * | 1995-06-13 | 1996-10-01 | General Electric Company | Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support |
JPH09254042A (ja) * | 1996-03-15 | 1997-09-30 | Symtec:Kk | 溝切り用砥石およびその製造方法 |
JP2957519B2 (ja) * | 1996-05-23 | 1999-10-04 | 旭ダイヤモンド工業株式会社 | 半導体ウェーハ研磨パッド用ドレッサ及びその製造方法 |
JPH10138120A (ja) * | 1996-10-31 | 1998-05-26 | Kyocera Corp | ドレッシング用治具 |
US6054183A (en) * | 1997-07-10 | 2000-04-25 | Zimmer; Jerry W. | Method for making CVD diamond coated substrate for polishing pad conditioning head |
US6027659A (en) * | 1997-12-03 | 2000-02-22 | Intel Corporation | Polishing pad conditioning surface having integral conditioning points |
JPH11267902A (ja) * | 1998-03-23 | 1999-10-05 | Hiroshi Hashimoto | 超微細切刃付き工具及び超微細切刃付き加工具 |
JP2000190200A (ja) * | 1998-12-25 | 2000-07-11 | Mitsubishi Materials Silicon Corp | 研磨布のシ―ズニング治具 |
JP4332980B2 (ja) * | 1999-03-18 | 2009-09-16 | 株式会社デンソー | ハニカム構造体成形用金型の製造方法 |
JP2001088028A (ja) * | 1999-09-17 | 2001-04-03 | Koremura Toishi Seisakusho:Kk | ロータリードレッサー |
TW467802B (en) * | 1999-10-12 | 2001-12-11 | Hunatech Co Ltd | Conditioner for polishing pad and method for manufacturing the same |
KR100387954B1 (ko) * | 1999-10-12 | 2003-06-19 | (주) 휴네텍 | 연마패드용 컨디셔너와 이의 제조방법 |
TW436375B (en) * | 1999-11-16 | 2001-05-28 | Asia Ic Mic Process Inc | Formation method for dresser of chemical mechanical polishing pad |
JP2001347454A (ja) * | 2000-06-09 | 2001-12-18 | Koremura Toishi Seisakusho:Kk | ドレッサーとその製造方法 |
US20070060026A1 (en) * | 2005-09-09 | 2007-03-15 | Chien-Min Sung | Methods of bonding superabrasive particles in an organic matrix |
US20060258276A1 (en) * | 2005-05-16 | 2006-11-16 | Chien-Min Sung | Superhard cutters and associated methods |
-
2006
- 2006-08-25 KR KR1020087005076A patent/KR101293461B1/ko not_active IP Right Cessation
- 2006-08-25 EP EP06796810A patent/EP1944125B1/en not_active Not-in-force
- 2006-08-25 WO PCT/JP2006/316737 patent/WO2007023949A1/ja active Application Filing
- 2006-08-25 CN CN2006800307352A patent/CN101247923B/zh not_active Expired - Fee Related
- 2006-08-25 JP JP2007532202A patent/JP5033630B2/ja not_active Expired - Fee Related
- 2006-08-25 TW TW095131436A patent/TWI406736B/zh not_active IP Right Cessation
- 2006-08-25 CA CA002620407A patent/CA2620407A1/en not_active Abandoned
- 2006-08-25 AU AU2006282293A patent/AU2006282293B2/en not_active Ceased
- 2006-08-25 RU RU2008110905/02A patent/RU2430827C2/ru not_active IP Right Cessation
- 2006-08-25 US US11/990,562 patent/US20090215366A1/en not_active Abandoned
- 2006-08-25 CN CN200910170789A patent/CN101693353A/zh active Pending
- 2006-08-25 BR BRPI0615020-9A patent/BRPI0615020A2/pt not_active IP Right Cessation
-
2008
- 2008-02-05 IL IL189314A patent/IL189314A/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1944125A1 (en) | 2008-07-16 |
CN101247923B (zh) | 2010-12-08 |
IL189314A (en) | 2013-01-31 |
JP5033630B2 (ja) | 2012-09-26 |
IL189314A0 (en) | 2008-06-05 |
WO2007023949A1 (ja) | 2007-03-01 |
AU2006282293B2 (en) | 2011-06-23 |
CA2620407A1 (en) | 2007-03-01 |
AU2006282293A1 (en) | 2007-03-01 |
KR20080037693A (ko) | 2008-04-30 |
RU2430827C2 (ru) | 2011-10-10 |
CN101247923A (zh) | 2008-08-20 |
TWI406736B (zh) | 2013-09-01 |
RU2008110905A (ru) | 2009-09-27 |
JPWO2007023949A1 (ja) | 2009-03-05 |
KR101293461B1 (ko) | 2013-08-07 |
US20090215366A1 (en) | 2009-08-27 |
EP1944125B1 (en) | 2012-01-25 |
TW200714416A (en) | 2007-04-16 |
CN101693353A (zh) | 2010-04-14 |
EP1944125A4 (en) | 2009-12-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE A 7A ANUIDADE. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2260 DE 29/04/2014. |