BRPI0615020A2 - ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma - Google Patents

ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma

Info

Publication number
BRPI0615020A2
BRPI0615020A2 BRPI0615020-9A BRPI0615020A BRPI0615020A2 BR PI0615020 A2 BRPI0615020 A2 BR PI0615020A2 BR PI0615020 A BRPI0615020 A BR PI0615020A BR PI0615020 A2 BRPI0615020 A2 BR PI0615020A2
Authority
BR
Brazil
Prior art keywords
polishing
tool
manufacturing
sintered
sintered body
Prior art date
Application number
BRPI0615020-9A
Other languages
English (en)
Inventor
Hiroshi Ishizuka
Original Assignee
Hiroshi Ishizuka
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hiroshi Ishizuka filed Critical Hiroshi Ishizuka
Publication of BRPI0615020A2 publication Critical patent/BRPI0615020A2/pt

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12Dressing tools; Holders therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/21Circular sheet or circular blank
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/2457Parallel ribs and/or grooves
    • Y10T428/24579Parallel ribs and/or grooves with particulate matter
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612Composite web or sheet

Abstract

FERRAMENTA COM SUPERFìCIE DE POLIMENTO DE CORPO SINTERIZADA E MéTODO DE FABRICAçãO DA MESMA. Uma ferramenta de polimento eficientemente processável, particularmente usada para um condicionador de disco de polimento CMP, capaz de solucionar problemas na força de fixação para fixar grãos abrasivos a uma chapa de base e problemas na superfície polida não uniforme e um método de efetivamente fabricar a ferramenta de polimento. A ferramenta de polimento (1) compreende uma peça de polimento feita de um corpo sinterizado de grãos super-abrasivos integralmente sinterizado com o material de revestimento de um carbureto cimentado. A peça de polimento compreende uma pluralidade de unidades de polimento (2) com peças de topo. As peças de topo são posicionadas sobre um plano aproximadamente igual. As unidades de polimento (2) são formadas por meio da formação de um grupo de ranhuras lineares (3) na peça de polimento.
BRPI0615020-9A 2005-08-25 2006-08-25 ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma BRPI0615020A2 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005243529 2005-08-25
JP2006209236 2006-07-31
PCT/JP2006/316737 WO2007023949A1 (ja) 2005-08-25 2006-08-25 焼結体研磨部を持つ工具およびその製造方法

Publications (1)

Publication Number Publication Date
BRPI0615020A2 true BRPI0615020A2 (pt) 2009-08-04

Family

ID=37771687

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0615020-9A BRPI0615020A2 (pt) 2005-08-25 2006-08-25 ferramenta com superfìcie de polimento de corpo sinterizada e método de fabricação da mesma

Country Status (12)

Country Link
US (1) US20090215366A1 (pt)
EP (1) EP1944125B1 (pt)
JP (1) JP5033630B2 (pt)
KR (1) KR101293461B1 (pt)
CN (2) CN101247923B (pt)
AU (1) AU2006282293B2 (pt)
BR (1) BRPI0615020A2 (pt)
CA (1) CA2620407A1 (pt)
IL (1) IL189314A (pt)
RU (1) RU2430827C2 (pt)
TW (1) TWI406736B (pt)
WO (1) WO2007023949A1 (pt)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009113133A (ja) * 2007-11-05 2009-05-28 Hiroshi Ishizuka Cmpパッド・コンディショナー
WO2011139562A2 (en) * 2010-04-27 2011-11-10 3M Innovative Properties Company Ceramic shaped abrasive particles, methods of making the same, and abrasive articles containing the same
US20120171935A1 (en) * 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
JP5809880B2 (ja) * 2011-08-25 2015-11-11 新日鉄住金マテリアルズ株式会社 研磨布用ドレッサー
KR102187425B1 (ko) 2011-12-30 2020-12-09 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자 및 이의 형성방법
CN102862121B (zh) * 2012-09-17 2015-05-20 上海华力微电子有限公司 一种cmp研磨垫修整结构
ES2756849T3 (es) * 2013-08-07 2020-04-27 Reishauer Ag Herramienta rectificadora y procedimiento para su fabricación
JP5976228B2 (ja) * 2013-08-26 2016-08-23 株式会社東京精密 ダイシングブレード
WO2015057562A1 (en) * 2013-10-18 2015-04-23 3M Innovative Properties Company Coated abrasive article and method of making the same
WO2015143278A1 (en) * 2014-03-21 2015-09-24 Entegris, Inc. Chemical mechanical planarization pad conditioner with elongated cutting edges
TWI609742B (zh) * 2015-04-20 2018-01-01 中國砂輪企業股份有限公司 研磨工具
US11819979B2 (en) 2016-02-22 2023-11-21 A.L.M.T. Corp. Abrasive tool
CN106078516B (zh) * 2016-06-21 2018-09-04 大连理工大学 一种cmp抛光垫修整器
CN110650819B (zh) * 2017-05-12 2022-08-09 3M创新有限公司 磨料制品中的四面体磨料颗粒
JP2021504171A (ja) 2017-11-21 2021-02-15 スリーエム イノベイティブ プロパティズ カンパニー 被覆研磨ディスク並びにその製造方法及び使用方法
US11607775B2 (en) 2017-11-21 2023-03-21 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
WO2019102329A1 (en) * 2017-11-21 2019-05-31 3M Innovative Properties Company Coated abrasive disc and methods of making and using the same
KR102026250B1 (ko) * 2018-02-05 2019-09-27 에스케이실트론 주식회사 웨이퍼 연마 장치용 연마 패드 및 그의 제조방법
MX2020011232A (es) * 2018-04-27 2020-11-11 Sumitomo Electric Industries Granos abrasivos policristalinos y muela abrasiva que comprenden los mismos.
TWI735795B (zh) * 2018-08-24 2021-08-11 宋健民 拋光墊修整器及化學機械平坦化的方法
KR102440315B1 (ko) * 2020-05-11 2022-09-06 한국생산기술연구원 패턴구조를 갖는 화학기계적 연마용 패드 및 이의 제조방법
CN112677062B (zh) * 2019-10-18 2022-12-09 江苏韦尔博新材料科技有限公司 一种打磨钢材磨盘的专用磨粒地貌、其金刚石磨盘与制备方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5739106A (en) * 1980-08-14 1982-03-04 Hiroshi Ishizuka Production of diamond ultrahard alloy composite
JPS58199776A (ja) * 1982-05-12 1983-11-21 住友電気工業株式会社 工具用ダイヤモンド焼結体及びその製造方法
JPS6184303A (ja) * 1984-09-28 1986-04-28 Ishizuka Kenkyusho:Kk 複合焼結体の製造法
JP2601284B2 (ja) * 1987-09-01 1997-04-16 株式会社石塚研究所 焼結ダイヤモンド複合体、及びその製造方法
US4925457B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Method for making an abrasive tool
US5049165B1 (en) * 1989-01-30 1995-09-26 Ultimate Abrasive Syst Inc Composite material
US4954139A (en) * 1989-03-31 1990-09-04 The General Electric Company Method for producing polycrystalline compact tool blanks with flat carbide support/diamond or CBN interfaces
JPH08243927A (ja) * 1995-03-02 1996-09-24 Fuji Xerox Co Ltd 研削工具とその製造方法及び研削装置
US5560754A (en) * 1995-06-13 1996-10-01 General Electric Company Reduction of stresses in the polycrystalline abrasive layer of a composite compact with in situ bonded carbide/carbide support
JPH09254042A (ja) * 1996-03-15 1997-09-30 Symtec:Kk 溝切り用砥石およびその製造方法
JP2957519B2 (ja) * 1996-05-23 1999-10-04 旭ダイヤモンド工業株式会社 半導体ウェーハ研磨パッド用ドレッサ及びその製造方法
JPH10138120A (ja) * 1996-10-31 1998-05-26 Kyocera Corp ドレッシング用治具
US6054183A (en) * 1997-07-10 2000-04-25 Zimmer; Jerry W. Method for making CVD diamond coated substrate for polishing pad conditioning head
US6027659A (en) * 1997-12-03 2000-02-22 Intel Corporation Polishing pad conditioning surface having integral conditioning points
JPH11267902A (ja) * 1998-03-23 1999-10-05 Hiroshi Hashimoto 超微細切刃付き工具及び超微細切刃付き加工具
JP2000190200A (ja) * 1998-12-25 2000-07-11 Mitsubishi Materials Silicon Corp 研磨布のシ―ズニング治具
JP4332980B2 (ja) * 1999-03-18 2009-09-16 株式会社デンソー ハニカム構造体成形用金型の製造方法
JP2001088028A (ja) * 1999-09-17 2001-04-03 Koremura Toishi Seisakusho:Kk ロータリードレッサー
TW467802B (en) * 1999-10-12 2001-12-11 Hunatech Co Ltd Conditioner for polishing pad and method for manufacturing the same
KR100387954B1 (ko) * 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
TW436375B (en) * 1999-11-16 2001-05-28 Asia Ic Mic Process Inc Formation method for dresser of chemical mechanical polishing pad
JP2001347454A (ja) * 2000-06-09 2001-12-18 Koremura Toishi Seisakusho:Kk ドレッサーとその製造方法
US20070060026A1 (en) * 2005-09-09 2007-03-15 Chien-Min Sung Methods of bonding superabrasive particles in an organic matrix
US20060258276A1 (en) * 2005-05-16 2006-11-16 Chien-Min Sung Superhard cutters and associated methods

Also Published As

Publication number Publication date
EP1944125A1 (en) 2008-07-16
CN101247923B (zh) 2010-12-08
IL189314A (en) 2013-01-31
JP5033630B2 (ja) 2012-09-26
IL189314A0 (en) 2008-06-05
WO2007023949A1 (ja) 2007-03-01
AU2006282293B2 (en) 2011-06-23
CA2620407A1 (en) 2007-03-01
AU2006282293A1 (en) 2007-03-01
KR20080037693A (ko) 2008-04-30
RU2430827C2 (ru) 2011-10-10
CN101247923A (zh) 2008-08-20
TWI406736B (zh) 2013-09-01
RU2008110905A (ru) 2009-09-27
JPWO2007023949A1 (ja) 2009-03-05
KR101293461B1 (ko) 2013-08-07
US20090215366A1 (en) 2009-08-27
EP1944125B1 (en) 2012-01-25
TW200714416A (en) 2007-04-16
CN101693353A (zh) 2010-04-14
EP1944125A4 (en) 2009-12-16

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 7A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: REFERENTE AO DESPACHO 8.6 PUBLICADO NA RPI 2260 DE 29/04/2014.