TWI401730B - 曝光方法、曝光設備及製造裝置之方法 - Google Patents

曝光方法、曝光設備及製造裝置之方法 Download PDF

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Publication number
TWI401730B
TWI401730B TW098105140A TW98105140A TWI401730B TW I401730 B TWI401730 B TW I401730B TW 098105140 A TW098105140 A TW 098105140A TW 98105140 A TW98105140 A TW 98105140A TW I401730 B TWI401730 B TW I401730B
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TW
Taiwan
Prior art keywords
substrate
magnification
observer
mark
correction value
Prior art date
Application number
TW098105140A
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English (en)
Chinese (zh)
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TW200952039A (en
Inventor
Nozomu Hayashi
Original Assignee
Canon Kk
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Publication date
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Publication of TW200952039A publication Critical patent/TW200952039A/zh
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Publication of TWI401730B publication Critical patent/TWI401730B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706851—Detection branch, e.g. detector arrangements, polarisation control, wavelength control or dark/bright field detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW098105140A 2008-02-29 2009-02-18 曝光方法、曝光設備及製造裝置之方法 TWI401730B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008051114A JP5096965B2 (ja) 2008-02-29 2008-02-29 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法

Publications (2)

Publication Number Publication Date
TW200952039A TW200952039A (en) 2009-12-16
TWI401730B true TWI401730B (zh) 2013-07-11

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Family Applications (1)

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TW098105140A TWI401730B (zh) 2008-02-29 2009-02-18 曝光方法、曝光設備及製造裝置之方法

Country Status (4)

Country Link
US (2) US8390809B2 (enExample)
JP (1) JP5096965B2 (enExample)
KR (1) KR101093388B1 (enExample)
TW (1) TWI401730B (enExample)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5975785B2 (ja) * 2012-08-14 2016-08-23 株式会社アドテックエンジニアリング 描画装置、露光描画装置、プログラム及び描画方法
JP6188382B2 (ja) 2013-04-03 2017-08-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6465565B2 (ja) * 2014-05-19 2019-02-06 キヤノン株式会社 露光装置、位置合わせ方法およびデバイス製造方法
JP6426984B2 (ja) * 2014-11-18 2018-11-21 キヤノン株式会社 リソグラフィ装置および物品製造方法
US9928474B1 (en) 2014-12-12 2018-03-27 Amazon Technologies, Inc. Mobile base utilizing transportation units for delivering items
JP6521637B2 (ja) * 2015-01-09 2019-05-29 キヤノン株式会社 計測装置、リソグラフィ装置及び物品の製造方法
US9745130B1 (en) 2015-03-13 2017-08-29 Amazon Technologies, Inc. Pickup locations with modifiable storage compartment configurations
JP6353487B2 (ja) * 2016-05-26 2018-07-04 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法
US10216188B2 (en) 2016-07-25 2019-02-26 Amazon Technologies, Inc. Autonomous ground vehicles based at delivery locations
US10248120B1 (en) 2016-09-16 2019-04-02 Amazon Technologies, Inc. Navigable path networks for autonomous vehicles
US10245993B1 (en) 2016-09-29 2019-04-02 Amazon Technologies, Inc. Modular autonomous ground vehicles
US10303171B1 (en) 2016-09-29 2019-05-28 Amazon Technologies, Inc. Autonomous ground vehicles providing ordered items in pickup areas
US10241516B1 (en) 2016-09-29 2019-03-26 Amazon Technologies, Inc. Autonomous ground vehicles deployed from facilities
US10222798B1 (en) 2016-09-29 2019-03-05 Amazon Technologies, Inc. Autonomous ground vehicles congregating in meeting areas
US10233021B1 (en) 2016-11-02 2019-03-19 Amazon Technologies, Inc. Autonomous vehicles for delivery and safety
US10514690B1 (en) 2016-11-15 2019-12-24 Amazon Technologies, Inc. Cooperative autonomous aerial and ground vehicles for item delivery
US11263579B1 (en) 2016-12-05 2022-03-01 Amazon Technologies, Inc. Autonomous vehicle networks
US10308430B1 (en) 2016-12-23 2019-06-04 Amazon Technologies, Inc. Distribution and retrieval of inventory and materials using autonomous vehicles
US10310499B1 (en) 2016-12-23 2019-06-04 Amazon Technologies, Inc. Distributed production of items from locally sourced materials using autonomous vehicles
US10310500B1 (en) 2016-12-23 2019-06-04 Amazon Technologies, Inc. Automated access to secure facilities using autonomous vehicles
US10573106B1 (en) 2017-03-22 2020-02-25 Amazon Technologies, Inc. Personal intermediary access device
US10147249B1 (en) 2017-03-22 2018-12-04 Amazon Technologies, Inc. Personal intermediary communication device
US11232391B1 (en) 2017-08-31 2022-01-25 Amazon Technologies, Inc. Customized indoor and outdoor navigation maps and routes for autonomous vehicles
JP6688273B2 (ja) * 2017-11-13 2020-04-28 キヤノン株式会社 リソグラフィ装置、リソグラフィ方法、決定方法及び物品の製造方法
US11392130B1 (en) 2018-12-12 2022-07-19 Amazon Technologies, Inc. Selecting delivery modes and delivery areas using autonomous ground vehicles
US11474530B1 (en) 2019-08-15 2022-10-18 Amazon Technologies, Inc. Semantic navigation of autonomous ground vehicles
US10796562B1 (en) 2019-09-26 2020-10-06 Amazon Technologies, Inc. Autonomous home security devices
US11260970B2 (en) 2019-09-26 2022-03-01 Amazon Technologies, Inc. Autonomous home security devices
JP7523904B2 (ja) * 2019-12-27 2024-07-29 キヤノン株式会社 検査装置および半導体装置の製造方法
JP2023083824A (ja) * 2021-12-06 2023-06-16 キヤノン株式会社 検出装置、基板処理装置、及び物品の製造方法
US12203773B1 (en) 2022-06-29 2025-01-21 Amazon Technologies, Inc. Visual localization for autonomous ground vehicles
US12280889B1 (en) 2022-06-30 2025-04-22 Amazon Technologies, Inc. Indoor navigation and obstacle avoidance for unmanned aerial vehicles
US12461228B1 (en) 2022-08-29 2025-11-04 Amazon Technologies, Inc. Radar-inertial odometry for autonomous ground vehicles
US12205072B1 (en) 2022-09-13 2025-01-21 Amazon Technologies, Inc. Fulfilling orders for multiple items from multiple sources via multimodal channels
US12346128B1 (en) 2022-09-30 2025-07-01 Amazon Technologies, Inc. Indoor altitude determination for aerial vehicles
US12479606B1 (en) 2023-03-30 2025-11-25 Amazon Technologies, Inc. Indoor aerial vehicles with advanced safety features
US12202634B1 (en) 2023-03-30 2025-01-21 Amazon Technologies, Inc. Indoor aerial vehicles with advanced safety features
US12205483B1 (en) * 2023-06-26 2025-01-21 Amazon Technologies, Inc. Selecting paths for indoor obstacle avoidance by unmanned aerial vehicles
US12227318B1 (en) 2023-09-28 2025-02-18 Amazon Technologies, Inc. Aerial vehicles with proximity sensors for safety
JP2025169629A (ja) * 2024-05-01 2025-11-14 キヤノン株式会社 基板処理方法、基板処理装置、および物品製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2606285B2 (ja) * 1988-06-07 1997-04-30 株式会社ニコン 露光装置および位置合わせ方法
JP2756620B2 (ja) * 1992-01-10 1998-05-25 キヤノン株式会社 半導体露光方法およびその装置
JPH08130180A (ja) * 1994-10-28 1996-05-21 Nikon Corp 露光方法
JP3516546B2 (ja) * 1995-12-22 2004-04-05 株式会社ルネサステクノロジ 重ね合せ誤差の低減方法
JP2000156336A (ja) * 1998-11-20 2000-06-06 Nikon Corp アライメント方法及び露光装置
JP2001135559A (ja) * 1999-11-02 2001-05-18 Nikon Corp 位置計測方法及び露光方法
JP4454773B2 (ja) 2000-03-21 2010-04-21 キヤノン株式会社 位置合わせ方法及び位置合わせ装置
JP2003092246A (ja) 2001-09-17 2003-03-28 Canon Inc アライメントマーク及びアライメント装置とその方法、及び露光装置、デバイスの製造方法
JP2003092248A (ja) * 2001-09-17 2003-03-28 Canon Inc 位置検出装置、位置決め装置及びそれらの方法並びに露光装置及びデバイスの製造方法
JP4366031B2 (ja) * 2001-09-17 2009-11-18 キヤノン株式会社 位置検出装置及び方法並びに露光装置、デバイスの製造方法
JP4165871B2 (ja) * 2002-03-15 2008-10-15 キヤノン株式会社 位置検出方法、位置検出装置及び露光装置
JP2004158741A (ja) * 2002-11-08 2004-06-03 Canon Inc 位置合わせ装置
JP2005217333A (ja) 2004-02-02 2005-08-11 Canon Inc 半導体露光方法及び半導体露光装置

Also Published As

Publication number Publication date
US20090219533A1 (en) 2009-09-03
TW200952039A (en) 2009-12-16
US20130148123A1 (en) 2013-06-13
US8390809B2 (en) 2013-03-05
JP2009212153A (ja) 2009-09-17
JP5096965B2 (ja) 2012-12-12
KR101093388B1 (ko) 2011-12-14
KR20090093899A (ko) 2009-09-02
US8885164B2 (en) 2014-11-11

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