JP5096965B2 - 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法 - Google Patents

位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法 Download PDF

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JP5096965B2
JP5096965B2 JP2008051114A JP2008051114A JP5096965B2 JP 5096965 B2 JP5096965 B2 JP 5096965B2 JP 2008051114 A JP2008051114 A JP 2008051114A JP 2008051114 A JP2008051114 A JP 2008051114A JP 5096965 B2 JP5096965 B2 JP 5096965B2
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Japanese (ja)
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JP2009212153A5 (enExample
JP2009212153A (ja
Inventor
望 林
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Canon Inc
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Canon Inc
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2008051114A priority Critical patent/JP5096965B2/ja
Priority to US12/370,827 priority patent/US8390809B2/en
Priority to TW098105140A priority patent/TWI401730B/zh
Priority to KR1020090017252A priority patent/KR101093388B1/ko
Publication of JP2009212153A publication Critical patent/JP2009212153A/ja
Publication of JP2009212153A5 publication Critical patent/JP2009212153A5/ja
Application granted granted Critical
Publication of JP5096965B2 publication Critical patent/JP5096965B2/ja
Priority to US13/759,319 priority patent/US8885164B2/en
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70516—Calibration of components of the microlithographic apparatus, e.g. light sources, addressable masks or detectors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706851—Detection branch, e.g. detector arrangements, polarisation control, wavelength control or dark/bright field detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2008051114A 2008-02-29 2008-02-29 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法 Active JP5096965B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008051114A JP5096965B2 (ja) 2008-02-29 2008-02-29 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法
US12/370,827 US8390809B2 (en) 2008-02-29 2009-02-13 Exposure method, exposure apparatus, and method of manufacturing device
TW098105140A TWI401730B (zh) 2008-02-29 2009-02-18 曝光方法、曝光設備及製造裝置之方法
KR1020090017252A KR101093388B1 (ko) 2008-02-29 2009-02-27 노광 방법, 노광 장치 및 디바이스 제조 방법
US13/759,319 US8885164B2 (en) 2008-02-29 2013-02-05 Exposure method, exposure apparatus, and method of manufacturing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008051114A JP5096965B2 (ja) 2008-02-29 2008-02-29 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法

Publications (3)

Publication Number Publication Date
JP2009212153A JP2009212153A (ja) 2009-09-17
JP2009212153A5 JP2009212153A5 (enExample) 2011-04-14
JP5096965B2 true JP5096965B2 (ja) 2012-12-12

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JP2008051114A Active JP5096965B2 (ja) 2008-02-29 2008-02-29 位置合わせ方法、位置合わせ装置、露光方法及びデバイス製造方法

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US (2) US8390809B2 (enExample)
JP (1) JP5096965B2 (enExample)
KR (1) KR101093388B1 (enExample)
TW (1) TWI401730B (enExample)

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JP6188382B2 (ja) 2013-04-03 2017-08-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6465565B2 (ja) * 2014-05-19 2019-02-06 キヤノン株式会社 露光装置、位置合わせ方法およびデバイス製造方法
JP6426984B2 (ja) * 2014-11-18 2018-11-21 キヤノン株式会社 リソグラフィ装置および物品製造方法
US9928474B1 (en) 2014-12-12 2018-03-27 Amazon Technologies, Inc. Mobile base utilizing transportation units for delivering items
JP6521637B2 (ja) * 2015-01-09 2019-05-29 キヤノン株式会社 計測装置、リソグラフィ装置及び物品の製造方法
US9745130B1 (en) 2015-03-13 2017-08-29 Amazon Technologies, Inc. Pickup locations with modifiable storage compartment configurations
JP6353487B2 (ja) * 2016-05-26 2018-07-04 株式会社サーマプレシジョン 投影露光装置及びその投影露光方法
US10216188B2 (en) 2016-07-25 2019-02-26 Amazon Technologies, Inc. Autonomous ground vehicles based at delivery locations
US10248120B1 (en) 2016-09-16 2019-04-02 Amazon Technologies, Inc. Navigable path networks for autonomous vehicles
US10245993B1 (en) 2016-09-29 2019-04-02 Amazon Technologies, Inc. Modular autonomous ground vehicles
US10303171B1 (en) 2016-09-29 2019-05-28 Amazon Technologies, Inc. Autonomous ground vehicles providing ordered items in pickup areas
US10241516B1 (en) 2016-09-29 2019-03-26 Amazon Technologies, Inc. Autonomous ground vehicles deployed from facilities
US10222798B1 (en) 2016-09-29 2019-03-05 Amazon Technologies, Inc. Autonomous ground vehicles congregating in meeting areas
US10233021B1 (en) 2016-11-02 2019-03-19 Amazon Technologies, Inc. Autonomous vehicles for delivery and safety
US10514690B1 (en) 2016-11-15 2019-12-24 Amazon Technologies, Inc. Cooperative autonomous aerial and ground vehicles for item delivery
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US10308430B1 (en) 2016-12-23 2019-06-04 Amazon Technologies, Inc. Distribution and retrieval of inventory and materials using autonomous vehicles
US10310499B1 (en) 2016-12-23 2019-06-04 Amazon Technologies, Inc. Distributed production of items from locally sourced materials using autonomous vehicles
US10310500B1 (en) 2016-12-23 2019-06-04 Amazon Technologies, Inc. Automated access to secure facilities using autonomous vehicles
US10573106B1 (en) 2017-03-22 2020-02-25 Amazon Technologies, Inc. Personal intermediary access device
US10147249B1 (en) 2017-03-22 2018-12-04 Amazon Technologies, Inc. Personal intermediary communication device
US11232391B1 (en) 2017-08-31 2022-01-25 Amazon Technologies, Inc. Customized indoor and outdoor navigation maps and routes for autonomous vehicles
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JP7523904B2 (ja) * 2019-12-27 2024-07-29 キヤノン株式会社 検査装置および半導体装置の製造方法
JP2023083824A (ja) * 2021-12-06 2023-06-16 キヤノン株式会社 検出装置、基板処理装置、及び物品の製造方法
US12203773B1 (en) 2022-06-29 2025-01-21 Amazon Technologies, Inc. Visual localization for autonomous ground vehicles
US12280889B1 (en) 2022-06-30 2025-04-22 Amazon Technologies, Inc. Indoor navigation and obstacle avoidance for unmanned aerial vehicles
US12461228B1 (en) 2022-08-29 2025-11-04 Amazon Technologies, Inc. Radar-inertial odometry for autonomous ground vehicles
US12205072B1 (en) 2022-09-13 2025-01-21 Amazon Technologies, Inc. Fulfilling orders for multiple items from multiple sources via multimodal channels
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Also Published As

Publication number Publication date
US20090219533A1 (en) 2009-09-03
TW200952039A (en) 2009-12-16
US20130148123A1 (en) 2013-06-13
US8390809B2 (en) 2013-03-05
JP2009212153A (ja) 2009-09-17
KR101093388B1 (ko) 2011-12-14
KR20090093899A (ko) 2009-09-02
US8885164B2 (en) 2014-11-11
TWI401730B (zh) 2013-07-11

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