TWI397955B - The cutting device of the workpiece - Google Patents

The cutting device of the workpiece Download PDF

Info

Publication number
TWI397955B
TWI397955B TW095131778A TW95131778A TWI397955B TW I397955 B TWI397955 B TW I397955B TW 095131778 A TW095131778 A TW 095131778A TW 95131778 A TW95131778 A TW 95131778A TW I397955 B TWI397955 B TW I397955B
Authority
TW
Taiwan
Prior art keywords
cutting
workpiece
liquid
semiconductor wafer
cutting fluid
Prior art date
Application number
TW095131778A
Other languages
English (en)
Chinese (zh)
Other versions
TW200715392A (en
Inventor
Seishi Sato
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of TW200715392A publication Critical patent/TW200715392A/zh
Application granted granted Critical
Publication of TWI397955B publication Critical patent/TWI397955B/zh

Links

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Dicing (AREA)
  • Crushing And Pulverization Processes (AREA)
TW095131778A 2005-09-05 2006-08-29 The cutting device of the workpiece TWI397955B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005256747A JP4880267B2 (ja) 2005-09-05 2005-09-05 切削装置

Publications (2)

Publication Number Publication Date
TW200715392A TW200715392A (en) 2007-04-16
TWI397955B true TWI397955B (zh) 2013-06-01

Family

ID=37931186

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095131778A TWI397955B (zh) 2005-09-05 2006-08-29 The cutting device of the workpiece

Country Status (2)

Country Link
JP (1) JP4880267B2 (ja)
TW (1) TWI397955B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5446027B2 (ja) * 2007-09-25 2014-03-19 株式会社東京精密 ダイシング装置
JP5458460B2 (ja) * 2008-09-08 2014-04-02 株式会社東京精密 切削加工装置及び切削加工方法
JP5422176B2 (ja) * 2008-11-06 2014-02-19 株式会社ディスコ 保持テーブルおよび切削装置
JP2011016170A (ja) * 2009-07-07 2011-01-27 Disco Abrasive Syst Ltd 切削装置
JP5511325B2 (ja) * 2009-11-18 2014-06-04 株式会社ディスコ 切削装置
JP6227985B2 (ja) * 2013-11-28 2017-11-08 株式会社ディスコ 切削装置
CN108312369B (zh) * 2018-03-28 2024-05-07 深圳赛意法微电子有限公司 晶圆切割设备及晶圆切割方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS621911U (ja) * 1985-06-21 1987-01-08
JPH01209104A (ja) * 1988-02-17 1989-08-22 Disco Abrasive Syst Ltd 加工装置
JPH0817765A (ja) * 1994-07-01 1996-01-19 Sony Corp 半導体ウエハ用ダイシング装置
JP2003142431A (ja) * 2001-11-02 2003-05-16 Disco Abrasive Syst Ltd 切削水ノズル

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58163615A (ja) * 1982-03-24 1983-09-28 富士通株式会社 ウエ−ハ切削方法
JPS621911A (ja) * 1985-06-26 1987-01-07 石川島播磨重工業株式会社 橋梁等の補修用作業車及びその架設方法
JPS6480506A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Dicer
JPH07115075A (ja) * 1993-10-18 1995-05-02 Sony Corp ウェーハのダイシング装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS621911U (ja) * 1985-06-21 1987-01-08
JPH01209104A (ja) * 1988-02-17 1989-08-22 Disco Abrasive Syst Ltd 加工装置
JPH0817765A (ja) * 1994-07-01 1996-01-19 Sony Corp 半導体ウエハ用ダイシング装置
JP2003142431A (ja) * 2001-11-02 2003-05-16 Disco Abrasive Syst Ltd 切削水ノズル

Also Published As

Publication number Publication date
JP4880267B2 (ja) 2012-02-22
JP2007069280A (ja) 2007-03-22
TW200715392A (en) 2007-04-16

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