TWI395629B - Laser processing method and device - Google Patents

Laser processing method and device Download PDF

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Publication number
TWI395629B
TWI395629B TW096113904A TW96113904A TWI395629B TW I395629 B TWI395629 B TW I395629B TW 096113904 A TW096113904 A TW 096113904A TW 96113904 A TW96113904 A TW 96113904A TW I395629 B TWI395629 B TW I395629B
Authority
TW
Taiwan
Prior art keywords
laser
workpiece
laser beam
optical system
irradiated
Prior art date
Application number
TW096113904A
Other languages
English (en)
Chinese (zh)
Other versions
TW200800456A (en
Original Assignee
Hitachi Shipbuilding Eng Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Shipbuilding Eng Co filed Critical Hitachi Shipbuilding Eng Co
Publication of TW200800456A publication Critical patent/TW200800456A/zh
Application granted granted Critical
Publication of TWI395629B publication Critical patent/TWI395629B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer, layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H05K2203/108—Using a plurality of lasers or laser light with a plurality of wavelengths
TW096113904A 2006-04-27 2007-04-20 Laser processing method and device TWI395629B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006124084A JP5025158B2 (ja) 2006-04-27 2006-04-27 レーザ加工方法及び装置

Publications (2)

Publication Number Publication Date
TW200800456A TW200800456A (en) 2008-01-01
TWI395629B true TWI395629B (zh) 2013-05-11

Family

ID=38655326

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096113904A TWI395629B (zh) 2006-04-27 2007-04-20 Laser processing method and device

Country Status (7)

Country Link
US (1) US8097829B2 (ko)
EP (1) EP2011599B1 (ko)
JP (1) JP5025158B2 (ko)
KR (1) KR101372350B1 (ko)
CN (1) CN101432094B (ko)
TW (1) TWI395629B (ko)
WO (1) WO2007125799A1 (ko)

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DE102007055530A1 (de) * 2007-11-21 2009-05-28 Carl Zeiss Ag Laserstrahlbearbeitung
JP5377086B2 (ja) * 2009-06-04 2013-12-25 株式会社日立ハイテクノロジーズ レーザ加工方法、レーザ加工装置及びソーラパネル製造方法
EP2465634B1 (en) * 2009-08-11 2021-11-10 Hamamatsu Photonics K.K. Laser machining device and laser machining method
JP2011045916A (ja) * 2009-08-28 2011-03-10 Hitachi High-Technologies Corp レーザ処理装置、太陽電池パネルの製造装置、太陽電池パネルおよびレーザ処理方法
WO2011060582A1 (zh) * 2009-11-19 2011-05-26 深圳市大族激光科技股份有限公司 多头激光加工方法及其装置
CN102510788B (zh) * 2010-06-14 2014-12-24 三菱电机株式会社 激光加工装置以及激光加工方法
KR20140062427A (ko) * 2011-09-15 2014-05-23 니폰 덴키 가라스 가부시키가이샤 유리판 절단 방법
KR101379411B1 (ko) * 2011-11-01 2014-04-01 주식회사 이오테크닉스 레이저 절단 장치 및 레이저 절단 방법
DE102012201194A1 (de) * 2012-01-20 2013-07-25 Rofin-Baasel Lasertech Gmbh & Co. Kg Vorrichtung zum Laserbearbeiten eines Werkstückes
WO2013116443A1 (en) * 2012-02-01 2013-08-08 Nscrypt, Inc. Micro-dispensing multi-layered 3d objects with curing steps
US9991090B2 (en) * 2012-11-15 2018-06-05 Fei Company Dual laser beam system used with an electron microscope and FIB
DE102015207279A1 (de) * 2015-04-22 2016-10-27 Ipg Laser Gmbh Fügevorrichtung und Fügeverfahren
AT517185B1 (de) * 2015-05-13 2017-06-15 Trotec Laser Gmbh Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes () mit einem
AT519177B1 (de) * 2016-10-06 2019-04-15 Trotec Laser Gmbh Verfahren zum Gravieren, Markieren und/oder Beschriften eines Werkstückes mit
US11064611B2 (en) * 2018-06-29 2021-07-13 Ipg Photonics Corporation Patterning and removal of circuit board material using ultrafast lasers
CN110076450A (zh) * 2019-05-10 2019-08-02 华中科技大学 双光束激光加工光学系统
CN114682934B (zh) * 2022-06-01 2022-09-20 杭州凌像科技有限公司 多脉宽复合的印制电路板激光加工装置

Citations (2)

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JPH10277764A (ja) * 1997-04-07 1998-10-20 Nippon Steel Corp 厚鋼板のレーザ切断方法及び装置
US20020021723A1 (en) * 2000-08-02 2002-02-21 Seiko Epson Corporation Method and apparatus for laser processing

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EP0577833A4 (en) * 1991-01-11 1994-06-29 Nippon Steel Corp Cooling drum for casting thin cast piece; device for and method of forming dimples on peripheral surface of said drum
JPH0810970A (ja) 1994-06-22 1996-01-16 Sony Corp レーザ加工装置及び方法
JP3772395B2 (ja) * 1996-05-14 2006-05-10 スズキ株式会社 レーザ溶接方法
KR970077142A (ko) * 1996-05-30 1997-12-12 김광호 펄스파 레이저 증착법을 이용한 고온 초전도 박막 제조 장치 및 그 방법
JPH1034364A (ja) * 1996-07-25 1998-02-10 Souei Tsusho Kk 複数点熱源による脆性材料の割断加工方法
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JP2002542043A (ja) 1999-04-27 2002-12-10 ジーエスアイ ルモニクス インコーポレイテッド 多重レーザビームを使用する材料処理システム及び方法
JP4580065B2 (ja) * 2000-07-10 2010-11-10 ミヤチテクノス株式会社 レーザ溶接方法及び装置
JP2002219590A (ja) * 2001-01-26 2002-08-06 Nippon Steel Corp 亜鉛めっき鋼板の重ねレーザー溶接方法
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Publication number Priority date Publication date Assignee Title
JPH10277764A (ja) * 1997-04-07 1998-10-20 Nippon Steel Corp 厚鋼板のレーザ切断方法及び装置
US20020021723A1 (en) * 2000-08-02 2002-02-21 Seiko Epson Corporation Method and apparatus for laser processing

Also Published As

Publication number Publication date
CN101432094A (zh) 2009-05-13
CN101432094B (zh) 2012-10-31
US8097829B2 (en) 2012-01-17
KR20090013785A (ko) 2009-02-05
US20090057284A1 (en) 2009-03-05
KR101372350B1 (ko) 2014-03-12
WO2007125799A1 (ja) 2007-11-08
EP2011599A4 (en) 2009-11-18
JP2007296533A (ja) 2007-11-15
TW200800456A (en) 2008-01-01
JP5025158B2 (ja) 2012-09-12
EP2011599B1 (en) 2012-11-21
EP2011599A1 (en) 2009-01-07

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MM4A Annulment or lapse of patent due to non-payment of fees