TWI394629B - Laser processing device - Google Patents
Laser processing device Download PDFInfo
- Publication number
- TWI394629B TWI394629B TW097125518A TW97125518A TWI394629B TW I394629 B TWI394629 B TW I394629B TW 097125518 A TW097125518 A TW 097125518A TW 97125518 A TW97125518 A TW 97125518A TW I394629 B TWI394629 B TW I394629B
- Authority
- TW
- Taiwan
- Prior art keywords
- mirror
- laser
- concave
- laser beam
- optical path
- Prior art date
Links
- 230000003287 optical effect Effects 0.000 claims description 68
- 230000007246 mechanism Effects 0.000 claims description 54
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 239000010931 gold Substances 0.000 claims description 7
- 229910052737 gold Inorganic materials 0.000 claims description 7
- 230000003028 elevating effect Effects 0.000 claims description 6
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 36
- 239000011521 glass Substances 0.000 description 29
- 239000000463 material Substances 0.000 description 22
- 238000000034 method Methods 0.000 description 14
- 238000001816 cooling Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 230000006870 function Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 230000001965 increasing effect Effects 0.000 description 4
- 239000003245 coal Substances 0.000 description 3
- 238000000608 laser ablation Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000002826 coolant Substances 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- SBIBMFFZSBJNJF-UHFFFAOYSA-N selenium;zinc Chemical compound [Se]=[Zn] SBIBMFFZSBJNJF-UHFFFAOYSA-N 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000004093 laser heating Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007252094A JP5060893B2 (ja) | 2007-09-27 | 2007-09-27 | レーザ加工装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200914188A TW200914188A (en) | 2009-04-01 |
| TWI394629B true TWI394629B (zh) | 2013-05-01 |
Family
ID=40516055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097125518A TWI394629B (zh) | 2007-09-27 | 2008-07-07 | Laser processing device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5060893B2 (enExample) |
| KR (1) | KR101193855B1 (enExample) |
| CN (1) | CN101397185A (enExample) |
| TW (1) | TWI394629B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5281544B2 (ja) * | 2009-10-30 | 2013-09-04 | 三星ダイヤモンド工業株式会社 | ブレイク装置 |
| CN102738313B (zh) * | 2011-04-01 | 2015-03-18 | 山东华光光电子有限公司 | 一种提高led芯片出光的芯片切割方法 |
| CN102699528A (zh) * | 2012-06-28 | 2012-10-03 | 镒生电线塑料(昆山)有限公司 | 镭射加工装置的改良结构 |
| CN103060795B (zh) * | 2012-11-22 | 2015-01-07 | 北京工业大学 | 一种熔覆层宽度实时可变的激光加工工作头 |
| CN104071974B (zh) * | 2014-06-20 | 2016-04-13 | 武汉先河激光技术有限公司 | 一种用于玻璃切割的激光设备及切割方法 |
| CN106466763A (zh) * | 2015-08-12 | 2017-03-01 | 苏州领创激光科技有限公司 | 具有多参数设定功能的激光切割机 |
| CN106466764A (zh) * | 2015-08-12 | 2017-03-01 | 苏州领创激光科技有限公司 | 具有实时调整工艺参数功能的激光切割头 |
| KR102042659B1 (ko) * | 2017-03-21 | 2019-11-08 | (주)컨셉션 | 다중 레이저의 중첩을 이용한 레이저 고출력 변환장치 |
| CN108692680B (zh) * | 2018-08-13 | 2023-12-26 | 北京行易道科技有限公司 | 激光标定工装 |
| CN109581667A (zh) * | 2019-01-10 | 2019-04-05 | 延锋伟世通电子科技（上海）有限公司 | 一种用于车载抬头显示器的光学投影装置 |
| RU209801U1 (ru) * | 2021-11-29 | 2022-03-23 | Валерий Иванович Ревенко | Устройство лазерной резки образца из хрупкого неметаллического материала |
| CN114952013B (zh) * | 2022-04-28 | 2024-06-18 | 维达力科技股份有限公司 | 3d玻璃盖板及其制备方法、电子产品 |
| CN114952047A (zh) * | 2022-06-15 | 2022-08-30 | 无锡镭科曼数控科技有限公司 | 一种大幅面激光切割机自动纠错机构 |
| CN116551217B (zh) * | 2023-07-10 | 2023-09-12 | 大量科技（涟水）有限公司 | 一种数控机床激光切割机 |
| JP7435936B1 (ja) * | 2023-07-18 | 2024-02-21 | 三菱電機株式会社 | ガルバノスキャナ及びレーザ加工機 |
| CN117161477B (zh) * | 2023-10-31 | 2024-07-02 | 临沂友诚制锯技术服务有限公司 | 圆弧光路锯齿加工工艺 |
| CN118023697B (zh) * | 2024-04-12 | 2024-06-11 | 武汉市双桥科技有限公司 | 一种面向立体纸雕的激光雕刻方法及系统 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01113192A (ja) * | 1987-10-23 | 1989-05-01 | Hitachi Ltd | レーザ加工機用集光装置 |
| JPH04210883A (ja) * | 1990-12-18 | 1992-07-31 | Toshiba Corp | レーザ照射装置 |
| JP2002028798A (ja) * | 2000-07-11 | 2002-01-29 | Nippon Steel Chem Co Ltd | レーザ加工装置及びレーザ加工方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0428493A (ja) * | 1990-05-22 | 1992-01-31 | Nissan Motor Co Ltd | レーザ光学系 |
| JP2720811B2 (ja) * | 1995-03-15 | 1998-03-04 | 住友電気工業株式会社 | レーザ集光方法及び装置 |
| JPH11285886A (ja) * | 1998-03-31 | 1999-10-19 | Shin Meiwa Ind Co Ltd | レーザ加工装置 |
| JP2000084689A (ja) | 1998-07-16 | 2000-03-28 | Amada Eng Center Co Ltd | レーザ加工装置 |
-
2007
- 2007-09-27 JP JP2007252094A patent/JP5060893B2/ja not_active Expired - Fee Related
-
2008
- 2008-07-07 TW TW097125518A patent/TWI394629B/zh not_active IP Right Cessation
- 2008-08-08 KR KR1020080077828A patent/KR101193855B1/ko not_active Expired - Fee Related
- 2008-09-19 CN CNA2008101491895A patent/CN101397185A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01113192A (ja) * | 1987-10-23 | 1989-05-01 | Hitachi Ltd | レーザ加工機用集光装置 |
| JPH04210883A (ja) * | 1990-12-18 | 1992-07-31 | Toshiba Corp | レーザ照射装置 |
| JP2002028798A (ja) * | 2000-07-11 | 2002-01-29 | Nippon Steel Chem Co Ltd | レーザ加工装置及びレーザ加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200914188A (en) | 2009-04-01 |
| KR101193855B1 (ko) | 2012-10-25 |
| JP5060893B2 (ja) | 2012-10-31 |
| JP2009082927A (ja) | 2009-04-23 |
| KR20090032955A (ko) | 2009-04-01 |
| CN101397185A (zh) | 2009-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |