CN101397185A - 激光加工装置 - Google Patents

激光加工装置 Download PDF

Info

Publication number
CN101397185A
CN101397185A CNA2008101491895A CN200810149189A CN101397185A CN 101397185 A CN101397185 A CN 101397185A CN A2008101491895 A CNA2008101491895 A CN A2008101491895A CN 200810149189 A CN200810149189 A CN 200810149189A CN 101397185 A CN101397185 A CN 101397185A
Authority
CN
China
Prior art keywords
laser
mirror
supporting mass
processing device
beam spot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101491895A
Other languages
English (en)
Chinese (zh)
Inventor
在间则文
森田英毅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN101397185A publication Critical patent/CN101397185A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CNA2008101491895A 2007-09-27 2008-09-19 激光加工装置 Pending CN101397185A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007252094 2007-09-27
JP2007252094A JP5060893B2 (ja) 2007-09-27 2007-09-27 レーザ加工装置

Publications (1)

Publication Number Publication Date
CN101397185A true CN101397185A (zh) 2009-04-01

Family

ID=40516055

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008101491895A Pending CN101397185A (zh) 2007-09-27 2008-09-19 激光加工装置

Country Status (4)

Country Link
JP (1) JP5060893B2 (enExample)
KR (1) KR101193855B1 (enExample)
CN (1) CN101397185A (enExample)
TW (1) TWI394629B (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102699528A (zh) * 2012-06-28 2012-10-03 镒生电线塑料(昆山)有限公司 镭射加工装置的改良结构
CN102738313A (zh) * 2011-04-01 2012-10-17 山东华光光电子有限公司 一种提高led芯片出光的芯片切割方法
CN103060795A (zh) * 2012-11-22 2013-04-24 北京工业大学 一种熔覆层宽度实时可变的激光加工工作头
CN104071974A (zh) * 2014-06-20 2014-10-01 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
CN106466764A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有实时调整工艺参数功能的激光切割头
CN106466763A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有多参数设定功能的激光切割机
CN108692680A (zh) * 2018-08-13 2018-10-23 北京行易道科技有限公司 激光标定工装
RU209801U1 (ru) * 2021-11-29 2022-03-23 Валерий Иванович Ревенко Устройство лазерной резки образца из хрупкого неметаллического материала
CN114952013A (zh) * 2022-04-28 2022-08-30 维达力实业（赤壁）有限公司 3d玻璃盖板及其制备方法、电子产品

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281544B2 (ja) * 2009-10-30 2013-09-04 三星ダイヤモンド工業株式会社 ブレイク装置
KR102042659B1 (ko) * 2017-03-21 2019-11-08 (주)컨셉션 다중 레이저의 중첩을 이용한 레이저 고출력 변환장치
CN109581667A (zh) * 2019-01-10 2019-04-05 延锋伟世通电子科技（上海）有限公司 一种用于车载抬头显示器的光学投影装置
CN114952047A (zh) * 2022-06-15 2022-08-30 无锡镭科曼数控科技有限公司 一种大幅面激光切割机自动纠错机构
CN116551217B (zh) * 2023-07-10 2023-09-12 大量科技（涟水）有限公司 一种数控机床激光切割机
JP7435936B1 (ja) * 2023-07-18 2024-02-21 三菱電機株式会社 ガルバノスキャナ及びレーザ加工機
CN117161477B (zh) * 2023-10-31 2024-07-02 临沂友诚制锯技术服务有限公司 圆弧光路锯齿加工工艺
CN118023697B (zh) * 2024-04-12 2024-06-11 武汉市双桥科技有限公司 一种面向立体纸雕的激光雕刻方法及系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113192A (ja) * 1987-10-23 1989-05-01 Hitachi Ltd レーザ加工機用集光装置
JPH0428493A (ja) * 1990-05-22 1992-01-31 Nissan Motor Co Ltd レーザ光学系
JPH04210883A (ja) * 1990-12-18 1992-07-31 Toshiba Corp レーザ照射装置
JP2720811B2 (ja) * 1995-03-15 1998-03-04 住友電気工業株式会社 レーザ集光方法及び装置
JPH11285886A (ja) * 1998-03-31 1999-10-19 Shin Meiwa Ind Co Ltd レーザ加工装置
JP2000084689A (ja) 1998-07-16 2000-03-28 Amada Eng Center Co Ltd レーザ加工装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102738313B (zh) * 2011-04-01 2015-03-18 山东华光光电子有限公司 一种提高led芯片出光的芯片切割方法
CN102738313A (zh) * 2011-04-01 2012-10-17 山东华光光电子有限公司 一种提高led芯片出光的芯片切割方法
CN102699528A (zh) * 2012-06-28 2012-10-03 镒生电线塑料(昆山)有限公司 镭射加工装置的改良结构
CN103060795A (zh) * 2012-11-22 2013-04-24 北京工业大学 一种熔覆层宽度实时可变的激光加工工作头
CN103060795B (zh) * 2012-11-22 2015-01-07 北京工业大学 一种熔覆层宽度实时可变的激光加工工作头
CN104071974B (zh) * 2014-06-20 2016-04-13 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
CN104071974A (zh) * 2014-06-20 2014-10-01 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
CN106466764A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有实时调整工艺参数功能的激光切割头
CN106466763A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有多参数设定功能的激光切割机
CN108692680A (zh) * 2018-08-13 2018-10-23 北京行易道科技有限公司 激光标定工装
CN108692680B (zh) * 2018-08-13 2023-12-26 北京行易道科技有限公司 激光标定工装
RU209801U1 (ru) * 2021-11-29 2022-03-23 Валерий Иванович Ревенко Устройство лазерной резки образца из хрупкого неметаллического материала
CN114952013A (zh) * 2022-04-28 2022-08-30 维达力实业（赤壁）有限公司 3d玻璃盖板及其制备方法、电子产品
CN114952013B (zh) * 2022-04-28 2024-06-18 维达力科技股份有限公司 3d玻璃盖板及其制备方法、电子产品

Also Published As

Publication number Publication date
JP5060893B2 (ja) 2012-10-31
KR101193855B1 (ko) 2012-10-25
KR20090032955A (ko) 2009-04-01
TW200914188A (en) 2009-04-01
JP2009082927A (ja) 2009-04-23
TWI394629B (zh) 2013-05-01

Similar Documents

Publication Publication Date Title
CN101397185A (zh) 激光加工装置
JP5221560B2 (ja) レーザ加工装置
US7772522B2 (en) Method for scribing substrate of brittle material and scriber
KR101211427B1 (ko) 취성재료기판의 절단장치 및 절단방법
KR100659478B1 (ko) 레이저 가공방법 및 가공장치
KR101306673B1 (ko) 모따기 가공 장치
JP2009082927A5 (enExample)
JP5102846B2 (ja) 脆性材料基板の面取り加工方法および面取り加工装置
JP5670647B2 (ja) 加工対象物切断方法
CN101909806B (zh) 激光加工装置
CN1644296B (zh) 激光加工设备
KR100583889B1 (ko) 취성재료기판의 스크라이브 장치
CN114728373A (zh) 激光加工系统及激光加工方法
TWI331685B (en) Method and apparatus for correcting a defective pixel of a liquid crystal display
JP4429974B2 (ja) レーザ加工方法および装置
JP2022544001A (ja) レーザー失透材除去システム及び方法
JP2021142546A (ja) 光学ユニット、レーザー加工装置及びレーザー加工方法
KR100862522B1 (ko) 레이저가공 장치 및 기판 절단 방법
KR20050078416A (ko) 레이저 리페어 장치

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20090401