JP5060893B2 - レーザ加工装置 - Google Patents

レーザ加工装置 Download PDF

Info

Publication number
JP5060893B2
JP5060893B2 JP2007252094A JP2007252094A JP5060893B2 JP 5060893 B2 JP5060893 B2 JP 5060893B2 JP 2007252094 A JP2007252094 A JP 2007252094A JP 2007252094 A JP2007252094 A JP 2007252094A JP 5060893 B2 JP5060893 B2 JP 5060893B2
Authority
JP
Japan
Prior art keywords
mirror
laser
concave
support
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007252094A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009082927A5 (enExample
JP2009082927A (ja
Inventor
則文 在間
英毅 森田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Priority to JP2007252094A priority Critical patent/JP5060893B2/ja
Priority to TW097125518A priority patent/TWI394629B/zh
Priority to KR1020080077828A priority patent/KR101193855B1/ko
Priority to CNA2008101491895A priority patent/CN101397185A/zh
Publication of JP2009082927A publication Critical patent/JP2009082927A/ja
Publication of JP2009082927A5 publication Critical patent/JP2009082927A5/ja
Application granted granted Critical
Publication of JP5060893B2 publication Critical patent/JP5060893B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2007252094A 2007-09-27 2007-09-27 レーザ加工装置 Expired - Fee Related JP5060893B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007252094A JP5060893B2 (ja) 2007-09-27 2007-09-27 レーザ加工装置
TW097125518A TWI394629B (zh) 2007-09-27 2008-07-07 Laser processing device
KR1020080077828A KR101193855B1 (ko) 2007-09-27 2008-08-08 레이저 가공장치
CNA2008101491895A CN101397185A (zh) 2007-09-27 2008-09-19 激光加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007252094A JP5060893B2 (ja) 2007-09-27 2007-09-27 レーザ加工装置

Publications (3)

Publication Number Publication Date
JP2009082927A JP2009082927A (ja) 2009-04-23
JP2009082927A5 JP2009082927A5 (enExample) 2010-10-14
JP5060893B2 true JP5060893B2 (ja) 2012-10-31

Family

ID=40516055

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007252094A Expired - Fee Related JP5060893B2 (ja) 2007-09-27 2007-09-27 レーザ加工装置

Country Status (4)

Country Link
JP (1) JP5060893B2 (enExample)
KR (1) KR101193855B1 (enExample)
CN (1) CN101397185A (enExample)
TW (1) TWI394629B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281544B2 (ja) * 2009-10-30 2013-09-04 三星ダイヤモンド工業株式会社 ブレイク装置
CN102738313B (zh) * 2011-04-01 2015-03-18 山东华光光电子有限公司 一种提高led芯片出光的芯片切割方法
CN102699528A (zh) * 2012-06-28 2012-10-03 镒生电线塑料(昆山)有限公司 镭射加工装置的改良结构
CN103060795B (zh) * 2012-11-22 2015-01-07 北京工业大学 一种熔覆层宽度实时可变的激光加工工作头
CN104071974B (zh) * 2014-06-20 2016-04-13 武汉先河激光技术有限公司 一种用于玻璃切割的激光设备及切割方法
CN106466763A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有多参数设定功能的激光切割机
CN106466764A (zh) * 2015-08-12 2017-03-01 苏州领创激光科技有限公司 具有实时调整工艺参数功能的激光切割头
KR102042659B1 (ko) * 2017-03-21 2019-11-08 (주)컨셉션 다중 레이저의 중첩을 이용한 레이저 고출력 변환장치
CN108692680B (zh) * 2018-08-13 2023-12-26 北京行易道科技有限公司 激光标定工装
CN109581667A (zh) * 2019-01-10 2019-04-05 延锋伟世通电子科技（上海）有限公司 一种用于车载抬头显示器的光学投影装置
RU209801U1 (ru) * 2021-11-29 2022-03-23 Валерий Иванович Ревенко Устройство лазерной резки образца из хрупкого неметаллического материала
CN114952013B (zh) * 2022-04-28 2024-06-18 维达力科技股份有限公司 3d玻璃盖板及其制备方法、电子产品
CN114952047A (zh) * 2022-06-15 2022-08-30 无锡镭科曼数控科技有限公司 一种大幅面激光切割机自动纠错机构
CN116551217B (zh) * 2023-07-10 2023-09-12 大量科技（涟水）有限公司 一种数控机床激光切割机
JP7435936B1 (ja) * 2023-07-18 2024-02-21 三菱電機株式会社 ガルバノスキャナ及びレーザ加工機
CN117161477B (zh) * 2023-10-31 2024-07-02 临沂友诚制锯技术服务有限公司 圆弧光路锯齿加工工艺
CN118023697B (zh) * 2024-04-12 2024-06-11 武汉市双桥科技有限公司 一种面向立体纸雕的激光雕刻方法及系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01113192A (ja) * 1987-10-23 1989-05-01 Hitachi Ltd レーザ加工機用集光装置
JPH0428493A (ja) * 1990-05-22 1992-01-31 Nissan Motor Co Ltd レーザ光学系
JPH04210883A (ja) * 1990-12-18 1992-07-31 Toshiba Corp レーザ照射装置
JP2720811B2 (ja) * 1995-03-15 1998-03-04 住友電気工業株式会社 レーザ集光方法及び装置
JPH11285886A (ja) * 1998-03-31 1999-10-19 Shin Meiwa Ind Co Ltd レーザ加工装置
JP2000084689A (ja) 1998-07-16 2000-03-28 Amada Eng Center Co Ltd レーザ加工装置
JP2002028798A (ja) * 2000-07-11 2002-01-29 Nippon Steel Chem Co Ltd レーザ加工装置及びレーザ加工方法

Also Published As

Publication number Publication date
KR101193855B1 (ko) 2012-10-25
KR20090032955A (ko) 2009-04-01
TW200914188A (en) 2009-04-01
CN101397185A (zh) 2009-04-01
JP2009082927A (ja) 2009-04-23
TWI394629B (zh) 2013-05-01

Similar Documents

Publication Publication Date Title
JP5060893B2 (ja) レーザ加工装置
JP2009082927A5 (enExample)
JP5221560B2 (ja) レーザ加工装置
KR101211427B1 (ko) 취성재료기판의 절단장치 및 절단방법
JP4731082B2 (ja) 脆い材料から作られた平らな加工物を切断するための方法及び装置
JP5670647B2 (ja) 加工対象物切断方法
JP5102846B2 (ja) 脆性材料基板の面取り加工方法および面取り加工装置
JP5320395B2 (ja) 面取り加工装置
JP5138800B2 (ja) レーザ加工方法
JP5050099B2 (ja) 脆性材料基板の加工方法
TW200920534A (en) Method for cutting a fragile material substrate
JPWO2007119740A1 (ja) スクライブ方法、スクライブ装置、及びこの方法または装置を用いて割断した割断基板
JP2011025279A (ja) 光学系及びレーザ加工装置
CN112846488A (zh) 可变光斑激光切割头装置
JP2008503355A (ja) 基板材料の切断、分断または分割装置、システムおよび方法
JP5667347B2 (ja) レーザ光によるガラス基板加工装置
KR100583889B1 (ko) 취성재료기판의 스크라이브 장치
KR100976035B1 (ko) 레이저 절단장치
JP2020105055A (ja) ガラスの曲げ加工方法および加工装置
CN223544359U (zh) 一种紫外纳秒激光超精密微抛光装置
JP2003010990A (ja) レーザ加工装置
CN120816150A (zh) 一种脆性材料倒角加工方法及装置
CN120862040A (zh) 一种激光聚焦系统

Legal Events

Date Code Title Description
RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20090904

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100827

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20100827

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120309

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120321

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120518

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20120710

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20120806

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20150810

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees