TWI392557B - A solder paste, a joining method using it, and a bonding structure - Google Patents

A solder paste, a joining method using it, and a bonding structure Download PDF

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Publication number
TWI392557B
TWI392557B TW99129327A TW99129327A TWI392557B TW I392557 B TWI392557 B TW I392557B TW 99129327 A TW99129327 A TW 99129327A TW 99129327 A TW99129327 A TW 99129327A TW I392557 B TWI392557 B TW I392557B
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TW
Taiwan
Prior art keywords
metal
solder paste
resin
alloy
ratio
Prior art date
Application number
TW99129327A
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English (en)
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TW201124224A (en
Inventor
Kosuke Nakano
Hidekiyo Takaoka
Original Assignee
Murata Manufacturing Co
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Publication date
Application filed by Murata Manufacturing Co filed Critical Murata Manufacturing Co
Publication of TW201124224A publication Critical patent/TW201124224A/zh
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Publication of TWI392557B publication Critical patent/TWI392557B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
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    • B23K35/362—Selection of compositions of fluxes
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/05—Alloys based on copper with manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
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Description

焊膏、使用其之接合方法、及接合結構
本發明係關於焊膏、使用其之接合方法、及接合結構，詳言之，係關於例如安裝電子零件之情形等所使用之焊膏，使用其之接合方法、及接合結構。
作為安裝電子零件時所使用之接合材料，廣泛使用焊錫(焊膏)。
但，先前廣泛使用之Sn-Pb系焊錫中，廣泛應用以下溫度階層連接方法：使用例如使用富含Pb之Pn-5Sn(熔點：314~310℃)、Pb-10Sn(熔點：302~275℃)等作為高溫系焊錫，在330~350℃之溫度焊接，其後，例如使用低溫系焊錫之Sn-37Pb共晶(183℃)等，以上述高溫系焊錫之熔點以下之溫度進行焊接，藉此不使先前焊接所使用之高溫系焊錫熔融，而由焊接進行連接。
如此之溫度階層連接係例如應用於黏合晶片之類型之半導體裝置，或覆晶連接等半導體裝置等中，於半導體裝置內部以焊接進行連接後，進而利用焊接將該半導體裝置本身連接於基板上之情形中所使用之重要技術。
作為用於該用途之焊膏，提案有例如含有下述之焊膏：(a)Cu、Al、Au、Ag等之第2金屬或由包含該等之高熔點合金所成之第2金屬(或合金)球、及(b)由Sn或In所成之第1金屬球之混合體(參照專利文獻1)。
另，該專利文獻1中，揭示有使用焊膏之接合方法，或電子設備之製造方法。
使用該專利文獻1之焊膏進行焊接時，如圖3(a)模式性所示，含低熔點金屬(例如Sn)球51、高熔點金屬(例如Cu)球52、及助熔劑53之焊膏之焊膏被加熱而反應，焊接後，如圖3(b)所示，複數個高熔點金屬球52經由在源自低熔點金屬球之低熔點金屬與源自高熔點金屬球之高熔點金屬間形成之金屬化合物54而連結，藉由該連結體而連接、連結接合對象物(焊接)。
但，該專利文獻1之焊膏之情形中，於焊接步驟加熱焊膏，而生成高熔點金屬(例如Cu)與低熔點金屬(例如Sn)之金屬間化合物，但Cu(高熔點金屬)與Sn(低熔點金屬)之組合，其擴散速度較慢，因此低熔點金屬Sn殘留。Sn殘留之焊膏之情形，在高溫之接合強度大幅降低，有無法根據應接合製品之種類而使用之情形。另，於焊接步驟中殘留之Sn於之後的焊接步驟中有熔融流出之虞，作為溫度階層連接所使用之高溫焊錫，有可靠性低之問題點。
即，例如半導體裝置之製造步驟中，經過進行焊接步驟製造半導體裝置後，以回焊之方法將該半導體裝置安裝於基板上時，有半導體裝置之製造步驟中焊接步驟中殘留之Sn在回焊步驟中熔融流出之虞。
另，為了不使Sn殘留而使低熔點金屬完全成為金屬間化合物，於焊接步驟中需要高溫且長時間之加熱，亦有與生產性兼顧，實用上不可行之情況。
先前技術文獻 專利文獻
專利文獻1：日本特開2002-254194號公報
本發明係解決上述問題者，其目的係提供一種焊膏及使用其之接合可靠性高之接合方法及接合結構，該焊膏於焊接步驟之第1金屬與第2金屬之擴散性良好，低溫且短時間生成熔點高之金屬間化合物，焊接後低熔點成份不殘留，且耐熱強度優良。
為解決上述問題，本發明之焊膏之特徵在於：其包含金屬成份及助熔劑成份，該金屬成份包含第1金屬粉末與比前述第1金屬粉末熔點高之第2金屬粉末，前述第1金屬係Sn或含Sn之合金，前述第2金屬係金屬或合金，與前述第1金屬形成顯現310℃以上熔點之金屬間化合物，且前述金屬間化合物之晶格常數與前述第2金屬成份之晶格常數之差即晶格常數差為50%以上。
另，前述第2金屬粉末在前述金屬成份中所占比率宜為30體積%以上。
另，較佳為前述第1金屬為Sn單體、或包含自由Cu、Ni、Ag、Au、Sb、Zn、Bi、In、Ge、Al、Co、Mn、Fe、Cr、Mg、Mn、Pd、Si、Sr、Te、P所組成之群中選出之至少一種與Sn之合金。
另，前述第2金屬宜為Cu-Mn合金或Cu-Ni合金。
較佳前述第2金屬係Mn在前述第2金屬中所占比率為10~15重量%之Cu-Mn合金，或係Ni在前述第2金屬中所占比率為10~15重量%之Cu-Ni合金。
另，前述第2金屬粉末宜為比表面積為0.05 m2 ‧g-1 以上者。
另，前述第1金屬粉末中至少一部份係塗覆於前述第2金屬粉末之周圍。
另，前述助熔劑宜為包含由下列組群所選出之至少一種者：
(a)自含松香、聚合松香、WW(water white)松香、氫化松香之松香群之選出之至少1種，
(b)含自前述松香群之選出至少1種衍生物之松香系樹脂，
(c)將硬化蓖麻油、脂肪族醯胺等觸變劑、有機酸、胺之鹵化氫酸鹽之活性劑等固體成份，以自由乙二醇單丁醚、二乙二醇單乙醚、二乙二醇單丁醚所成組群選出之至少一種溶劑溶解成膏狀者。
另，較佳為前述助熔劑包含自環氧樹脂、酚醛樹脂、聚醯亞胺樹脂、矽樹脂或其變性樹脂、丙烯酸樹脂所成之熱固性樹脂群選出之至少一種，或自聚醯胺樹脂、聚苯乙烯樹脂、聚甲基丙烯酸樹脂、聚碳酸酯樹脂、纖維素系樹脂所成之熱塑性樹脂群選出之至少一種者。
另，本發明之接合方法係使用焊膏使接合對象物接合之方法，其特徵在於：使用請求項1至9中任一焊膏，並加熱使構成前述焊膏之前述第1金屬全部成為與構成前述焊膏之前述第2金屬之間的金屬間化合物，使接合對象物接合。
另，本發明之接合結構之特徵在於：接合對象物係使用請求項1至9中任一焊膏接合之接合結構，使接合對象物接合之接合部係以源自前述焊膏之前述第2金屬，與含前述第2金屬與Sn之金屬間化合物為主要成份，源自前述焊膏之前述第1金屬相對於金屬成份全體之比率為30體積%以下。
另，本發明之接合結構中，較佳為前述金屬間化合物係在源自前述焊膏之前述第2金屬與源自前述焊膏之前述第1金屬之間形成之金屬間化合物，前述第2金屬係Cu-Mn合金或Cu-Ni合金，前述第1金屬係Sn單體或含選自由Cu、Ni、Ag、Au、Sb、Zn、Bi、In、Ge、Al、Co、Mn、Fe、Cr、Mg、Mn、Pd、Si、Sr、Te、P之群中至少一種與Sn之合金。
本發明之焊膏係含有包含第1金屬粉末與比其熔點高之第2金屬粉末之金屬成份及助熔劑成份之焊膏，作為第1金屬，含有Sn或含Sn之合金，且作為第2金屬，係與第1金屬形成顯示310℃以上熔點之金屬間化合物，且含有與金屬間化合物之晶格常數差為50%以上之金屬或合金，因此第1金屬與第2金屬之擴散活躍地進行，促進向更高熔點之金屬間化合物變化，由於低熔點成份不會殘留，因此可進行耐熱強度大之焊接。
即，藉由使用本發明之焊膏，於例如半導體裝置之製造步驟中，經過進行焊接之步驟製造半導體裝置後，即使以回焊方法將該半導體裝置安裝於基板上時，由於先前焊接步驟中之焊接部份耐熱強度優良，因此於回焊步驟中亦不會再熔融，而可進行可靠性高之安裝。
又，本發明中所謂「晶格常數差」，係定義為將從金屬間化合物之晶格常數減去第2金屬成份之晶格常數之值，除以第2金屬成份之晶格常數之數值得絕對值乘以100之數值(%)。
即，該晶格常數係表示在與第2金屬之界面新生成之金屬間化合物之晶格常數，相對第2金屬之晶格常數有多少差者，而不管各晶格常數之大小者。
再者，以如下計算式表示。
晶格常數差(%)={(金屬間化合物之晶格常數-第2金屬之晶格常數)/第2金屬之晶格常數}×100
圖1係模式性顯示使用本發明之焊膏進行接合時之舉動之圖。
如圖1所示，使用本發明之焊膏接合一對電極11a、11b時，如圖1(a)所示，首先使焊膏10位於一對電極11a、11b間。
接著，該狀態下加熱接合部，如圖1(b)所示，焊膏10之溫度達到第1金屬(Sn或含Sn之合金)1之熔點以上時，焊膏10中之第1金屬1熔融。
其後進而繼續加熱，則第1金屬1與第2金屬2形成金屬間化合物3(圖1(c))。然後，本發明之焊膏10由於在第1金屬1與第2金屬2之界面生成之金屬間化合物3，與第2金屬2間之晶格常數差變大(即，第2金屬2與金屬間化合物3之晶格常數差成為50%以上)，因此熔融之第1金屬中金屬間化合物一面剝離、分散一面重複反應，金屬間化合物之生成活躍進行，可在短時間內充分降低第1金屬1(圖1(a)、(b))之含量。又，藉由使第1金屬1與第2金屬2之組成比最適化，如圖1(c)所示，可使第1金屬全部成為金屬間化合物(參照圖1(c))。
其結果，可進行耐熱強度大之焊接。
另，藉由使第2金屬在含第1金屬與第2金屬之金屬成份中所占比率為30體積%以上，焊接步驟中可進而降低Sn之殘留比率，而可更提高耐熱性。
另，作為第1金屬，使用Sn單體或含有選自Cu、Ni、Ag、Au、Sb、Zn、Bi、In、Ge、Al、Co、Mn、Fe、Cr、Mg、Mn、Pd、Si、Sr、Te、P之群中至少一種與Sn之合金，藉此可容易地與其他金屬(第2金屬)間形成金屬間化合物，可使本發明更具實效。
另，作為第2金屬，藉由使用Cu-Mn合金或Cu-Ni合金，進而使用Mn之比率為10~15重量%之Cu-Mn合金，或Ni之比率為10~15重量%之Cu-Ni合金，可容易於短時間與第1金屬之間形成金屬間化合物，而可能使其在其後回焊步驟中亦不會熔融。
於第2金屬在不阻礙與第1金屬反應之程度下，亦可以例如1重量%以下之比率含有雜質。作為雜質，可舉出Zn、Ge、Ti、Sn、Al、Be、Sb、In、Ga、Si、Ag、Mg、La、P、Pr、Th、Zr、B、Pd、Pt、Ni、Au等。
另，考慮到接合性與反應性時，第1及第2金屬粉末中之氧濃度為2000 ppm以下較佳，尤其係10~1000 ppm較佳。
另，作為前述第2金屬，藉由使用比表面積為0.05 m2 ‧g-1 以上者，與第1金屬之接觸概率變高，在與第1金屬間進而易形成金屬間化合物，因此可以一般之回焊過程完成高熔點化。
另，藉由使第1金屬粉末中至少一部份塗覆於第2金屬粉末周圍，可在第1金屬與第2金屬間進而易形成金屬間化合物，可進而使本發明更具實效。
另，本發明之焊膏中，作為助熔劑，可使用含有載劑、溶劑、觸變劑、活性劑等眾所周知之各種者。
作為前述載劑之具體例，可舉出包含松香及使其變性之變性松香等衍生物之松香系樹脂、合成樹脂、或該等之混合體等。
另，作為含前述松香及使其變性之變性松香等之衍生物之松香系樹脂之具體例，可舉出松香、塔爾油松香、木松香、聚合松香、氫化松香、甲醯化松香、松香酯、松香變性馬來酸樹脂、松香變性苯酚樹脂、松香變性醇酸樹脂、及其他各種松香衍生物等。
另，作為含前述松香及使其變性之變性松香等之衍生物之合成樹脂之具體例，可舉出聚酯樹脂、聚醯胺樹脂、苯氧樹脂、萜烯樹脂等。
另，作為前述溶劑，已知有乙醇、酮、酯、醚、芳香族系、碳化氫類等，作為具體例，可舉出苯甲醇、乙醇、異丙醇、丁醇、二乙二醇、乙二醇、乙基溶纖劑、丁基溶纖劑、乙酸乙酯、乙酸丁酯、苯甲酸丁酯、己二酸二乙酯、十二烷、十四碳烯、α-松油醇、萜品醇、2-甲基2、4-戊二醇、2-乙基己二醇、甲苯、二甲苯、丙二醇苯醚、二乙二醇單己醚、乙二醇單丁醚、二乙二醇單丁醚、己二酸二異丁酯、己二醇、環己烷二甲醇、2-松油氧乙醇、2-二氫松油氧乙醇、及混合有該等者。
另，作為前述觸變劑之具體例，可舉出硬化蓖麻油、巴西棕櫚蠟、醯胺類、羥基脂肪酸類、二亞苄基山梨糖醇、雙(p-甲基亞苄基)山梨醇類、蜜蠟、硬酯酸醯胺、羥基硬脂酸伸乙雙醯胺等。另，亦可使用於該等中依必要添加有如辛酸、月桂酸、肉豆蔻酸、棕櫚酸、硬酯酸、山萮酸之脂肪酸、如1,2-羥基硬脂酸之羥基脂肪酸、抗氧化劑、界面活性劑、胺類等者作為前述觸變劑。
另，作為前述活性劑，有胺之鹵化氫酸鹽、有機鹵化化合物、有機酸、有機胺、多價醇等，作為前述胺之鹵化氫酸鹽之具體者，例示有二苯胍氫溴酸鹽、二苯胍鹽酸鹽、環己胺氫溴酸鹽、乙胺鹽酸鹽、乙胺氫溴酸鹽、二乙基苯胺氫溴酸鹽、二乙基苯胺鹽酸鹽、三乙醇胺氫溴酸鹽、單乙醇胺氫溴酸鹽等。
又，作為前述有機鹵化化合物之具體例，可舉出氣化石蠟、四溴乙烷、二溴丙醇、2,3-二溴-1,4-丁二醇、2,3-二溴-2-丁烯-1,4-二醇、叁(2,3-二溴丙基)異氰尿酸酯等。
另，作為前述有機酸之具體例，有丙二酸、富馬酸、乙醇酸、檸檬酸、蘋果酸、琥珀酸、苯基琥珀酸、馬來酸、水楊酸、鄰胺基苯甲酸、戊二酸、辛二酸、己二酸、癸二酸、硬脂酸、松香酸、苯甲酸、偏苯三酸、苯均四酸、十二烷酸等，進而作為有機胺之具體者，可舉出單乙醇胺、二乙醇胺、三乙醇胺、三丁胺、苯胺、二乙基苯胺等。
另，作為前述多價醇，例示有赤蘚糖醇、鄰苯三酚、核糖醇等。
本發明之焊膏中，亦包含其他眾所周知者，尤其使用包含選自由下述所成組群知至少一種者：(a)由松香、聚合松香、WW(water white)松香、氫化松香所成之松香群中選出之至少一種，(b)包含由前述松香群中選出之至少1種之衍生物之松香系樹脂，(c)將硬化蓖麻油、脂肪族醯胺等觸變劑、有機酸、胺之鹵化氫酸鹽等活性劑等固體成份，以選自由乙二醇單丁醚、二乙二醇單乙醚、二乙二醇單丁醚所成之群中之至少一種溶劑溶解成膏狀者時，可確實發揮本發明之作用效果。
另，作為助熔劑，使用含有選自由環氧樹脂、苯酚樹脂、聚醯亞胺樹脂、矽樹脂或其變性樹脂、丙烯酸樹脂所成之熱固性性樹脂群中至少一種，或選自由聚醯胺樹脂、聚苯乙烯樹脂、聚甲基丙烯酸樹脂、聚碳酸酯樹脂、纖維素系樹脂所成之熱塑性樹脂群中至少一種者時，可更確實發揮上述本發明之作用效果。
另，本發明之接合方法係使用本發明之焊膏並加熱，使構成焊膏之低熔點金屬與構成焊膏之第2金屬成為金屬間化合物，使接合對象物接合，因此於焊接步驟中第1金屬與第2金屬之擴散活躍進行，促進向更高熔點之金屬間化合物變化，使第1金屬成份相對於金屬成份全體之比率為例如30體積%以下，可進行耐熱強度大之焊接。
進而，藉由使焊膏中金屬調配比等最適化，可進行第1金屬成份完全不殘留之設計。
即，藉由使用本發明之焊膏，於例如半導體裝置之製造步驟中，經過焊接步驟製造半導體裝置後，以回焊之方法將該半導體裝置安裝於基板上之情形時，由於先前焊接步驟中之焊接部份耐熱強度優良，因此於回焊之步驟亦不會再熔融，可進行可靠性高之安裝。
另，本發明之接合結構，其使接合對象物接合之接合部係以源自焊膏之第2金屬與包含該第2金屬與Sn之金屬間化合物作為主要成份，源自焊膏之第1金屬相對於金屬成份全體之比率為30體積%以下，因此可提供耐熱強度大之接合結構。
又，接合部中源自焊膏之前述第1金屬更好為3體積%以下。
即，本發明之接合結構中，如圖1(c)所示，使接合對象物(電極)11a及11b接合之接合部(焊錫)4中，由於所有第1金屬與第2金屬形成金屬間化合物3，因此接合部4由第2金屬2與金屬間化合物3構成，第1金屬1(圖1(a)、(b))不會殘留，因此可實現耐熱強度大之接合結構。
另，金屬間化合物為在源自焊膏之第2金屬即Cu-Mn合金或Cu-Ni合金與源自焊膏之第1金屬即Sn單體或包含選自Cu、Ni、Ag、Au、Sb、Zn、Bi、In、Ge、Al、Co、Mn、Fe、Cr、Mg、Mn、Pd、Si、Sr、Te、P所成之群中至少一種與Sn之合金之間形成之金屬間化合物時，可提供第1金屬成份更確實地完全不殘留，且耐熱強度大之接合結構。
以下顯示本發明之實施例，進一步詳細說明本發明之特徵處。
實施例1
該實施例1中，藉由混合第1金屬粉末、第2金屬粉末、助熔劑而製作焊膏。
第1金屬粉末與第2金屬粉末之調配比以第1金屬粉末/第2金屬粉末之體積比成60/40(即第2金屬為40體積%)之方式進行調整。
作為第1金屬粉末，如表1所示，使用Sn-3Ag-0.5Cu、Sn、Sn-3.5Ag、Sn-0.75Cu、Sn-58Bi、Sn-0.7Cu-0.05Ni、Sn-5Sb、Sn-2Ag-0.5Cu-2Bi、Sn-57Bi-1Ag、Sn-3.5Ag-0.5Bi-8In、Sn-9Zn、Sn-8Zn-3Bi。使第1金屬粉末之平均粒徑為25 μm。
又，上述各材料之表示中，例如「Sn-3.5Ag」之數字3.5表示該成份(此時為Ag)之重量%之值，上述其他材料及以下記載之情形亦相同。
另，作為第2金屬粉末，如表1所示，使用Cu-10Ni、Cu-10Mn、Cu-12Mn-4Ni、Cu-10Mn-1P、Cu-10Ni與Cu-10Mn之等量混合粉末、Cu、Cu-10Zn。第2金屬粉末之平均粒徑為15 μm。
又，作為助熔劑，使用松香：74重量%、二乙二醇單丁醚：22重量%、三乙醇胺：2重量%、及氫化蓖麻油2重量%之調配比率者。
另，助熔劑之調配比率為助熔劑在焊膏全體所占比率成10重量%之比率。
將所製成之焊膏使用金屬遮罩，印刷於尺寸為10 mm×10 mm，厚度為0.2 mm之無氧Cu板上。金屬遮罩之開口徑為1.5 mm×1.5 mm，厚度為100 μm。
於經印刷之焊膏上安裝實施鍍Ni及鍍Au之黃銅端子(尺寸1.2 mm×1.0 mm×1.0 mm)後，使用回焊裝置以圖2所示之回焊過程接合。
[特性之評估]
對如上述製成之試料按以下方法測定接合強度及焊錫流出之不良產生率，並評估特性。
《接合強度》
所得接合體之剪斷強度係使用接合測試器測定並評估。
剪斷強度之測定係在橫壓速度0.1 mm‧s-1 ，室溫及260℃之條件下進行。
並且，剪斷強度為20 Nmm‧s-2 以上者評估為◎(優)，2 Nmm‧s-2 以下者評估為×(差)。
表1中顯示第1金屬及第2金屬之組成、第2金屬之晶格常數、第1金屬及第2金屬之調配比率、在第2金屬粉末表面首先生成之金屬間化合物之種類與其晶格常數、第2金屬(Cu合金)與金屬間化合物之晶格常數差、各接合體之接合強度(室溫、260℃)。又，晶格常數係基於a軸評估。
《殘留成份之評估》
將所得之反應生成物切下約7 mg，在測定溫度30℃~300℃、升溫速度5℃/min、N2 氛圍、參考物Al2 O3 之條件下進行差分掃描熱量測定(DSC測定)。從所得之DSC圖之第1金屬成份於熔融溫度之熔融吸熱峰值之吸熱量，定量殘留之第1金屬成份。由此將第1金屬成份相對金屬成份全體之比率作為殘留第1金屬成份率加以評估。殘留第1金屬成份率在0~3體積%時評估為◎(優)，大於30體積%時評估為×(差)。
表1一併顯示殘留第1金屬成份率與判斷結果。
《焊錫流出》
於印刷基板之Cu面(Cu面尺寸：0.7 mm×0.4 mm)上塗布前述焊膏(厚度100 μm)，於所得之塗布部上安裝長度1 mm、寬度0.5 mm、厚度0.5 mm尺寸之晶片型陶瓷電容器。
以峰值溫度250℃回焊後，將印刷基板以環氧樹脂密封並放置於相對濕度85%之環境中，以峰值溫度260℃之回焊條件加熱，調查焊錫之流出比率，作為焊錫流出不良產生率加以評估。
焊錫流出不良率在0~10%時評估為◎(優)，大於50%時評估為×(差)。
於表1一併顯示焊錫流出不良產生率與判斷結果。
如表1所示，關於室溫下之接合強度，實施例、比較例都顯示為20 Nmm-2 以上，確認具備實用強度。
另一方面，觀察260℃下之接合強度，比較例為2 Nmm-2 以下，接合強度不充分，與此相對，實施例保持在10 Nmm-2 以上，確認具備實用強度。
另，關於殘留第1金屬成份率，比較例大於30體積%，與此相對實施例都為0體積%，關於焊錫流出不良率，比較例為70%以上，與此相對實施例都為0%，確認具有高耐熱性。
另，關於實施例之試料，若第1金屬係以Sn為基底之焊錫合金，則確認無關於第1金屬之種類而具備相同之高耐熱性。
又，關於實施例之試料，第2金屬係以Cu-Mn為基底之金屬(Cu-12Mn-4Ni或Cu-10Mn-1P等)時，或第2金屬粉末為2種以上(Cu-Mn、Cu-Ni混合粉末)時，確認同樣具備高耐熱性。
如此實施例之試料具備高耐熱性，認為係根據使用Cu-Mn及Cu-Ni系合金作為第2金屬之實施例之情形中，金屬間化合物分別為Cu2 MnSn及Cu2 NiSn，各金屬間化合物與第2金屬(Cu金屬)間之晶格常數差為50%以上。即，認為係根據所生成之金屬間化合物層與基底金屬的第2金屬間之晶格常數較大時，熔融之第1金屬中金屬間化合物一面剝離、分散一面重複反應，因而金屬間化合物活躍進行。
另一方面，如比較例，使用Cu或Cu-Zn合金作為第2金屬時，認為接合界面之金屬間化合物為Cu3 Sn，金屬間化合物與第2金屬(Cu金屬)間之晶格常數差小如20%，金屬間化合物無法有效率進行，因此無法獲得高耐熱性。
實施例2
準備Sn-3Ag-0.5Cu之粉末作為第1金屬粉末。又，第1金屬粉末之平均粒徑為25 μm。
另，作為第2金屬粉末，準備Cu、及Cu-10Mn之粉末。第2金屬粉末之平均粒徑為15 μm。
準備松香：74重量%、二乙二醇單丁醚：22重量%、三乙醇胺：2重量%、及氫化蓖麻油2重量%之調配比率者作為助熔劑。
然後，藉由混合上述第1金屬粉末、第2金屬粉末、助熔劑而製作焊膏。
又，調配比率係以第1金屬粉末/第2金屬粉末之體積比成87/13~57/43(即第2金屬粉末為13~43體積%)之方式進行調整。
另，助熔劑之調配比率係助熔劑在焊膏全體中所占比率成10重量%之比率。
對如此製成之焊膏與實施例1之情形相同地測定接合強度及焊錫流出不良產生率，評估特性。
又，有關接合強度之評估，剪斷強度為20 Nmm-2 以上者評估為◎(優)，為2 Nmm-2 以上、不滿20 Nmm-2 者評估為○(良)，為2 Nmm-2 以下者評估為×(差)。
關於殘留第1金屬成份率，0~3體積%之情形評估為◎(優)，超過3體積%、30體積%以下之情形評估為○(可)，大於30體積%之情形評估為×(差)。
另，關於焊錫流出不良產生率，0~10之情形評估為◎(優)，超過100%、50%以下評估為○(可)，大於50%之情形評估為×(差)。
表2係顯示各接合體之接合強度(室溫、260℃)、殘留第1金屬成份率、焊錫流出不良率、及該等之評估結果。
如表2所示，可知關於室溫下之接合強度，實施例、比較例都顯示為20 Nmm-2 以上，具備實用強度。
另一方面，觀察260℃下之接合強度，比較例為0.1 Nmm-2 ，大幅低於2 Nmm-2 ，接合強度不充分，與此相對，實施例為7~26 Nmm-2 ，保持在2 Nmm-2 以上，確認具備實用強度。尤其於第2金屬為Cu-10Mn時，於其比率為30%以上，顯示23 Nmm-2 以上之接合強度，確認具備高耐熱強度。
另，關於殘留第1金屬成份，比較例大於30體積%，與此相對，實施例中都在30體積%以下，進而第2金屬的Cu-10Mn或Cu-10Ni之比率為30體積%以上時，殘留第1金屬成份率成為0體積%。另，關於焊錫流出不良率，比較例為70%以上，與此相對實施例中都在50%以下，進而第2金屬的Cu-10Mn或Cu-10Ni之比率為30%以上時，焊錫流出不良率成為0%，確認可獲得高耐熱性。
實施例3
準備Sn-3Ag-0.5Cu粉末作為第1金屬粉末。又，第1金屬粉末之平均粒徑為25 μm。
另，準備Mn之比率為5~30重量%之Cu-Mn合金粉末、及Ni之比率為5~20重量%之Cu-Ni合金粉末作為第2金屬粉末。第2金屬粉末之平均粒徑為15 μm。
準備松香：74重量%、二乙二醇單丁醚：22重量%、三乙醇胺：2重量%、及氫化蓖麻油2重量%之調配比率者作為助熔劑。
然後，藉由混合上述第1金屬粉末、第2金屬粉末、助熔劑而製作焊膏。
又，助熔劑之調配比率係助熔劑在焊膏全體所占比率成為10重量%之比率。
第1金屬粉末與第2金屬粉末之調配比係以第1金屬粉末/第2金屬粉末之體積比成60/40(即第2金屬粉末為40體積%)之方式進行調整。
關於如此製成之焊膏，與實施例1相同地測定接合強度、殘留第1金屬成份率及焊錫流出不良產生率，評估特性。
又，有關接合強度之評估、殘留第1金屬成份率、焊錫流出不良率，以與實施例2相同之基準進行評估。
表3係顯示各接合體之接合強度(室溫、260℃)、殘留第1金屬成份率、焊錫流出不良率、及該等之評估結果。
如表3所示，可知關於室溫下之接合強度，實施例、比較例都顯示為20 Nmm-2 以上，具備實用強度。
另一方面，觀察260℃下之接合強度，比較例為0.1 Nmm-2 ，大幅低於2 Nmm-2 ，接合強度不充分，與此相對，實施例為5~26 Nmm-2 時，保持在2 Nmm-2 以上，確認具備實用強度。尤其第2金屬為Cu-10~15Mn時，及為Cu-10~15Ni時，顯示高如24~26 Nmm-2 之接合強度，確認耐熱強度優良。
另，關於殘留第1金屬成份率，比較例大於30體積%。與此相對，實施例都在30體積%以下，進而為第2金屬的Cu-10~15Mn時，及Cu-10~15Ni時，殘留第1金屬成份率成為0體積%。另，關於焊錫流出不良率，比較例為70%以上，與此相對實施例中都在50%以下，進而為第2金屬的Cu-10~15Mn及Cu-10~15Ni時，焊錫流出不良率成為0%，確認可獲得高耐熱性。
實施例4
準備Sn-3Ag-0.5Cu之粉末作為第1金屬粉末。又，第1金屬粉末之平均粒徑為25 μm。
另，準備Cu、Cu-10Mn合金之粉末作為第2金屬粉末。第2金屬粉末之平均粒徑為15 μm。第2金屬粉末使其粒徑變化，比表面積成為0.03~0.06 m2 ‧g-1 。
另，準備松香：74重量%、二乙二醇單丁醚：22重量%、三乙醇胺：2重量%、及氫化蓖麻油2重量%之調配比率者作為助熔劑。
然後，藉由混合上述第1金屬粉末、第2金屬粉末、助熔劑而製作焊膏。
又，助熔劑之調配比率係助熔劑在焊膏全體所占比率成為10重量%之比率。
第1金屬粉末與第2金屬粉末之調配比係以第1金屬粉末/第2金屬粉末之體積比成60/40(即第2金屬粉末為40體積%)之方式進行調整。
關於如此製成之焊膏，與實施例1之情形相同，測定接合強度及殘留第1金屬成份、焊錫流出不良產生率，評估特性。
接合強度之評估及殘留第1金屬成份率、焊錫流出不良率之評估，係以與上述實施例2之情形相同之基準進行評估。
表4係顯示各接合體之接合強度(室溫、260℃)、殘留第1金屬成份率、焊錫流出不良率、及該等之評估結果。
如表4所示，可知關於室溫下之接合強度，實施例、比較例都顯示為20 Nmm-2 以上，具備實用強度。
另一方面，觀察260℃下之接合強度，比較例為0.1 Nmm-2 ，大幅低於2 Nmm-2 ，接合強度不充分，與此相對，實施例中為14~24 Nmm-2 ，保持在2 Nmm-2 以上，確認具備實用強度。進而為第2金屬之Cu-10Mn之比表面積為0.05 m2 ‧g-1 以上時，顯示21 Nmm-2 以上，具有特別高之耐熱強度。
另，關於殘留第1金屬成份率，比較例大於30體積%，與此相對，實施例中都在30體積%以下，進而為第2金屬的Cu-10Mn之比表面積為0.05 m2 ‧g-1 以上時，殘留第1金屬成份率成為0體積%。另，關於焊錫流出不良率，比較例為70%以上，與此相對實施例中都在50%以下，進而為第2金屬的Cu-10Mn之比表面積為0.05 m2 ‧g-1 以上時，焊錫流出不良率成為0%，確認獲得高耐熱性。
實施例5
藉由混合包含(a)鍍Sn之Cu-10Mn合金與Sn粉之混合體及
(b)鍍Sn之Cu-10Mn合金與Sn粉與Cu-10Mn合金之混合體
(c)鍍Sn之Cu-10Mn合金單體
之金屬粉與助熔劑而製作焊膏。
除使用鍍Sn之Cu-10Mn合金單體之情形外，第1金屬粉末與第2金屬粉末之調配比以第1金屬粉末/第2金屬粉末之體積比成為60/40(即第2金屬粉末為40體積%)之方式進行調整。
但，鍍Sn之Cu-10Mn合金單體之情形中，Cu-Mn合金(第2金屬)之合計比率為80%。
又，準備松香：74重量%、二乙二醇單丁醚：22重量%、三乙醇胺：2重量%、及氫化蓖麻油2重量%之調配比率者作為助熔劑。
另，助熔劑之調配比率係以助熔劑在焊膏全體所占比率成10重量%之方式進行調整。
關於如此製成之焊膏，與實施例1之情形相同，測定接合強度、殘留第1金屬成份率及焊錫流出不良產生率，評估特性。
再者，接合強度之評估、殘留第1金屬成份率、及焊錫流出不良率之評估，係以與上述實施例2之情形相同之基準進行評估。
表5顯示各接合體之接合強度(室溫、260℃)、殘留第1金屬成份率、焊錫流出不良率、及該等評估結果。
如表5所示，可知關於室溫下之接合強度，實施例、比較例都顯示為20 Nmm-2 以上，具備實用強度。
另一方面，觀察260℃下之接合強度，比較例為0.1 Nmm-2 ，大幅低於2 Nmm-2 ，接合強度不充分，與此相對，實施例為24~26 Nmm-2 ，保持在2 Nmm-2 以上，確認具備實用強度。由此，第1金屬鍍敷(塗覆)於第2金屬表面時，亦與上述各實施例之情形相同，確認獲得高耐熱強度。
另，關於殘留第1金屬成份率，比較例大於30體積%，與此相對，實施例中都在30體積%以下，另，關於焊錫流出不良率，比較例為70%以上，與此相對實施例中都為0%，第1金屬鍍敷(塗覆)於第2金屬表面時，亦確認獲得高耐熱性。
實施例6
準備Sn-3Ag-0.5Cu之粉末作為第1金屬粉末。又，第1金屬粉末之平均粒徑為25 μm。
另，準備Cu-10Mn合金之粉末作為第2金屬粉末。第2金屬粉末之平均粒徑為15 μm。
準備添加有樹脂者與不添加有樹脂者作為助熔劑。
作為不添加有樹脂之助熔劑，係準備松香：74重量%、二乙二醇單丁醚：22重量%、三乙醇胺：2重量%、及氫化蓖麻油2重量%之調配比率之一般助熔劑A。
另，作為添加有樹脂者，準備於上述一般助熔劑A中添加熱固性性樹脂與硬化劑之熱固性性樹脂調配助熔劑B，準備於上述一般助熔劑A中添加有熱塑性樹脂之熱塑性樹脂調配助熔劑C。
又，熱固性性樹脂調配助熔劑B係按以下比率含有上述助熔劑A、熱固性性樹脂(雙酚A型環氧樹脂)及硬化劑者。
助熔劑A：30重量%
熱固性性樹脂：40重量%
硬化劑：30重量%
另，熱塑性樹脂調配助熔劑C係按以下比率含有上述助熔劑A、熱塑性樹脂(聚醯胺樹脂)者。
助熔劑A：30重量%
熱固性性樹脂(聚醯胺樹脂)：70重量%
然後，
製作(1)使不添加有樹脂之上述助熔劑A以助熔劑在焊膏全體所占比例成為10重量%之比率進行調配之焊膏，
(2)使熱固性性樹脂調配助熔劑B以助熔劑在焊膏全體所占比率成為25重量%之比率進行調配之焊膏，
(3)使熱塑性樹脂調配助熔劑C以助熔劑在焊膏全體所占比率成25重量%之比率進行調配之焊膏。
此後，對該等焊膏與實施例1之情形相同地測定接合強度、殘留第1金屬成份率及焊錫流出不良產生率，評估特性。
如表6所示，可知關於室溫下之接合強度，實施例、比較例都顯示為20 Nmm-2 以上，具備實用強度。
另一方面，觀察260℃下之接合強度，比較例為0.1 Nmm-2 ，大幅低於2 Nmm-2 ，接合強度不充分，與此相對，實施例為24~33 Nmm-2 ，保持在2 Nmm-2 以上，確認具備實用強度。
另，關於殘留第1金屬成份率，比較例大於30體積%，與此相對，實施例中都為0體積%。另，關於焊錫流出不良率，比較例為70%以上，與此相對實施例中都為0%，確認不添加樹脂之情形中亦可獲得高耐熱性。
又，上述實施例中，以金屬間化合物之晶格常數比第2金屬之晶格常數大之情形為例進行說明，但本發明在理論上亦可以第2金屬之晶格常數比金屬間化合物之晶格常數大之方式構成。此時使晶格常數差亦成50%以上，藉此第1金屬與第2金屬之擴散活躍進行，促進向更高熔點金屬間化合物變化，第1金屬成份幾乎不會殘留，因此可進行耐熱強度大之焊接。
本發明不限於上述實施例，關於構成焊膏之第1金屬及第2金屬之種類或組成、第1金屬與第2金屬之調配比率、助熔劑成份或助熔劑之調配比率等，在發明範圍內可加入各種應用、變形。
另，關於欲適用本發明進行接合之接合對象物之種類、或接合步驟之條件等，在發明範圍內亦可加入各種應用、變形。
本發明進而在其他方面亦可在發明範圍內加入各種應用、變形。
1．．．第1金屬
2．．．第2金屬
3．．．金屬間化合物
4．．．接合部
10．．．焊膏
11a、11b．．．一對電極(接合對象物)
圖1係模式性顯示使用本發明之焊膏進行接合時之舉動之圖，(a)係顯示加熱前狀態之圖，(b)係顯示加熱開始，第1金屬熔融狀態之圖，(c)係顯示進而繼續加熱，所有第1金屬與第2金屬形成金屬間化合物之狀態圖。
圖2係顯示使用本發明之焊膏，於無氧Cu板上安裝黃銅端子時之回焊過程之圖。
圖3係顯示使用先前之焊膏進行焊接時之焊錫之舉動之圖，(a)係顯示加熱前狀態之圖，(b)係顯示焊接步驟結束後之狀態圖。
1．．．第1金屬
2．．．第2金屬
3．．．金屬間化合物
4．．．接合部
10．．．焊膏
11a、11b．．．一對電極(接合對象物)

Claims (12)

  1. 一種焊膏，其特徵在於：其包含金屬成份與助熔劑成份，該金屬成份包含第1金屬粉末與比前述第1金屬粉末熔點高之第2金屬粉末，前述第1金屬係Sn或含Sn之合金，前述第2金屬係金屬或合金，與前述第1金屬生成顯現310℃以上熔點之金屬間化合物，且前述金屬間化合物之晶格常數與前述第2金屬成份之晶格常數之差即晶格常數差為50%以上。
  2. 如請求項1之焊膏，其中前述第2金屬粉末在前述金屬成份中所占比率為30體積%以上。
  3. 如請求項1或2之焊膏，其中前述第1金屬係Sn單體、或包含選自Cu、Ni、Ag、Au、Sb、Zn、Bi、In、Ge、Al、Co、Mn、Fe、Cr、Mg、Mn、Pd、Si、Sr、Te、P之群中至少一種與Sn之合金。
  4. 如請求項1或2之焊膏，其中前述第2金屬係Cu-Mn合金或Cu-Ni合金。
  5. 如請求項1或2之焊膏，其中前述第2金屬係Mn在前述第2金屬中所占比率為10~15重量%之Cu-Mn合金，或係Ni在前述第2金屬中所占比率為10~15重量%之Cu-Ni合金。
  6. 如請求項1或2之焊膏，其中前述第2金屬粉末係比表面積為0.05 m2 ．g-1 以上者。
  7. 如請求項1或2之焊膏，其中前述第1金屬粉末中之至少一部份係塗覆於前述第2金屬粉末周圍。
  8. 如請求項1或2之焊膏，其中前述助熔劑係包含由下列組群所選出之至少一種者：(a)選自含松香、聚合松香、WW(water white)松香、氫化松香之松香群之至少1種，(b)含選自前述松香群之至少1種之衍生物之松香系樹脂，(c)將硬化蓖麻油、脂肪族醯胺等觸變劑、有機酸、胺之鹵化氫酸鹽之活性劑等固體成份，以選自由乙二醇單丁醚、二乙二醇單乙醚、二乙二醇單丁醚所成組群之至少一種之溶劑溶解成膏狀者。
  9. 如請求項1或2之焊膏，其中前述助熔劑含有自由環氧樹脂、酚醛樹脂、聚醯亞胺樹脂、矽樹脂或其變性樹脂、丙烯酸樹脂所組成之熱固性樹脂群中選出之至少一種，或自由聚醯胺樹脂、聚苯乙烯樹脂、聚甲基丙烯酸樹脂、聚碳酸酯樹脂、纖維素系樹脂所組成之熱塑性樹脂群中選出之至少一種。
  10. 一種接合方法，其係使用焊膏將接合對象物接合者，其特徵在於：使用請求項1至9中任一項之焊膏，並加熱使構成前述焊膏之前述第1金屬成份成為與構成前述焊膏之前述第2金屬間的金屬間化合物，而使接合對象物接合。
  11. 一種接合結構，特徵在於：接合對象物係使用請求項1至9中任一項之焊膏接合，且使接合對象物接合之接合部之焊錫係以源自前述焊膏 之前述第2金屬及含前述第2金屬與Sn之金屬間化合物作為主要成份，源自前述焊膏之前述第1金屬相對於金屬成份全體之比率為30體積%以下。
  12. 如請求項11之接合結構，其中前述金屬間化合物係在源自前述焊膏之前述第2金屬與源自前述焊膏之前述第1金屬之間形成之金屬間化合物，前述第2金屬係Cu-Mn合金或Cu-Ni合金，前述第1金屬係Sn單體或包含選自由Cu、Ni、Ag、Au、Sb、Zn、Bi、In、Ge、Al、Co、Mn、Fe、Cr、Mg、Mn、Pd、Si、Sr、Te、P組成之群中至少一種與Sn之合金。
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US9044816B2 (en) 2015-06-02
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