TWI390765B - 具有波長轉換材料之光電半導體晶片、具有該晶片之光電半導體元件、以及該光電半導體晶片之製造方法 - Google Patents

具有波長轉換材料之光電半導體晶片、具有該晶片之光電半導體元件、以及該光電半導體晶片之製造方法 Download PDF

Info

Publication number
TWI390765B
TWI390765B TW096117572A TW96117572A TWI390765B TW I390765 B TWI390765 B TW I390765B TW 096117572 A TW096117572 A TW 096117572A TW 96117572 A TW96117572 A TW 96117572A TW I390765 B TWI390765 B TW I390765B
Authority
TW
Taiwan
Prior art keywords
wavelength
semiconductor wafer
radiation
region
optoelectronic semiconductor
Prior art date
Application number
TW096117572A
Other languages
English (en)
Chinese (zh)
Other versions
TW200802994A (en
Inventor
Dirk Berben
Frank Jermann
Original Assignee
Osram Opto Semiconductors Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh filed Critical Osram Opto Semiconductors Gmbh
Publication of TW200802994A publication Critical patent/TW200802994A/zh
Application granted granted Critical
Publication of TWI390765B publication Critical patent/TWI390765B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8516Wavelength conversion means having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer or wavelength conversion layer with a concentration gradient
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/852Encapsulations
    • H10H20/854Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/882Scattering means

Landscapes

  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
TW096117572A 2006-05-23 2007-05-17 具有波長轉換材料之光電半導體晶片、具有該晶片之光電半導體元件、以及該光電半導體晶片之製造方法 TWI390765B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102006024165A DE102006024165A1 (de) 2006-05-23 2006-05-23 Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips

Publications (2)

Publication Number Publication Date
TW200802994A TW200802994A (en) 2008-01-01
TWI390765B true TWI390765B (zh) 2013-03-21

Family

ID=38436763

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096117572A TWI390765B (zh) 2006-05-23 2007-05-17 具有波長轉換材料之光電半導體晶片、具有該晶片之光電半導體元件、以及該光電半導體晶片之製造方法

Country Status (8)

Country Link
US (1) US7982233B2 (enExample)
EP (1) EP2020038B1 (enExample)
JP (1) JP2009537996A (enExample)
KR (1) KR20090015987A (enExample)
CN (1) CN101490860B (enExample)
DE (1) DE102006024165A1 (enExample)
TW (1) TWI390765B (enExample)
WO (1) WO2007134582A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009016585A2 (en) * 2007-08-02 2009-02-05 Koninklijke Philips Electronics N.V. Color conversion device
US7868340B2 (en) * 2008-05-30 2011-01-11 Bridgelux, Inc. Method and apparatus for generating white light from solid state light emitting devices
DE102008050643B4 (de) * 2008-10-07 2022-11-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtmittel
DE102008057720B4 (de) * 2008-11-17 2024-10-31 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Strahlungsemittierende Vorrichtung
WO2010074987A2 (en) * 2008-12-24 2010-07-01 3M Innovative Properties Company Light generating device having double-sided wavelength converter
EP2380217A2 (en) 2008-12-24 2011-10-26 3M Innovative Properties Company Method of making double-sided wavelength converter and light generating device using same
DE102009005907A1 (de) * 2009-01-23 2010-07-29 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil
KR100993045B1 (ko) * 2009-10-23 2010-11-08 엘지이노텍 주식회사 발광소자 칩 및 발광소자 패키지
KR101221870B1 (ko) * 2009-04-17 2013-01-15 한국전자통신연구원 태양 전지
JP5662939B2 (ja) * 2009-05-22 2015-02-04 パナソニックIpマネジメント株式会社 半導体発光装置及びそれを用いた光源装置
US20110062468A1 (en) * 2009-09-11 2011-03-17 Koninklijke Philips Electronics N.V. Phosphor-converted light emitting diode device
KR101655463B1 (ko) * 2010-03-26 2016-09-07 엘지이노텍 주식회사 발광소자 패키지 및 이를 구비한 라이트 유닛
CN102270732B (zh) * 2010-06-03 2015-06-10 展晶科技(深圳)有限公司 荧光层结构及其形成方法以及发光二极管封装结构
JP5635832B2 (ja) * 2010-08-05 2014-12-03 スタンレー電気株式会社 半導体発光装置
WO2012042452A2 (en) 2010-09-29 2012-04-05 Koninklijke Philips Electronics N.V. Wavelength converted light emitting device
JP2013541220A (ja) * 2010-10-27 2013-11-07 コーニンクレッカ フィリップス エヌ ヴェ 発光デバイスの製造用のラミネート支持フィルム、及びその製造方法
TWI474520B (zh) * 2010-11-29 2015-02-21 Epistar Corp 發光裝置、混光裝置及其製造方法
JP5762044B2 (ja) * 2011-02-23 2015-08-12 三菱電機株式会社 発光装置及び発光装置群及び製造方法
DE102011111980A1 (de) 2011-08-29 2013-02-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Leuchtdiode und Leuchtdiode
DE102012202927B4 (de) 2012-02-27 2021-06-10 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
DE102012202928A1 (de) * 2012-02-27 2013-08-29 Osram Gmbh Lichtquelle mit led-chip und leuchtstoffschicht
CN102709280A (zh) * 2012-05-29 2012-10-03 宁波升谱光电半导体有限公司 一种cob集成光源模块
DE102012108704A1 (de) * 2012-09-17 2014-03-20 Osram Opto Semiconductors Gmbh Verfahren zur Fixierung einer matrixfreien elektrophoretisch abgeschiedenen Schicht auf einem Halbleiterchip und strahlungsemittierendes Halbleiterbauelement
KR20140038692A (ko) * 2012-09-21 2014-03-31 포항공과대학교 산학협력단 색변환 엘리먼트 및 그 제조방법
CN103852613B (zh) * 2012-11-29 2016-08-10 沈阳工业大学 一种辐射电流传感方法及专用传感器
DE102013205179A1 (de) 2013-03-25 2014-09-25 Osram Gmbh Verfahren zum Herstellen einer elektromagnetische Strahlung emittierenden Baugruppe und elektromagnetische Strahlung emittierende Baugruppe
DE102013207226A1 (de) * 2013-04-22 2014-10-23 Osram Opto Semiconductors Gmbh Herstellung eines Schichtelements für einen optoelektronischen Halbleiterchip
JP2015002182A (ja) * 2013-06-13 2015-01-05 日立アプライアンス株式会社 照明装置
TW201503421A (zh) * 2013-07-15 2015-01-16 Ind Tech Res Inst 發光二極體晶粒
DE102013214896B4 (de) * 2013-07-30 2021-09-09 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines Konverterelements und eines optoelektronischen Bauelements, Konverterelement und optoelektronisches Bauelement
JP2015099911A (ja) * 2013-10-18 2015-05-28 株式会社エルム 蛍光体分離構造を備えた蛍光体含有フィルムおよびその製造方法
JP2015115480A (ja) * 2013-12-12 2015-06-22 株式会社エルム 発光装置及びその製造方法
DE102013114466A1 (de) * 2013-12-19 2015-06-25 Osram Gmbh Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils
WO2015170814A1 (en) * 2014-05-09 2015-11-12 Lg Electronics Inc. Apparatus of light source for display and apparatus of display using the same
JP2016062899A (ja) * 2014-09-12 2016-04-25 株式会社東芝 半導体発光装置
KR101632291B1 (ko) * 2014-12-11 2016-06-21 전남대학교산학협력단 고효율 형광체플레이트 및 상기 형광체플레이트를 포함하는 led 응용제품
DE102015103835A1 (de) * 2015-03-16 2016-09-22 Osram Opto Semiconductors Gmbh Lichtemittierendes Bauelement und Verfahren zur Herstellung eines lichtemittierenden Bauelements
CN104868026B (zh) * 2015-05-22 2019-02-22 深圳市华星光电技术有限公司 量子点发光元件
KR102140826B1 (ko) * 2016-06-13 2020-08-04 전남대학교산학협력단 고효율 형광체플레이트 및 상기 형광체플레이트의 제조방법
CN107611232B (zh) * 2017-08-21 2019-02-05 天津三安光电有限公司 发光二极管及其制作方法
DE102017119872A1 (de) * 2017-08-30 2019-02-28 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil
US20220254962A1 (en) * 2021-02-11 2022-08-11 Creeled, Inc. Optical arrangements in cover structures for light emitting diode packages and related methods

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3819409A (en) * 1972-07-26 1974-06-25 Westinghouse Electric Corp Method of manufacturing a display screen
DE29724582U1 (de) 1996-06-26 2002-07-04 OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US5684309A (en) * 1996-07-11 1997-11-04 North Carolina State University Stacked quantum well aluminum indium gallium nitride light emitting diodes
WO1998031055A1 (en) 1997-01-09 1998-07-16 Nichia Chemical Industries, Ltd. Nitride semiconductor device
US5895932A (en) 1997-01-24 1999-04-20 International Business Machines Corporation Hybrid organic-inorganic semiconductor light emitting diodes
US5898185A (en) * 1997-01-24 1999-04-27 International Business Machines Corporation Hybrid organic-inorganic semiconductor light emitting diodes
US5831277A (en) * 1997-03-19 1998-11-03 Northwestern University III-nitride superlattice structures
JP3691951B2 (ja) 1998-01-14 2005-09-07 東芝電子エンジニアリング株式会社 窒化ガリウム系化合物半導体発光素子
DE19955747A1 (de) * 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur
TW480744B (en) * 2000-03-14 2002-03-21 Lumileds Lighting Bv Light-emitting diode, lighting device and method of manufacturing same
JP4447806B2 (ja) * 2001-09-26 2010-04-07 スタンレー電気株式会社 発光装置
JP2003298120A (ja) * 2002-04-03 2003-10-17 Idec Izumi Corp 光源装置および蛍光パターンシート、それらの製造方法、ならびにそれを用いた液晶ディスプレイ装置、照明装置、掲示灯、表示灯および押しボタンスイッチ
JP2004133420A (ja) * 2002-09-20 2004-04-30 Seiko Epson Corp 光学デバイス及びその製造方法、表示装置、電子機器、並びに検査機器
KR100691143B1 (ko) 2003-04-30 2007-03-09 삼성전기주식회사 다층 형광층을 가진 발광 다이오드 소자
US7884382B2 (en) * 2004-02-20 2011-02-08 GE Lighting Solutions, LLC Rules for efficient light sources using phosphor converted LEDs
US7250715B2 (en) 2004-02-23 2007-07-31 Philips Lumileds Lighting Company, Llc Wavelength converted semiconductor light emitting devices
DE102004021233A1 (de) * 2004-04-30 2005-12-01 Osram Opto Semiconductors Gmbh Leuchtdiodenanordnung
JP4546176B2 (ja) * 2004-07-16 2010-09-15 京セラ株式会社 発光装置
US7045375B1 (en) * 2005-01-14 2006-05-16 Au Optronics Corporation White light emitting device and method of making same
US7321193B2 (en) * 2005-10-31 2008-01-22 Osram Opto Semiconductors Gmbh Device structure for OLED light device having multi element light extraction and luminescence conversion layer
EP1964184A2 (en) 2005-12-14 2008-09-03 Koninklijke Philips Electronics N.V. Solid-state light source and method of producing light of a desired color point

Also Published As

Publication number Publication date
EP2020038B1 (de) 2017-07-05
KR20090015987A (ko) 2009-02-12
EP2020038A1 (de) 2009-02-04
US7982233B2 (en) 2011-07-19
TW200802994A (en) 2008-01-01
US20090272998A1 (en) 2009-11-05
CN101490860A (zh) 2009-07-22
WO2007134582A1 (de) 2007-11-29
DE102006024165A1 (de) 2007-11-29
JP2009537996A (ja) 2009-10-29
CN101490860B (zh) 2011-08-31

Similar Documents

Publication Publication Date Title
TWI390765B (zh) 具有波長轉換材料之光電半導體晶片、具有該晶片之光電半導體元件、以及該光電半導體晶片之製造方法
CN111863856B (zh) 光源装置以及发光装置
CN110337721B (zh) 用于制造包含光刻胶的光致发光垫的光电器件的方法
JP5405712B2 (ja) 変換層を有するルミネセンスダイオードチップ及びその製造方法
US9882097B2 (en) Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component
CN104704634B (zh) 用于制造发光二极管显示器的方法和发光二极管显示器
US8093610B2 (en) Optoelectronic component
JP5175885B2 (ja) 白色光発光ダイオードチップ及びその製造方法
KR102422146B1 (ko) 광전자 반도체 컴포넌트들을 제조하기 위한 방법 및 광전자 반도체 컴포넌트
JP4415572B2 (ja) 半導体発光素子およびその製造方法
US20170186908A1 (en) Optoelectronic apparatus for light emission
US9099619B2 (en) Semiconductor light emitting device and method for manufacturing the same
CN116072800B (zh) Micro-LED显示芯片及其制备方法
JP2019062220A (ja) 半導体デバイス及び照明装置
TW201031034A (en) Method of making double-sided wavelength converter and light generating device using same
US11764196B2 (en) Optoelectronic device comprising light-emitting diodes
CN101904005A (zh) 光电子器件和光电子器件的制造方法
CN111684591A (zh) 光电半导体芯片、光电器件及其制造方法
TW201349555A (zh) 具受屏蔽矽基板之發光裝置
US20130299861A1 (en) Led structure, led device and methods for forming the same
CN116802821A (zh) 横向异质波长转换层
CN116195079A (zh) 光电半导体器件及其制造的方法
US20250275327A1 (en) High efficient led pixel array with composite n-contact
TWI404238B (zh) 混光式正面發光之發光二極體晶粒

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees