TWI389935B - 含聚醯胺酸之形成下層防反射膜之組成物 - Google Patents

含聚醯胺酸之形成下層防反射膜之組成物 Download PDF

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Publication number
TWI389935B
TWI389935B TW94129891A TW94129891A TWI389935B TW I389935 B TWI389935 B TW I389935B TW 94129891 A TW94129891 A TW 94129891A TW 94129891 A TW94129891 A TW 94129891A TW I389935 B TWI389935 B TW I389935B
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TW
Taiwan
Prior art keywords
compound
forming
reflection film
acid
lower anti
Prior art date
Application number
TW94129891A
Other languages
English (en)
Chinese (zh)
Other versions
TW200619268A (en
Inventor
Tadashi Hatanaka
Takahiro Sakaguchi
Tomoyuki Enomoto
Shigeo Kimura
Original Assignee
Nissan Chemical Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissan Chemical Ind Ltd filed Critical Nissan Chemical Ind Ltd
Publication of TW200619268A publication Critical patent/TW200619268A/zh
Application granted granted Critical
Publication of TWI389935B publication Critical patent/TWI389935B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
TW94129891A 2004-09-03 2005-08-30 含聚醯胺酸之形成下層防反射膜之組成物 TWI389935B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004256655 2004-09-03

Publications (2)

Publication Number Publication Date
TW200619268A TW200619268A (en) 2006-06-16
TWI389935B true TWI389935B (zh) 2013-03-21

Family

ID=36036238

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94129891A TWI389935B (zh) 2004-09-03 2005-08-30 含聚醯胺酸之形成下層防反射膜之組成物

Country Status (5)

Country Link
JP (1) JP4466877B2 (ja)
KR (1) KR101118697B1 (ja)
CN (2) CN101010634A (ja)
TW (1) TWI389935B (ja)
WO (1) WO2006027950A1 (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7563563B2 (en) 2006-04-18 2009-07-21 International Business Machines Corporation Wet developable bottom antireflective coating composition and method for use thereof
US8257901B2 (en) 2009-03-10 2012-09-04 Lg Chem, Ltd. Polyimide-based polymers, copolymers thereof and positive type photoresist compositions comprising the same
KR101056962B1 (ko) * 2009-03-10 2011-08-17 주식회사 엘지화학 폴리이미드계 중합체와 이들의 공중합체 혼합물 및 이들을 포함하는 포지티브형 감광성 수지 조성물
US8895230B2 (en) 2011-10-10 2014-11-25 Brewer Science Inc. Spin-on carbon compositions for lithographic processing
JP5817939B2 (ja) * 2013-10-18 2015-11-18 東レ株式会社 ポリアミド樹脂組成物、製造方法、成形品
JP7073845B2 (ja) * 2018-03-28 2022-05-24 日産化学株式会社 重合体及びそれを含む樹脂組成物
US11022885B2 (en) * 2018-08-31 2021-06-01 Taiwan Semiconductor Manufacturing Co., Ltd. Photosensitive middle layer
JPWO2022186312A1 (ja) * 2021-03-04 2022-09-09

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0572736A (ja) * 1991-09-18 1993-03-26 Hitachi Chem Co Ltd 含フツ素系ポリイミド樹脂膜パターンの製造法
US5397684A (en) * 1993-04-27 1995-03-14 International Business Machines Corporation Antireflective polyimide dielectric for photolithography
JP3031214B2 (ja) * 1995-09-11 2000-04-10 信越化学工業株式会社 反射防止膜材料
JP2000007783A (ja) * 1998-06-23 2000-01-11 Hitachi Chemical Dupont Microsystems Ltd ポリイミド前駆体樹脂組成物及びその製造方法
US6455416B1 (en) * 2000-10-24 2002-09-24 Advanced Micro Devices, Inc. Developer soluble dyed BARC for dual damascene process
KR100839393B1 (ko) * 2001-07-26 2008-06-19 닛산 가가쿠 고교 가부시키 가이샤 폴리아믹산 수지 조성물
US7261997B2 (en) * 2002-01-17 2007-08-28 Brewer Science Inc. Spin bowl compatible polyamic acids/imides as wet developable polymer binders for anti-reflective coatings
KR101195468B1 (ko) * 2004-10-14 2012-10-30 닛산 가가쿠 고교 가부시키 가이샤 방향족 술폰산 에스테르 화합물 및 광산발생제를 포함하는 하층반사방지막 형성조성물

Also Published As

Publication number Publication date
WO2006027950A1 (ja) 2006-03-16
KR101118697B1 (ko) 2012-03-12
JPWO2006027950A1 (ja) 2008-05-08
CN103163736A (zh) 2013-06-19
KR20070048237A (ko) 2007-05-08
JP4466877B2 (ja) 2010-05-26
CN101010634A (zh) 2007-08-01
TW200619268A (en) 2006-06-16

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