TWI384047B - 樹脂滲出防止劑及樹脂滲出防止方法 - Google Patents

樹脂滲出防止劑及樹脂滲出防止方法 Download PDF

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Publication number
TWI384047B
TWI384047B TW097116595A TW97116595A TWI384047B TW I384047 B TWI384047 B TW I384047B TW 097116595 A TW097116595 A TW 097116595A TW 97116595 A TW97116595 A TW 97116595A TW I384047 B TWI384047 B TW I384047B
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Taiwan
Prior art keywords
resin
group
resin bleed
prevention
integer
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TW097116595A
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English (en)
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TW200914568A (en
Inventor
Akihiro Aiba
Tomoharu Mimura
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Nippon Mining Co
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Publication of TW200914568A publication Critical patent/TW200914568A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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Description

樹脂滲出防止劑及樹脂滲出防止方法
本發明係有關在將引線框架(lead frame)或印刷配線板等半導體配線基材與IC晶片藉由樹脂而予以接著固定之黏晶步驟中的樹脂滲出防止劑及防止方法。
半導體晶片與引線框架或印刷配線板等基材，通常藉由黏晶樹脂予以接著固定。基材的接著面一般係施以金、銀、鈀、銅、鎳等鍍層，惟若表面粗度過大或表面經電鍍添加劑、變色防止劑、封孔處理劑等有機物污染，則在黏晶步驟中之黏晶樹脂塗佈時，會產生樹脂或添加劑的滲出(Resin Bleed Out(RBO))。該RBO係使黏晶強度降低，並對作為其後之步驟的打線接合(wire bonding)與模封(moulding)造成不好的影響。
以往，為了防止RBO，係使接著面之電鍍面的表面粗度減小而抑制毛細管現象，或洗淨表面以去除污染物。惟，由於接著面之表面粗度會對黏晶強度、或組裝機器(assembly machine)之影像辨識能力造成影響，故不可一概無差別地減小。此外，在洗淨表面時，有連變色防止覆膜或封孔處理覆膜也脫離的問題。
為了解決此等問題，在專利文獻1中揭示有藉由將基材浸漬於以羧酸、硫醇等作為主成分的溶液中並吸附1至數分子左右之有機覆膜，而可改變基材面之表面粗度、或是不會將變色防止覆膜或封孔處理覆膜洗淨剝離，此外， 由於吸附之有機覆膜非常地薄，故不會對打線接合性、模封性等組裝特性造成不好的影響，而可防止RBO。
此外，本發明人等再進行檢討，結果顯示具有極性基之氟烷化合物係較專利文獻1之羧酸、硫醇化合物等有更高的RBO防止效果(專利文獻2)。
惟，由於氟烷化合物含有氟，有排水會造成問題的情形。
[專利文獻1]日本特開平11－195662號公報[專利文獻2]日本特願2007－52890號
本發明之目的在於提供一種樹脂滲出防止劑，其排水處理之負荷小，且即使在使用低應力型之黏晶樹脂時，也不會對黏晶強度或組裝特性·造成不好的影響，且不會損及變色防止處理或封孔處理效果。
本發明人等進行努力研究的結果，發現在藉由將基材浸漬於含有樹脂滲出防止劑的溶液並使有機覆膜吸附於電鍍面之表面而防止樹脂滲出的步驟中，即使在使用排水處理之負荷較含氟化合物小且較低應力型之黏晶樹脂時，也不會對黏晶強度或組裝特性造成不好的影響，且不會損及變色防止處理或封孔處理效果之具有樹脂滲出防止效果的一群有機化合物，而完成本發明。
亦即，本發明係如以下敘述。
(1)一種樹脂滲出防止劑，包含以下述通式表示之磷酸酯：O＝P(O－(R2 －O)n －R1 )m (OH)3－m (式中，R1 為碳數4至30的飽和或不飽和之烴基，R2 為低級伸烷基，n為0至10的整數，m為1至3的整數)。
(2)如上述(1)記載之樹脂滲出防止劑，其中，上述磷酸酯之R1 為碳數8至20的烷基、烯基、炔基之任一者，R2 為伸乙基，n為1至6的整數，m為1至3的整數。
(3)如上述(1)或(2)記載之樹脂滲出防止劑，復包含：含有四唑衍生物、三唑衍生物、咪唑衍生物、噻唑衍生物之任一者的含氮雜環狀化合物系變色防止劑。
(4)一種樹脂滲出防止方法，係使用上述(1)至(3)中任一項記載之樹脂滲出防止劑施以樹脂滲出防止處理。
(5)一種基材，係經使用上述(1)至(3)中任一項記載之樹脂滲出防止劑施以樹脂滲出防止處理，而具有該樹脂滲出防止劑之覆膜。
藉由使用本發明之樹脂滲出防止劑進行在引線框架、印刷配線板等半導體配線基材的表面吸附具有樹脂滲出防止功能之有機化合物的樹脂滲出防止處理，可不損及變色防止效果或封孔處理效果而防止在黏晶步’驟中之樹脂滲出。此外，也不會對打線接合性或模封性等組裝特性造成不好的影響。更由於為非氟系之樹脂滲出防止劑，故排水處理之負荷小。
本發明之樹脂滲出防止劑包含以下述通式表示之磷酸酯：O＝P(O－(R2 －O)n －R1 )m (OH)3－m (式中，R1 為碳數4至30的飽和或不飽和之烴基，R2 為低級伸烷基，n為0至10的整數，m為1至3的整數)。
R1 為碳數4至30的飽和或不飽和之烴基。其中尤以碳數8至20的飽和或不飽和之烴基為佳。若碳數過少則樹脂滲出防止效果低，若過多則使模封性(模封樹脂之密著性)降低。
就飽和或不飽和之烴基而言，可具有2個以上的雙鍵、三鍵，此外，即使為直鏈狀亦可具有側鏈。再者，環狀烴基或芳族烴基亦可連結至主鏈，惟以直鏈狀之烷基、烯基、炔基為佳，以直鏈狀之烷基為尤佳。在烯基’、炔基中，雙鍵、三鍵的位置並無特別限制。
R2 為碳數1至4之低級伸烷基，以亞甲基(methylene)、伸乙基(ethylene)、伸丙基為佳，以伸乙基為尤佳。
n為0至10的整數，以1至6的整數為佳。
m為1至3的整數。上述磷酸酯中，單酯、二酯、三酯之任一者皆為有用，獲得為混合物時不需要分離，可以混合物之形式來使用。此外，m為複數時，R1 、R2 、以及n可為不同。
本發明之樹脂滲出防止劑係溶解於水等溶劑而作為樹 脂滲出防止劑溶液使用。上述樹脂滲出防止劑溶液中之上述磷酸酯濃度以1mg/L至100g/L為佳，以10mg/L至10g/L為更佳。由於在上述濃度未達1mg/L時RBO防止效果弱，而即使超過100g/L效果亦飽和而無法期待更高的效果，故為不佳。
再者，本發明之樹脂滲出防止劑可含有金屬之氧化變色防止劑。就該變色防止劑而言，具體而言可使用公知之變色防止劑，尤其是以含有四唑衍生物、三唑衍生物、咪唑衍生物、噻唑衍生物之任一者的含氮雜環狀化合物系變色防止劑為佳。
就此等變色防止劑而言，可舉出例如四唑、苯并三唑、苯并咪唑、苯并噻唑、巰基苯并噻唑等。
上述變色防止劑係以在樹脂滲出防止劑溶液中含有1mg/L至100g/L為佳，以10mg/L至10g/L為更佳。由於在未達1mg/L時變色防止效果弱，而即使超過100g/L效果亦飽和而無法期待更高的效果，故為不佳。
藉由含有變色防止劑，可同時賦予樹脂滲出防止效果與變色防止效果。
使用水作為溶劑時，在上述磷酸酯不易溶於水時，可因應需要添加醇、酮等有機溶劑。添加量雖可為上述磷酸酯溶於水之必須濃度，惟通常以0.1g/L至200g/L為佳，以1g/L至50g/L為更佳。若添加量過少則溶解性低，此外，即使添加過多時溶解上述磷酸酯之效果亦不變，故為不佳。
再者，在上述磷酸酯不易溶於水時，可因應需要添加 陰離子系、陽離子系、非離子系之界面活性劑之任一者；或此等界面活性劑之混合物。其添加量可為1μg/L至10g/L，宜為10μg/L至1g/L。若添加量過少則溶解性低，此外，即使添加過多時溶解上述磷酸酯之效果亦不變，故為不佳。
此外，在樹脂滲出防止劑溶液中，欲提升溶液之pH緩衝性時，可因應需要添加0.1g/L至200g/L(宜為添加1至50g/L)之磷酸系、硼酸系、有機酸系之pH緩衝劑。若未達0.1g/L則pH緩衝效果低，即使超過200g/L效果亦飽和而無法期待更高的效果，故為不佳。
此外，在樹脂滲出防止劑溶液中有金屬溶出時，可因應需要而使用金屬遮蔽劑。就該金屬遮蔽劑而言，基本上可使用公知者，尤其以使用胺系、胺基羧酸系、羧酸系之錯合劑為佳，添加量可為0.1g/L至200g/L，宜為1g/L至50g/L。若未達0.1g/L則金屬之錯合力低，即使超過200g/L效果亦飽和而無法期待更高的效果，故為不佳。
樹脂滲出防止劑溶液之pH不需要特別限定，通常在pH1至14間，以在pH2至12處理為佳。若不在此範圍，則素材的損傷大，樹脂滲出防止效果低。
此外，樹脂滲出防止劑溶液之溫度可為能以水溶液進行之溫度範圍，通常為5至90℃，宜為10至60℃。若溫度過低則樹脂滲出防止效果低，此外，即使超過90℃也只會使作業性變差，提高溫度並無助益。
再者，在樹脂滲出防止劑溶液之處理時間只要視效果 在0.1秒至300秒適當調整即可，若考慮到作業之再現性與效率則以1秒至60秒為佳。若未達0.1秒，則樹脂滲出防止效果低，且作業之再現性變難，即使超過300秒效果亦飽和，且作業效率變低。
此外，本發明之樹脂滲出防止方法，係將配線基材浸漬於樹脂滲出防止劑溶液，或藉由淋浴、噴灑等方式將樹脂滲出防止劑溶液散佈於基材，或藉由旋塗機等進行塗佈使其接觸後，進行水洗、乾燥即可。
就配線基材而言，可舉出引線框架或印刷配線板等半導體配線基材，以在進行樹脂滲出防止處理之基材表面施有金、銀、鈀、銅、鎳等鍍層者為佳。
藉由進行上述之樹脂滲出防止處理，而使上述磷酸酯吸附於配線基材表面之電鍍面，並形成由1至數分子左右之厚度的磷酸酯所構成的覆膜。因此，可使電鍍面與黏晶樹脂之接觸角增加，以抑制黏晶樹脂之滲出。另外，由於吸附之磷酸酯覆膜非常薄，故對打線接合性、造膜性等組裝特性不會造成不好的影響。此外，也不會損及變色防止效果或封孔處理效果。以上述方法施行樹脂滲出防止處理而形成有該防止劑之覆膜的配線基材、以及使用該配線基材之半導體封裝亦包含在本發明中。
就作為在進行本發明之樹脂滲出防止處理後所使用的黏晶樹脂為有效的黏晶樹脂而言，可為低應力型之黏晶樹脂，可舉出環氧樹脂、丙烯酸系樹脂等，且以環氧樹脂為佳。
(實施例)
以下，雖根據實施例說明本發明，惟本發明非限定於此等實施例者。
實施例1至6，比較例1至2 為了在銅合金(Cu：97.7%、Sn：2.0%、Ni：0.2%、P：0.03%)製引線框架提升密著性而進行銅打底電鍍(strike plating)作為底層後，於引線框架全面施以鍍銀、鍍金、鍍銅之任一者。藉由浸漬而進行記載於之後表1的樹脂滲出防止處理。
針對此等基材，進行黏晶，並進行耐樹脂滲出性(耐RBO性)、打線接合性(W/B性)、模封性、耐變色性之評估。將結果顯示於表1。表1中，電鍍浴組成中之「一」表示不添加，在評估欄之「一」表示在評估對象之外。
另外，表1中之R1 、R2 、n係表示上述通式所示之磷酸酯中的R1 、R2 、n，磷酸酯係使用單酯與二酯之1：1的混合物。使用之磷酸酯之R1 的烷基、烯基全部為直鏈狀，實施例5、6中的烯基為在中央具有雙鍵之10－二十烯基、11－二十二烯基。
耐樹脂滲出性之評估係以下述方法進行。
將市面販售之低應力黏晶用環氧樹脂(ABLEBOND8340，Ablestik社製)塗佈於經進行樹脂滲出防止處理的電鍍面後，在大氣中，以室溫放置2小時。接著，在大氣中以熱板進行175℃、1小時的熱硬化後，以金屬顯微鏡(100倍)觀察環氧樹脂塗佈部，如第1圖所示測定 樹脂滲出最嚴重部分的滲出量(RBO量)，以如下方式進行評估。
○：未達10μm△：10μm以上，且未達50μm×：50μm以上
打線接合性之評估係以下述方法進行。
使用25μm金線，以超音波併用熱壓著方式(溫度：200℃、荷重：50g、時間：10ms)進行打線接合，並以拉力測試機(pull tester)測試拉力強度，以如下方式進行評估。
○：10gf以上×：未達10gf
模封性之評估係以下述方法進行。
將市面販售之模封用環氧樹脂(住友BAKELITE製，EME－6300)塗佈於經進行樹’脂滲出防止處理的電鍍面後，進行175℃、5小時的熱硬化，之後測定密著性(剪切強度)，以如下方式進行評估。
○：20kgf/cm2 以上△：10 kgf/cm2 以上，且未達20 kgf/cm2 ×：未達10 kgf/cm2
耐變色性之評估係以下述方法進行。
以40℃、溼度90%加溼96小時後，進行外觀觀察，並如以下方式進行評估。
○：無變色×：有變色
第1圖係表示實施例之耐樹脂滲出性評估中之樹脂滲出量之測定方法的圖。
無元件符號

Claims (5)

  1. 一種樹脂滲出防止劑，包含以下述通式表示之磷酸酯：O=P(O-(R2 -O)n -R1 )m (OH)3-m (式中，R1 為碳數4至30的飽和或不飽和之烴基，R2 為低級伸烷基，n為1至10的整數，m為1至3的整數)。
  2. 如申請專利範圍第1項之樹脂滲出防止劑，其中，上述磷酸酯之R1 為碳數8至20的烷基、烯基、炔基之任一者，R2 為伸乙基，n為1至6的整數，m為1至3的整數。
  3. 如申請專利範圍第1項或第2項之樹脂滲出防止劑，復包含：含有四唑衍生物、三唑衍生物、咪唑衍生物、噻唑衍生物之任一者的含氮雜環狀化合物系變色防止劑。
  4. 一種樹脂滲出防止方法，係使用申請專利範圍第1至3項中任一項之樹脂滲出防止劑施以樹脂滲出防止處理。
  5. 一種基材，係經使用申請專利範圍第1至3項中任一項之樹脂滲出防止劑施以樹脂滲出防止處理，而具有該樹脂滲出防止劑之覆膜。
TW097116595A 2007-05-21 2008-05-06 樹脂滲出防止劑及樹脂滲出防止方法 TWI384047B (zh)

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