MY154006A - Resin-bleedout preventing agent and method for preventing resin-bleedout - Google Patents

Resin-bleedout preventing agent and method for preventing resin-bleedout

Info

Publication number
MY154006A
MY154006A MYPI20083473A MYPI20083473A MY154006A MY 154006 A MY154006 A MY 154006A MY PI20083473 A MYPI20083473 A MY PI20083473A MY PI20083473 A MYPI20083473 A MY PI20083473A MY 154006 A MY154006 A MY 154006A
Authority
MY
Malaysia
Prior art keywords
resin
bleedout
preventing
preventing agent
integer
Prior art date
Application number
MYPI20083473A
Inventor
Aiba Akihiro
Mimura Tomoharu
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY154006A publication Critical patent/MY154006A/en

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
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  • Chemical & Material Sciences (AREA)
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  • Die Bonding (AREA)
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Abstract

THE PURPOSE IS TO PROVIDE A RESIN-BLEEDOUT PREVENTING AGENT THAT POSES FEW PROBLEMS FOR WASTE-WATER TREATMENT AND DOES NOT ADVERSELY AFFECT DIE BONDING STRENGTH OR ASSEMBLY PROPERTIES EVEN USING A LOW-STRESS TYPE DIE BONDING RESIN OR DETRACT FROM THE EFFECTS OF ANTI-TARNISHING AND SEALANT TREATMENT. THE RESIN-BLEEDOUT PREVENTING AGENT CONTAINS A PHOSPHORIC ACID ESTER REPRESENTED BY THE FOLLOWING GENERAL FORMULA: O = P(0-(R2-O)n-R1)m(OH)3-m (WHEREIN R1 REPRESENTS A C4-30 SATURATED OR UNSATURATED HYDROCARBON GROUP, R2 REPRESENTS A LOWER ALKYLENE GROUP, n IS AN INTEGER FROM 0 TO 10 AND m IS AN INTEGER FROM 1 TO 3).
MYPI20083473A 2007-05-21 2008-09-08 Resin-bleedout preventing agent and method for preventing resin-bleedout MY154006A (en)

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JP5437393B2 (en) * 2009-12-17 2014-03-12 Ｊｘ日鉱日石金属株式会社 Resin bleed-out prevention agent
KR101375192B1 (en) * 2012-02-03 2014-03-17 삼성테크윈 주식회사 Method for preventing epoxy bleed out of lead frame
KR102190964B1 (en) 2014-03-18 2020-12-15 해성디에스 주식회사 Bleed-out preventing agent, composition for preventing bleed-out including the same and method for preventing bleed-out
CN107353855B (en) * 2017-08-01 2019-03-29 烟台德邦科技有限公司 A kind of chip adhesive agent and preparation method thereof that low resin is precipitated

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JP3155139B2 (en) * 1993-12-28 2001-04-09 株式会社神戸製鋼所 Tin or tin alloy plated material having excellent oxidation resistance and method for producing the same
JPH1060381A (en) * 1996-08-21 1998-03-03 Denki Kagaku Kogyo Kk Primer composition for anaerobic acrylic adhesive
JP3343210B2 (en) * 1997-12-26 2002-11-11 株式会社ジャパンエナジー Epoxy bleed-out inhibitor and prevention method
KR100271558B1 (en) * 1998-09-04 2001-01-15 김무 Resin Leakage Inhibition and Surface Corrosion Prevention Composition of Copper-based Leadframes
JP4215235B2 (en) * 2002-10-18 2009-01-28 日鉱金属株式会社 Surface treatment agent and surface treatment method for Sn alloy
KR100953008B1 (en) * 2006-01-17 2010-04-14 닛코킨조쿠 가부시키가이샤 Epoxy bleedout-preventing agent

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CN101542718B (en) 2012-06-13
HK1135507A1 (en) 2010-06-04
TW200914568A (en) 2009-04-01
KR101076118B1 (en) 2011-10-21
CN101542718A (en) 2009-09-23
WO2008142960A1 (en) 2008-11-27
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KR20090009201A (en) 2009-01-22
JPWO2008142960A1 (en) 2010-08-05

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