TWI376995B - - Google Patents

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Publication number
TWI376995B
TWI376995B TW095116414A TW95116414A TWI376995B TW I376995 B TWI376995 B TW I376995B TW 095116414 A TW095116414 A TW 095116414A TW 95116414 A TW95116414 A TW 95116414A TW I376995 B TWI376995 B TW I376995B
Authority
TW
Taiwan
Prior art keywords
circuit board
component mounting
flexible circuit
mounting portion
stepped
Prior art date
Application number
TW095116414A
Other languages
English (en)
Chinese (zh)
Other versions
TW200718322A (en
Inventor
Hiroaki Inose
Katsunori Kokubun
Original Assignee
Nippon Mektron Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron Kk filed Critical Nippon Mektron Kk
Publication of TW200718322A publication Critical patent/TW200718322A/zh
Application granted granted Critical
Publication of TWI376995B publication Critical patent/TWI376995B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09154—Bevelled, chamferred or tapered edge
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW095116414A 2005-08-12 2006-05-09 Method to manufacture a hybrid multilayered circuit substrate TW200718322A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005234420A JP2007049076A (ja) 2005-08-12 2005-08-12 混成多層回路基板の製造方法

Publications (2)

Publication Number Publication Date
TW200718322A TW200718322A (en) 2007-05-01
TWI376995B true TWI376995B (ja) 2012-11-11

Family

ID=37722472

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095116414A TW200718322A (en) 2005-08-12 2006-05-09 Method to manufacture a hybrid multilayered circuit substrate

Country Status (3)

Country Link
JP (1) JP2007049076A (ja)
CN (1) CN1913752B (ja)
TW (1) TW200718322A (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5075568B2 (ja) * 2007-10-17 2012-11-21 株式会社フジクラ シールド付回路配線基板及びその製造方法
KR101038335B1 (ko) 2008-03-18 2011-05-31 영풍전자 주식회사 다층 인쇄회로기판의 제조방법
CN103384447B (zh) * 2013-06-26 2016-06-29 友达光电股份有限公司 软性电子装置
KR102497358B1 (ko) * 2015-09-24 2023-02-10 주식회사 기가레인 벤딩 내구성이 개선된 연성회로기판
CN107404797B (zh) * 2016-05-18 2019-06-11 庆鼎精密电子（淮安）有限公司 具有段差结构的多层电路板及其制作方法
CN114245572B (zh) 2020-09-09 2024-08-09 深南电路股份有限公司 复合电路板及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2631548B2 (ja) * 1989-03-15 1997-07-16 日本シイエムケイ株式会社 シールド層を備えるプリント配線板
JPH0695591B2 (ja) * 1990-09-29 1994-11-24 日本メクトロン株式会社 Ｉｃ搭載用可撓性回路基板及びその製造法
JPH06132617A (ja) * 1992-10-16 1994-05-13 Tatsuta Electric Wire & Cable Co Ltd プリント回路基板及びその製造方法
JPH06302962A (ja) * 1993-02-19 1994-10-28 Mitsubishi Rayon Co Ltd リジッド−フレキシブル配線板およびその製造方法
US5334800A (en) * 1993-07-21 1994-08-02 Parlex Corporation Flexible shielded circuit board
JP3445678B2 (ja) * 1995-02-27 2003-09-08 シャープ株式会社 多層フレキシブルプリント配線板及びその製造方法
JP3166611B2 (ja) * 1996-04-19 2001-05-14 富士ゼロックス株式会社 プリント配線板及びその製造方法
JP3871910B2 (ja) * 2001-09-12 2007-01-24 日本メクトロン株式会社 ケーブルを有するフレキシブルプリント基板およびその製造方法
EP1465471A3 (en) * 2003-04-03 2005-07-27 Matsushita Electric Industrial Co., Ltd. Wiring board, method for manufacturing a wiring board and electronic equipment
KR100747393B1 (ko) * 2003-04-25 2007-08-07 미쓰이 긴조꾸 고교 가부시키가이샤 전자 부품 실장용 필름 캐리어 테이프와 그 제조 방법 및솔더 레지스트 도포용 스크린

Also Published As

Publication number Publication date
CN1913752B (zh) 2010-05-12
TW200718322A (en) 2007-05-01
CN1913752A (zh) 2007-02-14
JP2007049076A (ja) 2007-02-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees