TWI374572B - Multilayer cavity slot antenna - Google Patents
Multilayer cavity slot antenna Download PDFInfo
- Publication number
- TWI374572B TWI374572B TW094127045A TW94127045A TWI374572B TW I374572 B TWI374572 B TW I374572B TW 094127045 A TW094127045 A TW 094127045A TW 94127045 A TW94127045 A TW 94127045A TW I374572 B TWI374572 B TW I374572B
- Authority
- TW
- Taiwan
- Prior art keywords
- conductor
- layer
- antenna
- conductor layer
- layers
- Prior art date
Links
- 239000004020 conductor Substances 0.000 claims description 157
- 238000000034 method Methods 0.000 claims description 32
- 230000005855 radiation Effects 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 15
- 239000000919 ceramic Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000008878 coupling Effects 0.000 claims description 2
- 238000010168 coupling process Methods 0.000 claims description 2
- 238000005859 coupling reaction Methods 0.000 claims description 2
- 239000000543 intermediate Substances 0.000 claims 9
- 238000010344 co-firing Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000003989 dielectric material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 206010029412 Nightmare Diseases 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002574 poison Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 210000001747 pupil Anatomy 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/66—High-frequency adaptations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
- H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Waveguide Aerials (AREA)
- Details Of Aerials (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/930,660 US7057564B2 (en) | 2004-08-31 | 2004-08-31 | Multilayer cavity slot antenna |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200629649A TW200629649A (en) | 2006-08-16 |
| TWI374572B true TWI374572B (en) | 2012-10-11 |
Family
ID=35942327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094127045A TWI374572B (en) | 2004-08-31 | 2005-08-09 | Multilayer cavity slot antenna |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7057564B2 (enExample) |
| EP (1) | EP1790036A1 (enExample) |
| JP (1) | JP2008512048A (enExample) |
| KR (1) | KR20070046898A (enExample) |
| CN (1) | CN1993863B (enExample) |
| TW (1) | TWI374572B (enExample) |
| WO (1) | WO2006025972A1 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI708434B (zh) * | 2019-12-27 | 2020-10-21 | 財團法人工業技術研究院 | 高整合度多天線陣列 |
| US11276942B2 (en) | 2019-12-27 | 2022-03-15 | Industrial Technology Research Institute | Highly-integrated multi-antenna array |
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| WO2007008646A2 (en) | 2005-07-12 | 2007-01-18 | Massachusetts Institute Of Technology | Wireless non-radiative energy transfer |
| JP4681614B2 (ja) * | 2005-11-14 | 2011-05-11 | アンリツ株式会社 | 直線偏波アンテナ及びそれを用いるレーダ装置 |
| US20070182636A1 (en) * | 2006-02-06 | 2007-08-09 | Nokia Corporation | Dual band trace antenna for WLAN frequencies in a mobile phone |
| KR100819196B1 (ko) | 2006-10-25 | 2008-04-04 | 광운대학교 산학협력단 | 금속에 부착 가능한 ｕｈｆ대역 ｒｆｉｄ 태그 안테나 |
| TWI355772B (en) * | 2006-12-29 | 2012-01-01 | Advanced Semiconductor Eng | Carrier with solid antenna structure and manufactu |
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| KR100916072B1 (ko) * | 2007-07-11 | 2009-09-08 | 삼성전기주식회사 | 칩 안테나 |
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| US10505255B2 (en) | 2017-01-30 | 2019-12-10 | Infineon Technologies Ag | Radio frequency device packages and methods of formation thereof |
| JP6946466B2 (ja) | 2017-05-12 | 2021-10-06 | ホアウェイ・テクノロジーズ・カンパニー・リミテッド | 通信デバイス |
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| US10186492B1 (en) * | 2017-07-18 | 2019-01-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Package structure and manufacturing method thereof |
| US10971806B2 (en) | 2017-08-22 | 2021-04-06 | The Boeing Company | Broadband conformal antenna |
| KR102318761B1 (ko) | 2017-08-24 | 2021-10-28 | 삼성전자주식회사 | 안테나를 포함하는 전자 장치 |
| KR102019354B1 (ko) * | 2017-11-03 | 2019-09-09 | 삼성전자주식회사 | 안테나 모듈 |
| KR102028714B1 (ko) | 2017-12-06 | 2019-10-07 | 삼성전자주식회사 | 안테나 모듈 및 안테나 모듈 제조 방법 |
| US11710904B2 (en) | 2017-12-26 | 2023-07-25 | Vayyar Imaging Ltd. | Cavity backed antenna with in-cavity resonators |
| US10283832B1 (en) * | 2017-12-26 | 2019-05-07 | Vayyar Imaging Ltd. | Cavity backed slot antenna with in-cavity resonators |
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| JP2025526230A (ja) * | 2022-06-09 | 2025-08-13 | 國立清華大學 | 超広帯域全方向性デュオ・アロエベラ・クルーセス・コンセントリシス・アンテナ構造 |
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| JP2001016027A (ja) * | 1999-06-30 | 2001-01-19 | Kyocera Corp | 積層型開口面アンテナ |
| FI112982B (fi) * | 1999-08-25 | 2004-02-13 | Filtronic Lk Oy | Tasoantennirakenne |
| JP2001068924A (ja) * | 1999-08-30 | 2001-03-16 | Kyocera Corp | 積層型開口面アンテナ |
| JP4242983B2 (ja) * | 1999-09-29 | 2009-03-25 | 京セラ株式会社 | 積層型開口面アレイアンテナ |
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| JP4216979B2 (ja) * | 1999-12-24 | 2009-01-28 | 京セラ株式会社 | アンテナ給電線路およびそれを用いたアンテナモジュール |
| US6239762B1 (en) | 2000-02-02 | 2001-05-29 | Lockheed Martin Corporation | Interleaved crossed-slot and patch array antenna for dual-frequency and dual polarization, with multilayer transmission-line feed network |
| JP3629399B2 (ja) | 2000-04-18 | 2005-03-16 | シャープ株式会社 | アンテナ一体化マイクロ波・ミリ波モジュール |
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| US6727855B1 (en) | 2002-11-21 | 2004-04-27 | The United States Of America As Represented By The Secretary Of The Army | Folded multilayer electrically small microstrip antenna |
-
2004
- 2004-08-31 US US10/930,660 patent/US7057564B2/en not_active Expired - Lifetime
-
2005
- 2005-07-20 WO PCT/US2005/026065 patent/WO2006025972A1/en not_active Ceased
- 2005-07-20 KR KR1020077004746A patent/KR20070046898A/ko not_active Withdrawn
- 2005-07-20 JP JP2007529865A patent/JP2008512048A/ja active Pending
- 2005-07-20 EP EP05776419A patent/EP1790036A1/en not_active Withdrawn
- 2005-07-20 CN CN2005800260563A patent/CN1993863B/zh not_active Expired - Fee Related
- 2005-08-09 TW TW094127045A patent/TWI374572B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI708434B (zh) * | 2019-12-27 | 2020-10-21 | 財團法人工業技術研究院 | 高整合度多天線陣列 |
| US11276942B2 (en) | 2019-12-27 | 2022-03-15 | Industrial Technology Research Institute | Highly-integrated multi-antenna array |
Also Published As
| Publication number | Publication date |
|---|---|
| US7057564B2 (en) | 2006-06-06 |
| EP1790036A1 (en) | 2007-05-30 |
| KR20070046898A (ko) | 2007-05-03 |
| US20060044188A1 (en) | 2006-03-02 |
| CN1993863A (zh) | 2007-07-04 |
| CN1993863B (zh) | 2012-07-18 |
| WO2006025972A1 (en) | 2006-03-09 |
| TW200629649A (en) | 2006-08-16 |
| JP2008512048A (ja) | 2008-04-17 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |