CN1993863B - 多层腔隙缝天线 - Google Patents

多层腔隙缝天线 Download PDF

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Publication number
CN1993863B
CN1993863B CN2005800260563A CN200580026056A CN1993863B CN 1993863 B CN1993863 B CN 1993863B CN 2005800260563 A CN2005800260563 A CN 2005800260563A CN 200580026056 A CN200580026056 A CN 200580026056A CN 1993863 B CN1993863 B CN 1993863B
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CN
China
Prior art keywords
conductive layer
layer
conductive
slot antenna
radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2005800260563A
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English (en)
Chinese (zh)
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CN1993863A (zh
Inventor
希-陶·察伊
托马斯·E·杰尔柯勒
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NXP USA Inc
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Freescale Semiconductor Inc
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Filing date
Publication date
Application filed by Freescale Semiconductor Inc filed Critical Freescale Semiconductor Inc
Publication of CN1993863A publication Critical patent/CN1993863A/zh
Application granted granted Critical
Publication of CN1993863B publication Critical patent/CN1993863B/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
CN2005800260563A 2004-08-31 2005-07-20 多层腔隙缝天线 Expired - Fee Related CN1993863B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/930,660 US7057564B2 (en) 2004-08-31 2004-08-31 Multilayer cavity slot antenna
US10/930,660 2004-08-31
PCT/US2005/026065 WO2006025972A1 (en) 2004-08-31 2005-07-20 Multilayer cavity slot antenna

Publications (2)

Publication Number Publication Date
CN1993863A CN1993863A (zh) 2007-07-04
CN1993863B true CN1993863B (zh) 2012-07-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2005800260563A Expired - Fee Related CN1993863B (zh) 2004-08-31 2005-07-20 多层腔隙缝天线

Country Status (7)

Country Link
US (1) US7057564B2 (enExample)
EP (1) EP1790036A1 (enExample)
JP (1) JP2008512048A (enExample)
KR (1) KR20070046898A (enExample)
CN (1) CN1993863B (enExample)
TW (1) TWI374572B (enExample)
WO (1) WO2006025972A1 (enExample)

Cited By (2)

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US9065286B2 (en) 2005-07-12 2015-06-23 Massachusetts Institute Of Technology Wireless non-radiative energy transfer
US9444265B2 (en) 2005-07-12 2016-09-13 Massachusetts Institute Of Technology Wireless energy transfer

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JP6946466B2 (ja) 2017-05-12 2021-10-06 ホアウェイ・テクノロジーズ・カンパニー・リミテッド 通信デバイス
CN113571882B (zh) * 2017-05-12 2023-02-03 华为技术有限公司 一种通信设备
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KR102019354B1 (ko) * 2017-11-03 2019-09-09 삼성전자주식회사 안테나 모듈
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US10283832B1 (en) * 2017-12-26 2019-05-07 Vayyar Imaging Ltd. Cavity backed slot antenna with in-cavity resonators
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9065286B2 (en) 2005-07-12 2015-06-23 Massachusetts Institute Of Technology Wireless non-radiative energy transfer
US9444265B2 (en) 2005-07-12 2016-09-13 Massachusetts Institute Of Technology Wireless energy transfer
US9450421B2 (en) 2005-07-12 2016-09-20 Massachusetts Institute Of Technology Wireless non-radiative energy transfer
US9450422B2 (en) 2005-07-12 2016-09-20 Massachusetts Institute Of Technology Wireless energy transfer
US9509147B2 (en) 2005-07-12 2016-11-29 Massachusetts Institute Of Technology Wireless energy transfer

Also Published As

Publication number Publication date
US7057564B2 (en) 2006-06-06
EP1790036A1 (en) 2007-05-30
TWI374572B (en) 2012-10-11
KR20070046898A (ko) 2007-05-03
US20060044188A1 (en) 2006-03-02
CN1993863A (zh) 2007-07-04
WO2006025972A1 (en) 2006-03-09
TW200629649A (en) 2006-08-16
JP2008512048A (ja) 2008-04-17

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