KR20070046898A - 다층 공동 슬롯 안테나 - Google Patents

다층 공동 슬롯 안테나 Download PDF

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Publication number
KR20070046898A
KR20070046898A KR1020077004746A KR20077004746A KR20070046898A KR 20070046898 A KR20070046898 A KR 20070046898A KR 1020077004746 A KR1020077004746 A KR 1020077004746A KR 20077004746 A KR20077004746 A KR 20077004746A KR 20070046898 A KR20070046898 A KR 20070046898A
Authority
KR
South Korea
Prior art keywords
conductive layer
conductive
layers
layer
slot antenna
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077004746A
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English (en)
Korean (ko)
Inventor
치-타우 트사이
토마스 이. 저클
Original Assignee
프리스케일 세미컨덕터, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by 프리스케일 세미컨덕터, 인크. filed Critical 프리스케일 세미컨덕터, 인크.
Publication of KR20070046898A publication Critical patent/KR20070046898A/ko
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H01L2924/15321—Connection portion the connection portion being formed on the die mounting surface of the substrate being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Waveguide Aerials (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
KR1020077004746A 2004-08-31 2005-07-20 다층 공동 슬롯 안테나 Withdrawn KR20070046898A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/930,660 2004-08-31
US10/930,660 US7057564B2 (en) 2004-08-31 2004-08-31 Multilayer cavity slot antenna

Publications (1)

Publication Number Publication Date
KR20070046898A true KR20070046898A (ko) 2007-05-03

Family

ID=35942327

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077004746A Withdrawn KR20070046898A (ko) 2004-08-31 2005-07-20 다층 공동 슬롯 안테나

Country Status (7)

Country Link
US (1) US7057564B2 (enExample)
EP (1) EP1790036A1 (enExample)
JP (1) JP2008512048A (enExample)
KR (1) KR20070046898A (enExample)
CN (1) CN1993863B (enExample)
TW (1) TWI374572B (enExample)
WO (1) WO2006025972A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
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KR100916072B1 (ko) * 2007-07-11 2009-09-08 삼성전기주식회사 칩 안테나
WO2019039882A1 (ko) * 2017-08-24 2019-02-28 삼성전자 주식회사 안테나를 포함하는 전자 장치
KR20190050576A (ko) * 2017-11-03 2019-05-13 삼성전기주식회사 안테나 모듈
KR20190066939A (ko) * 2017-12-06 2019-06-14 삼성전자주식회사 안테나 모듈 및 안테나 모듈 제조 방법

Families Citing this family (87)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7825543B2 (en) 2005-07-12 2010-11-02 Massachusetts Institute Of Technology Wireless energy transfer
CN102983639B (zh) 2005-07-12 2016-01-27 麻省理工学院 无线非辐射能量传递
WO2007055028A1 (ja) * 2005-11-14 2007-05-18 Anritsu Corporation 直線偏波アンテナ及びそれを用いるレーダ装置
US20070182636A1 (en) * 2006-02-06 2007-08-09 Nokia Corporation Dual band trace antenna for WLAN frequencies in a mobile phone
KR100819196B1 (ko) 2006-10-25 2008-04-04 광운대학교 산학협력단 금속에 부착 가능한 ｕｈｆ대역 ｒｆｉｄ 태그 안테나
TWI355772B (en) * 2006-12-29 2012-01-01 Advanced Semiconductor Eng Carrier with solid antenna structure and manufactu
US7746283B2 (en) * 2007-05-17 2010-06-29 Laird Technologies, Inc. Radio frequency identification (RFID) antenna assemblies with folded patch-antenna structures
US7916033B2 (en) * 2007-10-12 2011-03-29 Solstice Medical, Llc Small gamma shielded shorted patch RFID tag
US8344889B2 (en) * 2007-12-17 2013-01-01 Solstice Medical, Llc Side loaded shorted patch RFID tag
EP2281322B1 (en) * 2008-05-14 2016-03-23 Massachusetts Institute of Technology Wireless energy transfer, including interference enhancement
EP2345100B1 (en) 2008-10-01 2018-12-05 Massachusetts Institute of Technology Efficient near-field wireless energy transfer using adiabatic system variations
EP2178119B1 (en) * 2008-10-20 2018-06-20 QUALCOMM Incorporated Surface mountable integrated circuit package
JP5253468B2 (ja) * 2010-09-03 2013-07-31 株式会社東芝 アンテナ装置及びレーダ装置
US8730106B2 (en) * 2011-01-19 2014-05-20 Harris Corporation Communications device and tracking device with slotted antenna and related methods
US8786507B2 (en) * 2011-04-27 2014-07-22 Blackberry Limited Antenna assembly utilizing metal-dielectric structures
US8860532B2 (en) * 2011-05-20 2014-10-14 University Of Central Florida Research Foundation, Inc. Integrated cavity filter/antenna system
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JP6517629B2 (ja) * 2015-08-20 2019-05-22 株式会社東芝 平面型アンテナ装置
US10181653B2 (en) 2016-07-21 2019-01-15 Infineon Technologies Ag Radio frequency system for wearable device
US10128192B2 (en) * 2016-07-22 2018-11-13 Mediatek Inc. Fan-out package structure
US10218407B2 (en) 2016-08-08 2019-02-26 Infineon Technologies Ag Radio frequency system and method for wearable device
US10466772B2 (en) 2017-01-09 2019-11-05 Infineon Technologies Ag System and method of gesture detection for a remote device
US10505255B2 (en) 2017-01-30 2019-12-10 Infineon Technologies Ag Radio frequency device packages and methods of formation thereof
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WO2018206116A1 (en) 2017-05-12 2018-11-15 Huawei Technologies Co., Ltd. Communication device
JP6950084B2 (ja) * 2017-05-15 2021-10-13 ソニーグループ株式会社 ミリ波通信用のパッチアンテナ
US10056922B1 (en) 2017-06-14 2018-08-21 Infineon Technologies Ag Radio frequency device modules and methods of formation thereof
US10602548B2 (en) 2017-06-22 2020-03-24 Infineon Technologies Ag System and method for gesture sensing
US10186492B1 (en) * 2017-07-18 2019-01-22 Taiwan Semiconductor Manufacturing Co., Ltd. Package structure and manufacturing method thereof
US10971806B2 (en) 2017-08-22 2021-04-06 The Boeing Company Broadband conformal antenna
US10283832B1 (en) * 2017-12-26 2019-05-07 Vayyar Imaging Ltd. Cavity backed slot antenna with in-cavity resonators
US11710904B2 (en) 2017-12-26 2023-07-25 Vayyar Imaging Ltd. Cavity backed antenna with in-cavity resonators
US11346936B2 (en) 2018-01-16 2022-05-31 Infineon Technologies Ag System and method for vital signal sensing using a millimeter-wave radar sensor
US11278241B2 (en) 2018-01-16 2022-03-22 Infineon Technologies Ag System and method for vital signal sensing using a millimeter-wave radar sensor
FR3077165B1 (fr) * 2018-01-19 2021-12-24 Arianegroup Sas Antenne planaire destinee a equiper un vehicule spatial
US10795012B2 (en) 2018-01-22 2020-10-06 Infineon Technologies Ag System and method for human behavior modelling and power control using a millimeter-wave radar sensor
US11233310B2 (en) * 2018-01-29 2022-01-25 The Boeing Company Low-profile conformal antenna
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US10705198B2 (en) 2018-03-27 2020-07-07 Infineon Technologies Ag System and method of monitoring an air flow using a millimeter-wave radar sensor
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US11416077B2 (en) 2018-07-19 2022-08-16 Infineon Technologies Ag Gesture detection system and method using a radar sensor
US10923831B2 (en) 2018-08-24 2021-02-16 The Boeing Company Waveguide-fed planar antenna array with enhanced circular polarization
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US12405351B2 (en) 2022-03-25 2025-09-02 Infineon Technologies Ag Adaptive Tx-Rx crosstalk cancellation for radar systems
US12399254B2 (en) 2022-06-07 2025-08-26 Infineon Technologies Ag Radar-based single target vital sensing
US20230402740A1 (en) * 2022-06-09 2023-12-14 National Tsing Hua University Ultra-Wideband Omnidirectional And Polarization Insensitive Duo Aloe Vera Cruces Concentricis Antenna Structure Applied To Electromagnetic Wave Energy Absorber, Thermoelectric Energy Harvester, Photoconductive Antenna, Array Antenna And Rectenna
AU2022463003A1 (en) * 2022-06-09 2024-10-17 National Tsing Hua University Ultra-wideband omnidirectional duo aloe vera cruces concentricis antenna structure
US12399271B2 (en) 2022-07-20 2025-08-26 Infineon Technologies Ag Radar-based target tracker
US12254670B2 (en) 2022-07-29 2025-03-18 Infineon Technologies Ag Radar-based activity classification

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5608414A (en) * 1995-06-30 1997-03-04 Martin Marietta Corp. Heat rejecting spacecraft array antenna
KR100355263B1 (ko) * 1995-09-05 2002-12-31 가부시끼가이샤 히다치 세이사꾸쇼 동축공진형슬롯안테나와그제조방법및휴대무선단말
US6172651B1 (en) * 1995-10-25 2001-01-09 Larsen Electronics, Inc. Dual-band window mounted antenna system for mobile communications
JP3266491B2 (ja) * 1996-02-29 2002-03-18 京セラ株式会社 高周波用パッケージ
JP3427040B2 (ja) * 1996-02-29 2003-07-14 京セラ株式会社 高周波用パッケージ
JPH09270633A (ja) * 1996-03-29 1997-10-14 Hitachi Ltd Ｔｅｍスロットアレイアンテナ
JPH10135727A (ja) * 1996-10-30 1998-05-22 Hitachi Ltd 同軸共振型スロットアンテナ
US5966101A (en) * 1997-05-09 1999-10-12 Motorola, Inc. Multi-layered compact slot antenna structure and method
JP3420474B2 (ja) * 1997-07-25 2003-06-23 京セラ株式会社 積層型開口面アンテナ及びそれを具備する多層配線基板
US6028562A (en) * 1997-07-31 2000-02-22 Ems Technologies, Inc. Dual polarized slotted array antenna
US6121932A (en) * 1998-11-03 2000-09-19 Motorola, Inc. Microstrip antenna and method of forming same
JP3407694B2 (ja) * 1999-06-17 2003-05-19 株式会社村田製作所 高周波多層回路部品
JP2001016027A (ja) * 1999-06-30 2001-01-19 Kyocera Corp 積層型開口面アンテナ
FI112982B (fi) * 1999-08-25 2004-02-13 Filtronic Lk Oy Tasoantennirakenne
JP2001068924A (ja) * 1999-08-30 2001-03-16 Kyocera Corp 積層型開口面アンテナ
JP4242983B2 (ja) * 1999-09-29 2009-03-25 京セラ株式会社 積層型開口面アレイアンテナ
SE515832C2 (sv) * 1999-12-16 2001-10-15 Allgon Ab Slitsantennanordning
JP4216979B2 (ja) * 1999-12-24 2009-01-28 京セラ株式会社 アンテナ給電線路およびそれを用いたアンテナモジュール
US6239762B1 (en) * 2000-02-02 2001-05-29 Lockheed Martin Corporation Interleaved crossed-slot and patch array antenna for dual-frequency and dual polarization, with multilayer transmission-line feed network
JP3629399B2 (ja) * 2000-04-18 2005-03-16 シャープ株式会社 アンテナ一体化マイクロ波・ミリ波モジュール
JP2001339207A (ja) * 2000-05-26 2001-12-07 Kyocera Corp アンテナ給電線路およびそれを用いたアンテナモジュール
WO2002003499A1 (fr) 2000-06-30 2002-01-10 Sharp Kabushiki Kaisha Dispositif de communication radio avec antenne, emetteur et recepteur integres
JP3802405B2 (ja) * 2001-11-30 2006-07-26 日本放送協会 アクティブスロットアンテナ及びアクティブスロットアレーアンテナ及びそれを用いた送信装置と受信装置
US6727855B1 (en) * 2002-11-21 2004-04-27 The United States Of America As Represented By The Secretary Of The Army Folded multilayer electrically small microstrip antenna

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100916072B1 (ko) * 2007-07-11 2009-09-08 삼성전기주식회사 칩 안테나
WO2019039882A1 (ko) * 2017-08-24 2019-02-28 삼성전자 주식회사 안테나를 포함하는 전자 장치
KR20190021785A (ko) * 2017-08-24 2019-03-06 삼성전자주식회사 안테나를 포함하는 전자 장치
US11196151B2 (en) 2017-08-24 2021-12-07 Samsung Electronics Co., Ltd. Electronic device comprising antenna
KR20190050576A (ko) * 2017-11-03 2019-05-13 삼성전기주식회사 안테나 모듈
US10763225B2 (en) 2017-11-03 2020-09-01 Samsung Electronics Co., Ltd. Antenna module
US11217543B2 (en) 2017-11-03 2022-01-04 Samsung Electronics Co., Ltd. Antenna module
KR20190066939A (ko) * 2017-12-06 2019-06-14 삼성전자주식회사 안테나 모듈 및 안테나 모듈 제조 방법
US10790595B2 (en) 2017-12-06 2020-09-29 Samsung Electronics Co., Ltd. Antenna module and manufacturing method thereof

Also Published As

Publication number Publication date
CN1993863B (zh) 2012-07-18
US20060044188A1 (en) 2006-03-02
WO2006025972A1 (en) 2006-03-09
EP1790036A1 (en) 2007-05-30
US7057564B2 (en) 2006-06-06
JP2008512048A (ja) 2008-04-17
CN1993863A (zh) 2007-07-04
TW200629649A (en) 2006-08-16
TWI374572B (en) 2012-10-11

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