TWI368757B - Device for floating a substrate - Google Patents

Device for floating a substrate

Info

Publication number
TWI368757B
TWI368757B TW093111647A TW93111647A TWI368757B TW I368757 B TWI368757 B TW I368757B TW 093111647 A TW093111647 A TW 093111647A TW 93111647 A TW93111647 A TW 93111647A TW I368757 B TWI368757 B TW I368757B
Authority
TW
Taiwan
Prior art keywords
floating
substrate
Prior art date
Application number
TW093111647A
Other languages
English (en)
Chinese (zh)
Other versions
TW200500635A (en
Inventor
Okahira Hiroyuki
Original Assignee
Olympus Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Corp filed Critical Olympus Corp
Publication of TW200500635A publication Critical patent/TW200500635A/zh
Application granted granted Critical
Publication of TWI368757B publication Critical patent/TWI368757B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/02—Conveying systems characterised by their application for specified purposes not otherwise provided for for conveying workpieces through baths of liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B65G49/065—Transporting devices for sheet glass in a horizontal position supported partially or completely on fluid cushions, e.g. a gas cushion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW093111647A 2003-04-30 2004-04-26 Device for floating a substrate TWI368757B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003125701 2003-04-30

Publications (2)

Publication Number Publication Date
TW200500635A TW200500635A (en) 2005-01-01
TWI368757B true TWI368757B (en) 2012-07-21

Family

ID=33410239

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093111647A TWI368757B (en) 2003-04-30 2004-04-26 Device for floating a substrate

Country Status (5)

Country Link
JP (1) JP4418428B2 (ja)
KR (1) KR101053770B1 (ja)
CN (2) CN102152966B (ja)
TW (1) TWI368757B (ja)
WO (1) WO2004096679A1 (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4268447B2 (ja) * 2003-05-14 2009-05-27 Ｈｏｙａ株式会社 基板保持具、基板処理装置、基板検査装置及びこれらの使用方法
JP4754885B2 (ja) * 2004-11-30 2011-08-24 株式会社ダイヘン 基板搬送装置
JP4809612B2 (ja) * 2005-02-10 2011-11-09 パナソニック株式会社 基板搬送方法
JP4895518B2 (ja) * 2005-03-22 2012-03-14 オリンパス株式会社 基板保持装置及び基板の保持方法
CN101253113B (zh) 2005-09-02 2012-10-17 平田机工株式会社 工件搬入搬出系统及搬运装置
JP4758432B2 (ja) * 2005-09-29 2011-08-31 平田機工株式会社 ワーク収納装置
JP2007250871A (ja) * 2006-03-16 2007-09-27 Olympus Corp 基板搬送装置
JP2007281285A (ja) * 2006-04-10 2007-10-25 Olympus Corp 基板搬送装置
JP5084356B2 (ja) * 2007-06-11 2012-11-28 Ｎｓｋテクノロジー株式会社 露光装置用基板搬送機構及びそれを用いた基板位置調整方法
US8699001B2 (en) * 2009-08-20 2014-04-15 Nikon Corporation Object moving apparatus, object processing apparatus, exposure apparatus, object inspecting apparatus and device manufacturing method
CN102148176B (zh) * 2010-02-09 2013-02-06 北京北方微电子基地设备工艺研究中心有限责任公司 升降装置及具有该装置的半导体器件加工设备
JP2010251769A (ja) * 2010-05-24 2010-11-04 Olympus Corp 基板保持装置及び基板の保持方法
CN103182695B (zh) * 2011-12-29 2015-07-01 财团法人金属工业研究发展中心 可重组工具机的组构装置
KR101879162B1 (ko) * 2012-04-03 2018-07-16 가부시키가이샤 니콘 기판 처리 장치
CN102717314A (zh) * 2012-06-29 2012-10-10 苏州晟成新能源科技有限公司 修边机
KR101613121B1 (ko) 2014-03-18 2016-04-18 주식회사 에스에프에이 패턴 인쇄장치
JP6032234B2 (ja) * 2014-03-19 2016-11-24 信越半導体株式会社 ワーク保持装置
US10381256B2 (en) * 2015-03-12 2019-08-13 Kla-Tencor Corporation Apparatus and method for chucking warped wafers
CN106960810A (zh) * 2016-01-11 2017-07-18 锡宬国际有限公司 晶圆承载装置
KR101717680B1 (ko) * 2016-07-19 2017-03-20 디앤에이 주식회사 기판 안착장치
KR101865274B1 (ko) * 2016-08-31 2018-06-07 씨디에스(주) 경사구조를 이용한 기판 부상 이송장치
JP6842948B2 (ja) * 2017-02-24 2021-03-17 リンテック株式会社 位置決め装置および位置決め方法
JP7134039B2 (ja) * 2018-09-14 2022-09-09 東京エレクトロン株式会社 基板載置機構、成膜装置、および成膜方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0514034U (ja) * 1991-08-05 1993-02-23 横河電機株式会社 ウエハ搬送装置
TW559855B (en) * 2000-09-06 2003-11-01 Olympus Optical Co Wafer transfer apparatus
JP2002181714A (ja) * 2000-12-19 2002-06-26 Ishikawajima Harima Heavy Ind Co Ltd 薄板検査装置
JP2003040422A (ja) * 2001-07-27 2003-02-13 Toyota Industries Corp 物体浮揚搬送装置
JP2003063643A (ja) * 2001-08-30 2003-03-05 Nippon Sekkei Kogyo:Kk 薄板の搬送方法及び装置

Also Published As

Publication number Publication date
JPWO2004096679A1 (ja) 2006-07-13
CN1697768A (zh) 2005-11-16
KR101053770B1 (ko) 2011-08-02
CN1697768B (zh) 2011-03-30
WO2004096679A1 (ja) 2004-11-11
TW200500635A (en) 2005-01-01
JP4418428B2 (ja) 2010-02-17
KR20060015414A (ko) 2006-02-17
CN102152966B (zh) 2013-03-27
CN102152966A (zh) 2011-08-17

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees