TWI346258B - Substrate development apparatus - Google Patents

Substrate development apparatus

Info

Publication number
TWI346258B
TWI346258B TW093116720A TW93116720A TWI346258B TW I346258 B TWI346258 B TW I346258B TW 093116720 A TW093116720 A TW 093116720A TW 93116720 A TW93116720 A TW 93116720A TW I346258 B TWI346258 B TW I346258B
Authority
TW
Taiwan
Prior art keywords
development apparatus
substrate development
substrate
development
Prior art date
Application number
TW093116720A
Other languages
Chinese (zh)
Other versions
TW200516292A (en
Inventor
Futoshi Shimai
Shigeru Kawata
Original Assignee
Tokyo Ohka Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Ohka Kogyo Co Ltd filed Critical Tokyo Ohka Kogyo Co Ltd
Publication of TW200516292A publication Critical patent/TW200516292A/en
Application granted granted Critical
Publication of TWI346258B publication Critical patent/TWI346258B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Cleaning By Liquid Or Steam (AREA)
TW093116720A 2003-06-10 2004-06-10 Substrate development apparatus TWI346258B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003164537A JP3897114B2 (en) 2003-06-10 2003-06-10 Substrate developing device

Publications (2)

Publication Number Publication Date
TW200516292A TW200516292A (en) 2005-05-16
TWI346258B true TWI346258B (en) 2011-08-01

Family

ID=34091277

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093116720A TWI346258B (en) 2003-06-10 2004-06-10 Substrate development apparatus

Country Status (4)

Country Link
JP (1) JP3897114B2 (en)
KR (1) KR101043504B1 (en)
CN (1) CN100487587C (en)
TW (1) TWI346258B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4849914B2 (en) * 2006-03-13 2012-01-11 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing method, and computer-readable storage medium
KR101563128B1 (en) * 2015-01-09 2015-10-27 엠에스티코리아(주) apparatus for transferring substrates
JP7009130B2 (en) * 2017-09-21 2022-01-25 旭化成株式会社 Developing equipment, developing method and printing plate manufacturing method
CN117960679A (en) * 2024-04-01 2024-05-03 常州捷佳创精密机械有限公司 Silicon wafer cleaning equipment

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH051075Y2 (en) * 1987-04-10 1993-01-12
JPH04196519A (en) * 1990-11-28 1992-07-16 Matsushita Electric Ind Co Ltd Shower rinsing equipment of substrate
JP3638456B2 (en) * 1998-12-22 2005-04-13 大日本スクリーン製造株式会社 Substrate attitude changing device
JP2002338041A (en) * 2001-05-17 2002-11-27 Speedfam Clean System Co Ltd Method and device for treating substrate
JP3916891B2 (en) * 2001-06-19 2007-05-23 東京エレクトロン株式会社 Substrate processing apparatus and development processing apparatus
JP3704064B2 (en) * 2001-07-05 2005-10-05 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
JP2003306226A (en) 2002-04-12 2003-10-28 Shibaura Mechatronics Corp Substrate processing device and processing method

Also Published As

Publication number Publication date
JP2005005339A (en) 2005-01-06
KR101043504B1 (en) 2011-06-23
KR20040111004A (en) 2004-12-31
JP3897114B2 (en) 2007-03-22
TW200516292A (en) 2005-05-16
CN100487587C (en) 2009-05-13
CN1584744A (en) 2005-02-23

Similar Documents

Publication Publication Date Title
GB2400167B (en) Heatsink apparatus
GB0304033D0 (en) Apparatus
IL172123A0 (en) Photo-detecting apparatus
GB0426026D0 (en) Apparatus
IL159757A0 (en) Substrate supporting apparatus
GB0322544D0 (en) Apparatus
GB0310458D0 (en) Apparatus
GB0301607D0 (en) Apparatus
GB0427570D0 (en) Apparatus
GB0202319D0 (en) Apparatus
EP1481935A4 (en) Elevaltor apparatus
GB0307123D0 (en) Apparatus
GB0425084D0 (en) Apparatus
AU2003275563A1 (en) Substrate washing apparatus
GB0307125D0 (en) Apparatus
EP1550508A4 (en) Substance-atomizing apparatus
TWI346258B (en) Substrate development apparatus
GB0203182D0 (en) Apparatus
EP1628792A4 (en) Sand-forming apparatus
EP1693909A4 (en) Electronic apparatus
TW564994U (en) R-chip substrate strippulator
GB0326325D0 (en) Apparatus
GB0321970D0 (en) Deblistering apparatus
GB0413612D0 (en) An apparatus
GB2401809B (en) Substrate support apparatus

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees