JPH051075Y2 - - Google Patents
Info
- Publication number
- JPH051075Y2 JPH051075Y2 JP1987055147U JP5514787U JPH051075Y2 JP H051075 Y2 JPH051075 Y2 JP H051075Y2 JP 1987055147 U JP1987055147 U JP 1987055147U JP 5514787 U JP5514787 U JP 5514787U JP H051075 Y2 JPH051075 Y2 JP H051075Y2
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- wafer
- carrier
- stage
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007788 liquid Substances 0.000 claims description 66
- 235000012431 wafers Nutrition 0.000 description 42
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
Landscapes
- Weting (AREA)
Description
【考案の詳細な説明】
〔産業上の利用分野〕
本考案は半導体の製造に使用される液処理装置
の改良に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an improvement of a liquid processing apparatus used in the manufacture of semiconductors.
従来より半導体製造においてウエハをエツチン
グしたり、洗浄や現像といつた液処理を施すに
は、例えば、第５図に示すような液処理装置１０
０が使用されている。該液処理装置１００では、
ウエハ１１が搭載されたキヤリア１０を、揺動体
１３の先端に設けてあるステージ１０２のキヤリ
ヤ支持部１０２ｂに支持させて液槽１４内に潜入
させ、上記揺動体１３の他端を例えば偏心カム１
３ａ等の回動をシヤフト１３ｂによつて上下運動
に変換させることで、液槽１４内においてステー
ジ１０２を上下動させながらウエハ１１に液処理
が施されている。また、上記キヤリヤ支持部１０
２ｂには適所にスリツト１０２ｃが設けられてお
り、処理液１４ｂがキヤリヤ１０内を十分に流動
できるようになつている。このような液処理装置
１００では、処理液１４ｂを循環させて使用する
ため、液槽１４から溢れ出た処理液１４ｂは液受
１４ａで受け止められ、ポンプ１５ａやフイルタ
１５ｂ等を介して再び液槽１４に戻されている。
Conventionally, in semiconductor manufacturing, in order to perform liquid processing such as etching, cleaning, and development on wafers, for example, a liquid processing apparatus 10 as shown in FIG.
0 is used. In the liquid processing device 100,
The carrier 10 on which the wafer 11 is mounted is supported by the carrier support portion 102b of the stage 102 provided at the tip of the oscillating body 13 and inserted into the liquid tank 14, and the other end of the oscillating body 13 is connected to the eccentric cam 1, for example.
The wafer 11 is subjected to liquid treatment while the stage 102 is moved up and down in the liquid tank 14 by converting the rotation of the parts 3a and the like into vertical movement by the shaft 13b. Further, the carrier support section 10
A slit 102c is provided at a suitable position in the carrier 2b, so that the processing liquid 14b can sufficiently flow inside the carrier 10. In such a liquid processing apparatus 100, since the processing liquid 14b is circulated and used, the processing liquid 14b overflowing from the liquid tank 14 is received by the liquid receiver 14a and returned to the liquid tank via the pump 15a, filter 15b, etc. It has been returned to 14.
しかしながら、上述したような液処理装置１０
０に使用されるウエハ１１を搭載したキヤリヤ１
０では、第６図にその一部を示しているように、
ステージ１０２の上下動によりウエハ１１に液処
理を施す場合に、該ウエハ１１がウエハ１１ａの
ようにウエハ溝１０ａの中央に位置されていれば
液処理には何ら問題は発生しない。しかし、ウエ
ハ１１ｂ，１１ｃのようにウエハ溝１０ａ側壁１
０ｂに接触していると、ステージ１０２の下方向
の動作によつて処理液１４ｂが実線で示す方向に
流動した時や、逆にステージ１０２の上方向の動
作によつて破線で示す方向に処理液が流動して
も、上記ウエハ１１ｂ，１１ｃが側壁１０ｂより
離れないで接触していることがある。これでは、
その接触部分の液処理が行われなかつたり、不十
分となり問題となつてくる。
However, the liquid processing device 10 as described above
Carrier 1 carrying wafer 11 used for
0, as shown in part in Figure 6,
When performing liquid treatment on the wafer 11 by vertically moving the stage 102, no problem will occur in the liquid treatment if the wafer 11 is located at the center of the wafer groove 10a like the wafer 11a. However, like the wafers 11b and 11c, the side wall 1 of the wafer groove 10a
0b, when the processing liquid 14b flows in the direction shown by the solid line due to the downward movement of the stage 102, or conversely, when the processing liquid 14b flows in the direction shown by the broken line due to the upward movement of the stage 102. Even if the liquid flows, the wafers 11b and 11c may be in contact with each other without being separated from the side wall 10b. In this case,
The liquid treatment of the contact area may not be performed or may be insufficient, which poses a problem.
本考案は、上記問題点を解決するためになされ
たもので、ウエハを搭載したキヤリアをステージ
に支持させて、該ステージを液漕内で上下動させ
てウエハに液処理を施す液処理装置において、ス
テージはウエハ面を傾斜させる方向にキヤリアを
傾斜姿勢で支持するものであつて、その上下動に
おける下降時の速度はウエハに上方に向かう力を
付与して該ウエハの下面をキヤリアの溝内と非接
触とするにたる速度であることを特徴としてい
る。すなわち、ウエハを搭載したキヤリアを液漕
内で上下動させてステージに支持させてウエハに
液処理を施すものであつて、上記ステージはウエ
ハ面を傾斜させる方向にキヤリアを傾斜姿勢で支
持すると共に揺動体によつて上下動され、この上
下動における下降時の速度を液の流れでウエハを
押し上げて、ウエハ下面とキヤリアを非接触する
ように設定したことを特徴とする液処理装置であ
る。
The present invention was developed to solve the above problems, and is used in a liquid processing apparatus in which a carrier carrying a wafer is supported on a stage, and the stage is moved up and down in a liquid tank to perform liquid processing on the wafer. , the stage supports the carrier in an inclined position in the direction of inclining the wafer surface, and the lowering speed of the stage during vertical movement applies an upward force to the wafer to move the lower surface of the wafer into the groove of the carrier. It is characterized by being fast enough to be non-contact. That is, a carrier carrying a wafer is moved up and down in a liquid tank and supported by a stage to perform liquid treatment on the wafer. This liquid processing apparatus is moved up and down by a rocking body, and the speed at which the wafer descends during this up-and-down movement is set so that the wafer is pushed up by the flow of liquid so that the lower surface of the wafer and the carrier are not in contact with each other.
かかる構成とすれば、ウエハを搭載してあるキ
ヤリヤが傾斜姿勢でステージ上に支持されている
ので、液槽内で該ステージを下方向に動かせる
と、処理液は傾斜姿勢のウエハ面に斜め上方に押
上げるような力を加えながら流動するため、下面
側はキヤリアの溝内と非接触となつてその面は十
分な液処理が施される。また、逆に上記ステージ
を上方向に動かせると、処理液は傾斜姿勢のウエ
ハの反対面に斜め下方に押下げるような力を加え
ながら流動するため、その力及び自重によりウエ
ハは下に押下げられその上面はキヤリアの溝内と
非接触となつてその面は十分な液処理が施される
ことになる。このように、絶えず処理液がウエハ
の両面に接しながら流動されるので、ウエハ面で
液処理の不十分な部分がなくなり、液処理も迅速
に行われるようになる。
With this configuration, the carrier carrying the wafer is supported on the stage in an inclined position, so when the stage is moved downward in the liquid bath, the processing liquid is applied diagonally upward onto the wafer surface in the inclined position. Since it flows while applying a force pushing it up, the lower surface side is not in contact with the inside of the carrier groove, and that surface is subjected to sufficient liquid treatment. Conversely, if the stage is moved upward, the processing liquid will flow while applying a downward force to the opposite side of the wafer in an inclined position, and the wafer will be pushed downward by that force and its own weight. The upper surface of the carrier is not in contact with the inside of the groove of the carrier, and that surface is subjected to sufficient liquid treatment. In this way, since the processing liquid is constantly flowing while contacting both surfaces of the wafer, there are no areas on the wafer surface where the liquid treatment is insufficient, and the liquid processing can be performed quickly.
以下、図面を参照して本考案の実施例を説明す
る。
Embodiments of the present invention will be described below with reference to the drawings.
第１図は本考案の液処理装置に使用されるステ
ージ１２の一実施例の斜視図である。図に示すよ
うにステージ１２は、ウエハ１１を搭載したキヤ
リヤ１０の支持部１２ｂと、キヤリヤ止め１２ａ
および側壁１２ｃから構成されている。上記支持
部１２ｂはキヤリヤ１０が傾斜姿勢で支持される
ように、次第にその厚さが薄くなつて傾斜が付け
られており、最薄部に上記キヤリヤ止め１２ａが
設けられている。さらに、上記支持部１２ｂに
は、処理液がキヤリヤ１０内に十分に流動するよ
うに複数箇所にスリツト１２ｄ…が設けられてい
る。このスリツト１２ｄはキヤリヤ１０の下部開
口と同一形状寸法に形成されてもよい。このよう
なステージ１２に支持されたキヤリヤ１０は、第
２図に示すように液槽１４に浸されて、揺動体１
３の上下動によつて搭載したウエハ１１に液処理
が施される。図において、第１図に示したステー
ジ１２の構造を除いて、第５図と同様な構成であ
るので同一部分に同一符号を付してその説明は省
略する。 FIG. 1 is a perspective view of an embodiment of a stage 12 used in the liquid processing apparatus of the present invention. As shown in the figure, the stage 12 includes a support portion 12b of the carrier 10 on which the wafer 11 is mounted, and a carrier stop 12a.
and a side wall 12c. The support portion 12b has a thickness that gradually becomes thinner and is inclined so that the carrier 10 is supported in an inclined position, and the carrier stop 12a is provided at the thinnest portion. Further, the support portion 12b is provided with slits 12d at a plurality of locations so that the processing liquid can flow sufficiently into the carrier 10. This slit 12d may be formed to have the same shape and dimensions as the lower opening of the carrier 10. The carrier 10 supported by such a stage 12 is immersed in a liquid tank 14 as shown in FIG.
By the vertical movement of 3, the mounted wafer 11 is subjected to liquid treatment. In the figure, the structure is the same as that in FIG. 5 except for the structure of the stage 12 shown in FIG. 1, so the same parts are given the same reference numerals and the explanation thereof will be omitted.
さらに、第３図に他のステージの実施例を示す
と、このステージ１２′は水平な支持部１２b′の
複数箇所にスリツト１２d′…が設けられている。
さらに、キヤリヤ１０が傾斜姿勢で液槽１４に潜
入できるように、キヤリヤ止め１２ａと反対方向
の支持部１２′上に台１２ｅが設けられている。
これにより、キヤリヤ１０は液槽１４内で傾斜姿
勢を維持することができる。その他の構成は前記
実施例と同様であるため説明は省略する。 Further, FIG. 3 shows another embodiment of the stage. This stage 12' is provided with slits 12d' at a plurality of locations on a horizontal support portion 12b'.
Furthermore, a stand 12e is provided on the support portion 12' in the opposite direction to the carrier stop 12a so that the carrier 10 can enter the liquid tank 14 in an inclined position.
Thereby, the carrier 10 can maintain an inclined posture within the liquid tank 14. The rest of the configuration is the same as that of the previous embodiment, so a description thereof will be omitted.
さて、次に上述したような構造のステージ１
２，１２′に傾斜姿勢で支持されたキヤリヤ１０
に搭載されたウエハ１１に液処理が施されている
状態を第４図を用いて説明する。同図ａは液槽１
４内でキヤリヤ１０を下方に動作させている状態
を示している。この時処理液は矢印で示すように
傾斜姿勢のウエハ面１１ａを斜め上方に押上げる
ような力を加えながら流動するため、搭載された
ウエハ１１の全ウエハ面１１ａ…に十分な液処理
を施すことができる。また、逆に同図ｂに示すよ
うに、キヤリヤ１０を上方向に動かせると、処理
液は矢印で示すように傾斜姿勢のウエハ面１１ｂ
を斜め下方に押下げるような力を加えながら流動
するため、全ウエハ面１１ｂ…に十分な液処理が
施されることになる。このような動作が繰り返さ
れ絶えず処理液がウエハの両面に触れながら流動
されるので、ウエハ１１の全面に万遍なく迅速に
液処理が施されることなる。 Now, next is stage 1 of the structure as described above.
Carrier 10 supported in an inclined position on 2, 12'
The state in which the liquid treatment is applied to the wafer 11 mounted on the wafer 11 will be explained with reference to FIG. In the same figure, a shows liquid tank 1.
4, the carrier 10 is shown moving downward. At this time, the processing liquid flows while applying a force that pushes the wafer surface 11a in the inclined position diagonally upward as shown by the arrow, so that the entire wafer surface 11a of the mounted wafer 11 is subjected to sufficient liquid treatment. be able to. Conversely, if the carrier 10 is moved upward as shown in FIG.
Since the liquid flows while applying a force that pushes the liquid diagonally downward, the entire wafer surface 11b is subjected to sufficient liquid treatment. This operation is repeated and the processing liquid is constantly flowed while touching both sides of the wafer, so that the entire surface of the wafer 11 is uniformly and quickly processed.
以上の説明から明らかなように、本考案の液処
理装置では、キヤリヤに搭載されたウエハの全面
に十分な液処理を行うことができ、また処理液が
絶えずウエハ全面に接するので迅速に液処理が行
える。
As is clear from the above explanation, the liquid processing apparatus of the present invention can perform sufficient liquid processing on the entire surface of the wafer mounted on the carrier, and since the processing liquid is constantly in contact with the entire surface of the wafer, the liquid processing can be performed quickly. can be done.
第１図は本考案の液処理装置に使用されるステ
ージの一実施例の斜視図、第２図は上記ステージ
を用いた本考案の液処理装置の要部の一部断面
図、第３図は他の実施例におけるステージを用い
た本考案の液処理装置の要部の一部断面図、第４
図ａ，ｂはそれぞれ処理液の流動によるウエハの
状態を示した図、第５図は従来の液処理装置の要
部の一部断面図、第６図は従来の処理液の流動に
よるウエハの状態を示した図である。
１……液処理装置、１０……キヤリヤ、１１…
…ウエハ、１２，１２′……ステージ、１４……
液槽。
FIG. 1 is a perspective view of an embodiment of the stage used in the liquid processing apparatus of the present invention, FIG. 2 is a partial cross-sectional view of a main part of the liquid processing apparatus of the present invention using the above stage, and FIG. 3 4 is a partial cross-sectional view of a main part of the liquid processing apparatus of the present invention using a stage in another embodiment;
Figures a and b show the state of the wafer due to the flow of the processing liquid, Figure 5 is a partial cross-sectional view of the main parts of a conventional liquid processing apparatus, and Figure 6 is a diagram showing the state of the wafer due to the flow of the conventional treatment liquid. It is a figure showing a state. 1...liquid processing device, 10...carrier, 11...
...Wafer, 12, 12'...Stage, 14...
liquid tank.
Claims (1)
せるステージに支持させてウエハに液処理を施す
ものであつて、上記ステージはウエハ面を傾斜さ
せる方向にキヤリアを傾斜姿勢で支持すると共に
揺動体によつて上下動され、この上下動における
下降時の速度を液の流れでウエハを押し上げて、
ウエハ下面とキヤリアを非接触するように設定し
たことを特徴とする液処理装置。 A carrier carrying a wafer is supported on a stage that moves up and down in a liquid tank to perform liquid treatment on the wafer. As a result, the wafer is moved up and down, and the downward speed of this up-and-down movement is used to push the wafer up with the flow of liquid.
A liquid processing apparatus characterized in that the carrier is set to be in non-contact with the lower surface of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987055147U JPH051075Y2 (en) | 1987-04-10 | 1987-04-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987055147U JPH051075Y2 (en) | 1987-04-10 | 1987-04-10 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63162528U JPS63162528U (en) | 1988-10-24 |
| JPH051075Y2 true JPH051075Y2 (en) | 1993-01-12 |
Family
ID=30882788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987055147U Expired - Lifetime JPH051075Y2 (en) | 1987-04-10 | 1987-04-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH051075Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3897114B2 (en) * | 2003-06-10 | 2007-03-22 | 東京応化工業株式会社 | Substrate developing device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887832A (en) * | 1981-11-20 | 1983-05-25 | Toshiba Corp | Semiconductor treating device |
-
1987
- 1987-04-10 JP JP1987055147U patent/JPH051075Y2/ja not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5887832A (en) * | 1981-11-20 | 1983-05-25 | Toshiba Corp | Semiconductor treating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63162528U (en) | 1988-10-24 |
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