JP2613039B2 - Wafer transfer processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention holds a wafer with a wafer transfer holder,
The present invention relates to a wafer transfer processing apparatus for sequentially transferring the wafer to a plurality of wafer processing tanks and performing a wet process on the wafer.

[Related Art] In manufacturing semiconductor devices, wafer wet processing such as cleaning and etching is an indispensable step. The wet processing is performed by holding a wafer by a wafer transfer holder and sequentially transferring the wafer to a plurality of wafer processing tanks.

FIG. 4 is a schematic diagram of a conventional wafer transfer processing apparatus.

A plurality of chemical solution tanks 2a, 2b, 2c, 2d are provided in the transfer path of the wafer 1. A wafer support holder 3 is installed in each of the chemical solution tanks 2a to 2d. The shape of the wafer support holder 3 will be described later in detail.
Is formed with a deep groove guide so as to be held upright at a fixed position. In the chemical solution tanks 2a to 2d, the wafer 1
Chemicals such as pure water, sulfuric acid, and nitric acid necessary for wet processing
Contains 4d.

The wafer 1 is sandwiched between a wafer transfer holder 7 and an integral structure with a chuck 6. The chuck 6 is connected to a chuck support arm 8. The chuck support arm 8 supports the chuck 6 and is a mechanism for opening and closing the chuck 6. The chuck support arm 8 is connected to the moving arm 9. The moving arm 9 expands and contracts, and by this expansion and contraction movement, the wafer 1 is immersed in the chemical solution tanks 2a to 2d or taken out from the chemical solution tanks 2a to 2d. The moving arm 9 moves on the road 10. By this movement operation, the wafer 1
Is transported between the chemical tanks 2a to 2d.

Next, the shape of each component constituting the wafer transfer processing apparatus will be described.

FIG. 5 is a perspective view of a wafer holding unit of the wafer transfer processing apparatus.

The wafer 1 is supported by the wafer support holder 3 in a state where the wafer 1 is set in a fixed position. Although the shape of the wafer support holder 3 will be described in more detail later, the wafer 1 is supported by the portions 3a, 3b, and 3c of the wafer support holder 3,
A deep groove guide is formed in a portion supporting the wafer 1. By fitting the wafer 1 into the guide in the deep groove, the wafer 1 is held in a state where it is set in a fixed position. The shape of the wafer transfer holder 7 will be described in further detail later.
7a is formed. By fitting the wafer 1 into the guide 7a in the deep groove, the wafer 1 can be firmly sandwiched. The wafer transfer holder 7 has an integral structure with the chuck 6. The chuck 6 is connected to a chuck support arm 8. The chuck support arm 8 includes the chuck 6
And a mechanism for opening and closing it. The opening and closing of the chuck 6 causes the wafer transfer holder 7 to sandwich or separate the wafer 1. The chuck support arm 8 is connected to the moving arm 9. Moving arm 9
Is a telescopic movement and a lateral movement.

Next, the shapes of the wafer support holder 3 and the wafer transfer holder 7 will be further described with reference to the drawings.

FIG. 6A is a front view of the wafer support holder and the wafer transfer holder. The wafer 1 is shown sandwiched between the wafer support holders 7 and transferred to the wafer support holder 3.

FIG. 6B is a plan view (A), front view (B), and right side view (C) of the wafer transfer holder. Wafer transfer holder 7
A deep groove guide 7a is formed in a portion for holding the wafer 1.

FIG. 6C is a plan view (A), front view (B), and right side view (C) of the wafer support holder. Deep groove guides are formed in the portions 3a, 3b, 3c for holding the wafer 1, respectively.

Next, the operation of the conventional wafer transfer processing apparatus will be described with reference to FIG.

Wafer support holder 3 installed in chemical solution tank 2a
Holds the wafer 1. This wafer 1 is placed in a chemical tank 2b.
The case where the paper is conveyed to the printer will be described as an example.

The chuck 6 is opened by the chuck support arm 8. Then, the wafer transfer holder 7 is opened because it is formed integrally with the chuck 6. In this state, the moving arm 9 is extended, and the wafer transfer holder 7 is moved to a position where the wafer 1 held by the wafer support holder 3 can be gripped.
Move down. The chuck 6 is closed by the chuck support arm 8 and the wafer transfer holder 7 is closed. By closing the wafer transfer holder 7, the wafer 1 fits into the deep groove guide 7 a of the wafer transfer holder 7 and is gripped by the wafer transfer holder 7. After the wafer 1 is gripped by the wafer transfer holder 7, the moving arm 9 moves up to the position of the ascending limit and stops.

Next, the moving arm 9 moves sideways in the direction of the arrow 11, and stops above the next chemical solution tank 2b. Then, the moving arm 9 moves downward, and places the wafer 1 on the wafer supporting holder 3 provided in the chemical solution tank 2b. Thereafter, the chuck 6 and the wafer transfer holder 7 are opened by the chuck support arm 8. As a result, the wafer 1 is separated from the wafer transfer holder 7.

Next, the moving arm 9 moves up and stops. By this operation, only the wafer 1 is immersed in the chemical solution 4b in the chemical solution tank 2b, and the wafer 1 is wet-processed by the chemical solution 4b. After the wet processing of the wafer 1 is completed, the same operation is repeated again. Thereby, the wafer 1 is wet-processed in various chemicals.

[Problems to be Solved by the Invention] Since the conventional wafer transfer processing apparatus is configured as described above, when transferring the wafer 1, the wafer transfer holder 7 is always immersed in the chemical solution in the chemical solution tank. You. Therefore,
The chemical solution may be contaminated by dust and impurities in the wafer transfer holder 7, which is a problem. Further, when a wafer is transferred from one chemical solution tank to another chemical solution tank, there is another problem that the chemical composition in the chemical solution tank is changed as a result of the transport holder 7 bringing in the chemical solution.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a wafer transfer processing apparatus which is free from chemical contamination and does not change the chemical composition.

[Means for Solving the Problems] The present invention holds and transports a plurality of wafers between an upper portion of a processing tank and another position, and transfers a plurality of wafers between the upper portion of the processing tank and a wafer lift. A wafer transfer holder that can be transferred, a plurality of wafers are held and transferred between the upper part of the processing tank and the inside of the processing tank, and a plurality of wafers are transferred between the upper part of the processing tank and the wafer transfer holder. The present invention relates to a wafer transfer processing apparatus having a wafer lift capable of transferring and transferring a plurality of wafers to and from a processing tank inside the processing tank. A plurality of guide grooves extending at a predetermined pitch and in a direction in which the wafer is conveyed are provided on two opposing surfaces in the processing tank in contact with the outer peripheral portion of the wafer to prevent the wafer from falling down. And

[Operation] A plurality of wafers are held and transferred between the upper part of the processing tank and the inside of the processing tank, and the plurality of wafers are transferred between the upper part of the processing tank and the wafer transfer holder, and the processing is performed inside the processing tank. Since a wafer lift capable of transferring a plurality of wafers to and from the tank is provided, the wafer conveyed using the wafer lift is guided into the wafer processing tank, and the wafer after the wet processing is performed using the wafer lift. Can be lifted to return the wafer to the transfer path, so that the wafer transfer holder is not immersed in the chemical solution in the wafer processing tank. Also, a plurality of guide grooves extending at a predetermined pitch and extending in the direction in which the wafer is conveyed are provided on two opposing surfaces in the processing tank where the outer peripheral portion of the wafer is in contact with the wafer so as to prevent the wafer from falling down. ,
The wafer does not fall in the processing bath.

Embodiment An embodiment of the present invention will be described below with reference to the drawings, but the present invention is not limited thereto.

FIG. 1 is a perspective view of a wafer holding section of an embodiment of a wafer transfer processing apparatus according to the present invention, and corresponds to FIG. 5 showing a prior art.

A wafer lift 12 is provided in the wafer processing tank 2. Although not shown in the figure, the wafer transfer processing apparatus according to the present invention is provided with a plurality of wafer processing tanks 2, each of which is provided with a wafer lift 12.

The wafer 1 is placed on the wafer lift 12. The wafer transfer holder 7 does not enter the wafer processing tank 2 but stops at a position above the wafer processing tank 2. Although details will be described later, guide grooves having the same pitch and the same shape are formed in portions of the wafer processing tank 2 and the wafer transfer holder 7 which hold the wafer 1. A rotary chuck arm 13 that is integrally formed with the wafer transfer holder 7 and can rotate the wafer transfer holder 7 is attached to the wafer transfer holder 7. The rotary chuck arm 13 is moved up, down, left and right by the moving arm 9.

Next, this section will be described in more detail with reference to a cross-sectional view of the wafer holding section of the wafer transfer processing apparatus.

FIG. 2 is a side sectional view of a wafer holding section of one embodiment of the wafer transfer processing apparatus according to the present invention. A wafer lift 12 is provided in the wafer processing tank 2. The portion of the wafer lift 12 on which the wafer is placed has a deep groove 12a for facilitating the placement of the wafer 1. Guide grooves having the same pitch and the same shape are formed in portions of the wafer processing tank 2 and the wafer transfer holder 7 which hold the wafer 1. The reason why the guide grooves having the same pitch and the same shape are formed on both sides is to facilitate the transfer of the wafer 1 between the wafer transfer holder 7 and the wafer processing tank 2 without falling down. Needless to say, it is the wafer lift 12 that mediates the transfer. The wafer transfer holder 7 does not enter the wafer processing tank 2 but stops at a position located above the wafer processing tank 2. The wafer transfer holder 7 is provided with a rotary chuck arm 13 which is integrally formed with the wafer transfer holder 7 and can rotate the wafer transfer holder 7. The rotary chuck arm 13 is connected to the moving arm 9. The moving arm 9 moves up and down and moves right and left along a load 10 extending in the wafer transfer direction.

The vertical movement of the wafer lift 12, the vertical expansion and contraction movement and the horizontal movement of the moving arm 9, and the rotational movement of the rotary chuck arm 13 are controlled by a control box 14 having a control mechanism.

Next, this portion will be further described with reference to a front sectional view of a wafer holding portion of the wafer transfer processing apparatus.

3A and 3B are front sectional views of the wafer hold unit.

FIG. 3A is a view showing a state in which the wafer 1 has been transferred to the wafer processing tank 2 by the wafer transfer holder 7.
The wafer 1 is held in a state where the wafer transfer holder 7 is rotated by 10 to 80 degrees. Hereinafter, this state is referred to as “the wafer transfer holder 7 is closed”. The rotation operation of the wafer transfer holder 7 is performed by a rotary chuck arm 13.

The wafer transfer holder 7 is formed with a deep groove guide groove 7a. The wafer processing tank 2 is also formed with guide grooves 21 having the same pitch and the same shape as the wafer transfer holder 7.
A wafer lift 12 is provided in the wafer processing tank 2. When the wafer lift 12 rises, the wafer 1 fits into the guide groove 12a of the wafer lift 12. As a result, the wafer 1 moves from the wafer transfer holder 7 to the wafer lift 12.

FIG. 3B is a diagram showing a state after the wafer has been transferred from the wafer transfer holder to the wafer processing tank via a wafer lift. 3B, the rotation angle of the wafer transfer holder 7 is 0 °, that is, the deep groove guide groove 5a formed in the wafer transfer holder 7 and the deep groove guide groove 21 formed in the inner surface of the wafer processing tank 2. Are in parallel,
This is referred to as a “wafer transfer holder 7 opened” state.

Next, the operation of the wafer transfer processing apparatus according to the embodiment will be described with reference to FIGS. 3A and 3B.

First, an operation of introducing the wafer 1 into the wafer processing tank 2 and performing wet processing on the wafer 1 will be described.

The wafer transfer holder 7 is “closed” to hold the wafer 1. Then, the “closed” wafer transfer holder 7 holding the wafer 1 is moved by the moving arm 9 onto the wafer processing tank 2. Next, the wafer transfer holder 7
Is lowered until it comes into contact with the wafer processing tank 2.
Next, the wafer lift 12 is raised to bring the guide groove 12a of the wafer lift 12 into contact with the wafer 1 (see FIG. 3A).

Then, the wafer transfer holder 7 is slowly "opened". At this time, the wafer 1 is supported by the wafer lift 12 from below. When the wafer lift 12 is lowered, the guide 21 engraved on the inner surface of the wafer processing tank 12 and the guide engraved on the inner surface of the wafer transfer holder 7 are located on the same line, so that the wafer 1 can be processed without falling. It is guided into the tank 2 and subjected to a wet treatment (see FIG. 3B).

With the conventional wafer transfer processing apparatus, when transferring the wafer between the wafer transfer holder and the wafer support holder, the wafer may fall down, which is a problem. However, with the transfer method according to the embodiment, Such a problem is solved. That is, the guide groove 21 formed on the inner surface of the wafer processing tank 2 and the guide groove formed on the inner surface of the wafer transfer holder 7 are positioned on the same line, and the wafer 1 is lowered along the guide using the wafer lift 12. Then, the wafer 1 can be guided into the wafer processing tank 2 without falling. That is, the wafer transfer holder 7 and the wafer processing tank 2
By adopting such an inner surface shape, a new effect that the wafer 1 can be guided into the wafer processing tank 2 without causing the wafer 1 to fall down is produced (see FIG. 3B and FIG. 2).
See figure).

After the wet processing of the wafer 1, the wafer lift 12 is raised. At this time, the wafer transfer holder 7 is lowered to a predetermined position in advance and stopped while being "open".

When the wafer lift 12 is raised, the wafer 1 exits the wafer processing tank 2 and is sent to the wafer transfer holder 7. When the wafer lift 12 rises and stops at a fixed position, the wafer transfer holder slowly “closes” and holds the wafer 1. Then, the moving arm 9 rises and stops at a fixed position,
Further, a load 12 formed to extend in the transfer direction of the wafer 1
, And stops above the next wafer processing tank 2. Thereby, the wafer 1 is transferred to another wafer processing tank 2. After that, the same operation is repeated. By repeating the same operation, the wafer 1 is transferred to a plurality of wafer processing tanks,
Wet treatment is performed one after another.

[Effects of the Invention] As described above, according to the present invention, a plurality of wafers are held and transferred between the upper part of the processing tank and the inside of the processing tank,
A wafer lift capable of transferring a plurality of wafers to and from the wafer transfer holder at the top of the processing tank and transferring a plurality of wafers to and from the processing tank inside the processing tank is provided. The wafer transported by using the wafer processing tank can be guided into the wafer processing tank, and the wafer after the wet processing can be lifted using the wafer lift to return the wafer to the transfer path. It is not immersed in the chemical solution inside. As a result, the problem of chemical contamination and the problem of chemical composition change caused by the wafer transfer holder are solved. In addition, a plurality of guide grooves extending at a predetermined pitch and extending in the direction in which the wafer is conveyed are provided on two opposing surfaces in the processing tank where the outer peripheral portion of the wafer contacts, in order to prevent the wafer from falling down. Therefore, the wafer does not fall in the processing tank. As a result, there is an effect that the processing of the wafer is efficiently performed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a wafer holding part of one embodiment of the wafer transfer processing apparatus according to the present invention, and FIG. 2 is a side cross section of the wafer hold part of one embodiment of the wafer transfer processing apparatus according to the present invention. FIGS. 3A and 3B are front cross-sectional views of a wafer holding unit of an embodiment of the wafer transfer processing apparatus according to the present invention. FIG. 4 is a schematic diagram of a conventional wafer transfer processing apparatus. FIGS. 6A to 6C are perspective views of a wafer holding unit of the conventional wafer transfer processing apparatus, and FIGS. 6A to 6C are views for explaining the shapes of the conventional wafer support holder and the conventional wafer transfer holder in more detail. In the figure, 1 is a wafer, 2 is a wafer processing tank, 7 is a wafer transfer holder, and 12 is a wafer lift. In the drawings, the same reference numerals indicate the same or corresponding parts.

Claims (3)

(57) [Claims] 1. A wafer transfer holder capable of holding and transferring a plurality of wafers between an upper portion of a processing tank and another position, and transferring a plurality of wafers between the upper portion of the processing tank and a wafer lift. Holding and transferring a plurality of wafers between the upper part of the processing tank and the inside of the processing tank, and transferring the plurality of wafers between the upper part of the processing tank and a wafer transfer holder, A wafer lift capable of transferring a plurality of wafers between the wafer and a wafer lift, wherein the wafer is transferred at a predetermined pitch to two opposing surfaces in a processing tank in contact with an outer peripheral portion of the wafer. A plurality of guide grooves extending in the direction in which the wafers fall, in order to prevent the wafer from falling down. 2. A plurality of grooves having the same pitch and the same direction as a plurality of guide grooves provided in a processing tank are provided on an inner surface of a wafer holding portion of a wafer transfer holder in contact with an outer peripheral portion of the wafer. 2. The wafer transfer processing apparatus according to claim 1, wherein the apparatus is characterized in that: 3. The wafer holding part of the wafer transfer holder,
Each pair of chuck arms rotates about a horizontal axis, and a plurality of wafers are transferred to and from a wafer lift when the pair of chuck arms open and close. 2. The wafer transfer processing apparatus according to claim 1, wherein: