JPH03116731A - Semiconductor wafer transfer equipment - Google Patents

Semiconductor wafer transfer equipment

Info

Publication number
JPH03116731A
JPH03116731A JP25311289A JP25311289A JPH03116731A JP H03116731 A JPH03116731 A JP H03116731A JP 25311289 A JP25311289 A JP 25311289A JP 25311289 A JP25311289 A JP 25311289A JP H03116731 A JPH03116731 A JP H03116731A
Authority
JP
Japan
Prior art keywords
wafer
support rods
15c
15b
processing bath
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25311289A
Inventor
Hayaaki Fukumoto
Nobumi Hattori
Toshiaki Omori
Hirobumi Sasaki
Michita Sasaki
Motonori Yanagi
Original Assignee
Dan Kagaku:Kk
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dan Kagaku:Kk, Mitsubishi Electric Corp filed Critical Dan Kagaku:Kk
Priority to JP25311289A priority Critical patent/JPH03116731A/en
Publication of JPH03116731A publication Critical patent/JPH03116731A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE: To enable the inside of a wafer processing bath to be set wide by providing the wafer lift with at least three horizontal supports which bears semiconductor wafers.
CONSTITUTION: The transfer holder 3 is closed to hold a wafer 1, and the moving arm 12 is operated to move the holder 3 onto a wafer processing bath 11. Next, a wafer lift 15 is operated to raise wafer support rods 15 so that the lower side outer periphery of a wafer 1 is inserted into a deep groove 15e. At this time, the deep grooves 15e of the respective wafer support rods 15a, 15b, and 15c are formed at the same pitch as well as the guide grooves 3a of the wafer transfer holder 3; therefore, the lower side outer periphery of a wafer 1 is surely inserted into a deep groove 15e. In this state, the wafer transfer holder 3 is opened to allow the wafer support rods 15a, 15b, and 15c to bear the wafer 1. This action is followed by the descent of support rods 15a, 15b, 15c so that the wafer 1 is guided into the wafer processing bath 11 for wet processing.
COPYRIGHT: (C)1991,JPO&Japio
JP25311289A 1989-09-28 1989-09-28 Semiconductor wafer transfer equipment Pending JPH03116731A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25311289A JPH03116731A (en) 1989-09-28 1989-09-28 Semiconductor wafer transfer equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25311289A JPH03116731A (en) 1989-09-28 1989-09-28 Semiconductor wafer transfer equipment

Publications (1)

Publication Number Publication Date
JPH03116731A true JPH03116731A (en) 1991-05-17

Family

ID=17246667

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25311289A Pending JPH03116731A (en) 1989-09-28 1989-09-28 Semiconductor wafer transfer equipment

Country Status (1)

Country Link
JP (1) JPH03116731A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5269643A (en) * 1991-03-22 1993-12-14 Danippon Screen Manufacturing Co., Ltd. Method and apparatus for transferring wafers from wafer carrier to wafer conveyor apparatus in carrierless wafer surface treatment apparatus
US5379785A (en) * 1991-10-09 1995-01-10 Mitsubishi Denki Kabushiki Kaisha Cleaning apparatus
JPH07307323A (en) * 1994-05-10 1995-11-21 Nec Yamaguchi Ltd Carrier for wet treatment
US5503173A (en) * 1993-12-14 1996-04-02 Shin-Etsu Handotai Co., Ltd. Wafer cleaning tank
US5730162A (en) * 1995-01-12 1998-03-24 Tokyo Electron Limited Apparatus and method for washing substrates
US5791357A (en) * 1996-06-06 1998-08-11 Shin-Etsu Handotai Co., Ltd. Support jig for thin circular objects
US5820878A (en) * 1994-11-18 1998-10-13 Hisamitsu Pharmaceutical Co., Inc. Percutaneously absorbable patch
US5839460A (en) * 1997-11-13 1998-11-24 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
US5992431A (en) * 1996-04-24 1999-11-30 Steag Microtech Gmbh Device for treating substrates in a fluid container
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6269822B1 (en) * 1996-04-17 2001-08-07 Steag Microtech Gmbh Installation for wet-treating substrates
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
WO2002091435A3 (en) * 2001-05-10 2003-03-27 Mattson Wet Products Gmbh Device for wet cleaning disc-shaped substrates

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5269643A (en) * 1991-03-22 1993-12-14 Danippon Screen Manufacturing Co., Ltd. Method and apparatus for transferring wafers from wafer carrier to wafer conveyor apparatus in carrierless wafer surface treatment apparatus
US5379785A (en) * 1991-10-09 1995-01-10 Mitsubishi Denki Kabushiki Kaisha Cleaning apparatus
US5503173A (en) * 1993-12-14 1996-04-02 Shin-Etsu Handotai Co., Ltd. Wafer cleaning tank
JPH07307323A (en) * 1994-05-10 1995-11-21 Nec Yamaguchi Ltd Carrier for wet treatment
US5820878A (en) * 1994-11-18 1998-10-13 Hisamitsu Pharmaceutical Co., Inc. Percutaneously absorbable patch
US5817185A (en) * 1995-01-12 1998-10-06 Tokyo Electron Limited Method for washing substrates
US5730162A (en) * 1995-01-12 1998-03-24 Tokyo Electron Limited Apparatus and method for washing substrates
US6269822B1 (en) * 1996-04-17 2001-08-07 Steag Microtech Gmbh Installation for wet-treating substrates
US5992431A (en) * 1996-04-24 1999-11-30 Steag Microtech Gmbh Device for treating substrates in a fluid container
US5791357A (en) * 1996-06-06 1998-08-11 Shin-Etsu Handotai Co., Ltd. Support jig for thin circular objects
US6059891A (en) * 1997-07-23 2000-05-09 Tokyo Electron Limited Apparatus and method for washing substrate
US6431184B1 (en) 1997-08-05 2002-08-13 Tokyo Electron Limited Apparatus and method for washing substrate
US6115867A (en) * 1997-08-18 2000-09-12 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US6276378B1 (en) 1997-08-18 2001-08-21 Tokyo Electron Limited Apparatus for cleaning both sides of substrate
US5839460A (en) * 1997-11-13 1998-11-24 Memc Electronic Materials, Inc. Apparatus for cleaning semiconductor wafers
WO2002091435A3 (en) * 2001-05-10 2003-03-27 Mattson Wet Products Gmbh Device for wet cleaning disc-shaped substrates

Similar Documents

Publication Publication Date Title
GB2075921B (en) Processing semiconductor wafers
EP0782889A3 (en) Method and apparatus for washing or for washing-drying substrates
EP0157675A3 (en) Spinning device for processing a substrate, in particular a semiconductor wafer
EP0231115A3 (en) Method for manufacturing semiconductor devices
EP0072216A3 (en) The production of semiconductor devices by methods involving annealing
JPS62222625A (en) Semiconductor manufacturing equipment
JPH03125453A (en) Semiconductor wafer transfer device
JPS5727631A (en) Ball slide way
JPS636857A (en) Wafer transfer device
EP0344764A3 (en) Process for the wet-chemical surface treatment of semiconductor chips
GB2215129B (en) Method of fabricating semiconductor devices such as solar cells with anti-reflecting coating
JPH01304733A (en) Semiconductor wafer washer
GB2192754B (en) Optoelectronic bistable semiconductor apparatus
JPS61244040A (en) Wafer transferring tool
TW414934B (en) Transfer apparatus and vertical heat-processing system using the same
JPS5434751A (en) Washing method for silicon wafer
JPS6185664A (en) Loading device for disk reproducer
JPH04240721A (en) Multi chamber process device
JPS56117905A (en) Conveyor
JPH02290013A (en) Temperature processing method
TW432579B (en) Stackable cassette for use with wafer cassettes
JPS63208223A (en) Wafer treating apparatus
JPS57145326A (en) Method and device for forming pattern on wafer by photosensing semiconductor wafer
JPS5240059A (en) Process for production of semiconductor device
JPS62139341A (en) Treating device for substrate and wafer surface