TWI367539B - Methods and apparatus for purging a substrate carrier - Google Patents

Methods and apparatus for purging a substrate carrier

Info

Publication number
TWI367539B
TWI367539B TW096101142A TW96101142A TWI367539B TW I367539 B TWI367539 B TW I367539B TW 096101142 A TW096101142 A TW 096101142A TW 96101142 A TW96101142 A TW 96101142A TW I367539 B TWI367539 B TW I367539B
Authority
TW
Taiwan
Prior art keywords
purging
methods
substrate carrier
carrier
substrate
Prior art date
Application number
TW096101142A
Other languages
English (en)
Chinese (zh)
Other versions
TW200737391A (en
Inventor
Vinay K Shah
Eric Englhardt
Jeffrey C Hudgens
Martin Elliott
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200737391A publication Critical patent/TW200737391A/zh
Application granted granted Critical
Publication of TWI367539B publication Critical patent/TWI367539B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0396—Involving pressure control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
TW096101142A 2006-01-11 2007-01-11 Methods and apparatus for purging a substrate carrier TWI367539B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75815206P 2006-01-11 2006-01-11

Publications (2)

Publication Number Publication Date
TW200737391A TW200737391A (en) 2007-10-01
TWI367539B true TWI367539B (en) 2012-07-01

Family

ID=38257028

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096101142A TWI367539B (en) 2006-01-11 2007-01-11 Methods and apparatus for purging a substrate carrier

Country Status (6)

Country Link
US (3) US8074597B2 (enExample)
JP (1) JP5105334B2 (enExample)
KR (1) KR20080087880A (enExample)
CN (1) CN101370616B (enExample)
TW (1) TWI367539B (enExample)
WO (1) WO2007082031A2 (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101370616B (zh) 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
US8870512B2 (en) 2007-10-27 2014-10-28 Applied Materials, Inc. Sealed substrate carriers and systems and methods for transporting substrates
US20110084194A1 (en) * 2009-09-24 2011-04-14 Dgel Sciences Cassette for biological analysis and method of making thereof
TWI575631B (zh) 2011-06-28 2017-03-21 Dynamic Micro Systems 半導體儲存櫃系統與方法
CN103426792A (zh) * 2012-05-24 2013-12-04 上海宏力半导体制造有限公司 一种密封的n2清洗装置
US9412632B2 (en) * 2012-10-25 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle pod
CN109671643B (zh) 2013-08-12 2023-11-28 应用材料公司 具有工厂接口环境控制的基板处理系统、装置和方法
KR102162366B1 (ko) 2014-01-21 2020-10-06 우범제 퓸 제거 장치
KR102226451B1 (ko) * 2014-09-22 2021-03-12 에스케이하이닉스 주식회사 기판 캐리어 세정장치 및 기판 캐리어의 세정 방법
US10359743B2 (en) 2014-11-25 2019-07-23 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls
JP2018515936A (ja) 2015-05-22 2018-06-14 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 磁気ドア密封を含む、基板キャリアドアアセンブリ、基板キャリア、及び方法
US10573545B2 (en) 2016-06-28 2020-02-25 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack
FR3058562B1 (fr) * 2016-11-07 2019-05-10 Pfeiffer Vacuum Dispositif et procede de controle de l'etancheite d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs
US10741432B2 (en) 2017-02-06 2020-08-11 Applied Materials, Inc. Systems, apparatus, and methods for a load port door opener
US10446428B2 (en) 2017-03-14 2019-10-15 Applied Materials, Inc. Load port operation in electronic device manufacturing apparatus, systems, and methods
DE202019101794U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
US11061417B2 (en) 2018-12-19 2021-07-13 Applied Materials, Inc. Selectable-rate bottom purge apparatus and methods
US11569102B2 (en) 2020-02-14 2023-01-31 Applied Materials, Inc. Oxidation inhibiting gas in a manufacturing system
US12087605B2 (en) * 2020-09-30 2024-09-10 Gudeng Precision Industrial Co., Ltd. Reticle pod with antistatic capability
TWD223988S (zh) * 2022-03-03 2023-03-01 家登精密工業股份有限公司 氣匣

Family Cites Families (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3650057T2 (de) 1985-10-24 1995-02-16 Texas Instruments Inc System für Vakuumbehandlung.
US4995430A (en) 1989-05-19 1991-02-26 Asyst Technologies, Inc. Sealable transportable container having improved latch mechanism
US5169272A (en) 1990-11-01 1992-12-08 Asyst Technologies, Inc. Method and apparatus for transferring articles between two controlled environments
US5538390A (en) 1993-10-29 1996-07-23 Applied Materials, Inc. Enclosure for load lock interface
EP0663686B1 (en) 1994-01-14 1997-06-18 International Business Machines Corporation Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable container
US5482161A (en) 1994-05-24 1996-01-09 Fluoroware, Inc. Mechanical interface wafer container
JPH0846005A (ja) 1994-07-26 1996-02-16 Takenaka Komuten Co Ltd ウエーハ移載装置
JP3617681B2 (ja) * 1995-01-24 2005-02-09 アシスト シンコー株式会社 可搬式密閉コンテナのガス供給システム
JPH08330208A (ja) * 1995-05-30 1996-12-13 Oki Electric Ind Co Ltd 加熱装置
US5740845A (en) 1995-07-07 1998-04-21 Asyst Technologies Sealable, transportable container having a breather assembly
US5810062A (en) * 1996-07-12 1998-09-22 Asyst Technologies, Inc. Two stage valve for charging and/or vacuum relief of pods
US5879458A (en) 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
US5944857A (en) 1997-05-08 1999-08-31 Tokyo Electron Limited Multiple single-wafer loadlock wafer processing apparatus and loading and unloading method therefor
JP3167970B2 (ja) 1997-10-13 2001-05-21 ティーディーケイ株式会社 クリーンボックス、クリーン搬送方法及び装置
US6013920A (en) 1997-11-28 2000-01-11 Fortrend Engineering Coirporation Wafer-mapping load post interface having an effector position sensing device
JPH11168135A (ja) 1997-12-03 1999-06-22 Toshiba Corp 基板保管装置および基板保管方法
JPH11214479A (ja) * 1998-01-23 1999-08-06 Tokyo Electron Ltd 基板処理装置及びその方法並びに基板搬送装置
US5988233A (en) * 1998-03-27 1999-11-23 Asyst Technologies, Inc. Evacuation-driven SMIF pod purge system
US6398032B2 (en) 1998-05-05 2002-06-04 Asyst Technologies, Inc. SMIF pod including independently supported wafer cassette
NL1009171C2 (nl) 1998-05-14 1999-12-10 Asm Int Waferrek voorzien van een gasverdeelinrichting.
US6719516B2 (en) 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
JP2000124300A (ja) 1998-10-14 2000-04-28 Nec Kansai Ltd ウェーハキャリア
US6120229A (en) 1999-02-01 2000-09-19 Brooks Automation Inc. Substrate carrier as batchloader
US6042324A (en) 1999-03-26 2000-03-28 Asm America, Inc. Multi-stage single-drive FOUP door system
JP3769417B2 (ja) * 1999-06-30 2006-04-26 株式会社東芝 基板収納容器
AU6070500A (en) 1999-07-02 2001-01-22 Brian R. Cleaver Wafer container
US6428262B1 (en) 1999-08-11 2002-08-06 Proteros, Llc Compact load lock system for ion beam processing of foups
AU2001273666A1 (en) 2000-07-07 2002-01-21 Applied Materials, Inc. Automatic door opener
JP2002184831A (ja) * 2000-12-11 2002-06-28 Hirata Corp Ｆｏｕｐオープナ
JP2003092345A (ja) 2001-07-13 2003-03-28 Semiconductor Leading Edge Technologies Inc 基板収納容器、基板搬送システム、保管装置及びガス置換方法
TW545693U (en) 2002-05-15 2003-08-01 Macronix Int Co Ltd Air inlet structure of vacuum isolating chamber
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
KR100607302B1 (ko) * 2002-10-25 2006-07-31 신에츠 폴리머 가부시키가이샤 기판 수납 용기
US20050105997A1 (en) 2003-09-11 2005-05-19 Englhardt Eric A. Methods and apparatus for carriers suitable for use in high-speed/high-acceleration transport systems
US7051870B2 (en) 2003-11-26 2006-05-30 Applied Materials, Inc. Suspension track belt
JP2005327815A (ja) * 2004-05-12 2005-11-24 Miraial Kk 収納容器のガス置換装置およびそれを用いたガス置換方法
EP1803146A2 (en) 2004-09-04 2007-07-04 Applied Materials, Inc. Substrate carrier having reduced height
US20070141280A1 (en) 2005-12-16 2007-06-21 Applied Materials, Inc. Substrate carrier having an interior lining
CN101370616B (zh) 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
US8870512B2 (en) 2007-10-27 2014-10-28 Applied Materials, Inc. Sealed substrate carriers and systems and methods for transporting substrates

Also Published As

Publication number Publication date
WO2007082031A2 (en) 2007-07-19
US20120060971A1 (en) 2012-03-15
KR20080087880A (ko) 2008-10-01
CN101370616B (zh) 2011-04-27
US8601975B2 (en) 2013-12-10
JP2009523325A (ja) 2009-06-18
CN101370616A (zh) 2009-02-18
US8689812B2 (en) 2014-04-08
TW200737391A (en) 2007-10-01
JP5105334B2 (ja) 2012-12-26
WO2007082031A3 (en) 2007-11-15
US20120325328A1 (en) 2012-12-27
US20070158183A1 (en) 2007-07-12
US8074597B2 (en) 2011-12-13

Similar Documents

Publication Publication Date Title
TWI367539B (en) Methods and apparatus for purging a substrate carrier
TWI368267B (en) Method and apparatus for cleaning a substrate surface
GB2453892B (en) Method and apparatus for clamping a substrate
GB2462734B (en) Substrate inspection apparatus
GB0816928D0 (en) A Method and Apparatus for Creating Contextualized Feeds
IL209796A0 (en) Apparatus and method for inspecting a substrate
EP1996299A4 (en) METHOD AND APPARATUS FOR PROJECTING AN OBJECT
EP1907173A4 (en) DEVICE FOR TRANSPORTING SUBSTRATES
EP2389478A4 (en) APPARATUS AND METHOD FOR REALIZING MARKERS ON A SUBSTRATE
TWI340114B (en) Positioning apparatus for carrier tape
PL1990204T3 (pl) Sposób i urządzenie do powlekania powierzchni
TWI368071B (en) Apparatus and method for attaching substrates
TWI365112B (en) Apparatus for treating a substrate
TWI350133B (en) Apparatus for attaching substrates
TWI368067B (en) Apparatus for attaching substrates
ZA200709026B (en) Apparatus and method for coating a substrate
IL183692A0 (en) Apparatus and method for substrates handling
TWI350561B (en) Apparatus and system for cleaning a substrate
TWI371821B (en) Apparatus and method for bonding substrates
IL212774A (en) A device and method for depositing droplets onto a substrate
GB0610832D0 (en) Holder for electronic apparatus
TWI369727B (en) Substrate processing apparatus
GB2452174B (en) A method and composition for selectively stripping nickel from a substrate
EP2101618A4 (en) APPARATUS FOR RETAINING SUBSTANTIALLY CYLINDRICALLY SHAPED ELEMENTS
ZA200810410B (en) Method and apparatus for positioning a reservoir-mounted component

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees