JP5105334B2 - 基板キャリヤをパージするための方法及び装置 - Google Patents

基板キャリヤをパージするための方法及び装置 Download PDF

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Publication number
JP5105334B2
JP5105334B2 JP2008550404A JP2008550404A JP5105334B2 JP 5105334 B2 JP5105334 B2 JP 5105334B2 JP 2008550404 A JP2008550404 A JP 2008550404A JP 2008550404 A JP2008550404 A JP 2008550404A JP 5105334 B2 JP5105334 B2 JP 5105334B2
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Prior art keywords
substrate carrier
port
gas
seal
door
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Expired - Fee Related
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JP2008550404A
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English (en)
Japanese (ja)
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JP2009523325A5 (enExample
JP2009523325A (ja
Inventor
ヴィネイ ケー． サー，
エリック イングラート，
ジェフリー シー． ハジェンス，
マーティン エリオット，
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Applied Materials Inc
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Applied Materials Inc
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Publication of JP2009523325A5 publication Critical patent/JP2009523325A5/ja
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Publication of JP5105334B2 publication Critical patent/JP5105334B2/ja
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67353—Closed carriers specially adapted for a single substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y10T137/0396—Involving pressure control

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
JP2008550404A 2006-01-11 2007-01-11 基板キャリヤをパージするための方法及び装置 Expired - Fee Related JP5105334B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US75815206P 2006-01-11 2006-01-11
US60/758,152 2006-01-11
PCT/US2007/000722 WO2007082031A2 (en) 2006-01-11 2007-01-11 Methods and apparatus for purging a substrate carrier

Publications (3)

Publication Number Publication Date
JP2009523325A JP2009523325A (ja) 2009-06-18
JP2009523325A5 JP2009523325A5 (enExample) 2010-02-25
JP5105334B2 true JP5105334B2 (ja) 2012-12-26

Family

ID=38257028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008550404A Expired - Fee Related JP5105334B2 (ja) 2006-01-11 2007-01-11 基板キャリヤをパージするための方法及び装置

Country Status (6)

Country Link
US (3) US8074597B2 (enExample)
JP (1) JP5105334B2 (enExample)
KR (1) KR20080087880A (enExample)
CN (1) CN101370616B (enExample)
TW (1) TWI367539B (enExample)
WO (1) WO2007082031A2 (enExample)

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CN101370616B (zh) 2006-01-11 2011-04-27 应用材料股份有限公司 一种基材载件、一种装载端口以及一种清洗基材载件的方法
US8870512B2 (en) 2007-10-27 2014-10-28 Applied Materials, Inc. Sealed substrate carriers and systems and methods for transporting substrates
US20110084194A1 (en) * 2009-09-24 2011-04-14 Dgel Sciences Cassette for biological analysis and method of making thereof
TWI575631B (zh) 2011-06-28 2017-03-21 Dynamic Micro Systems 半導體儲存櫃系統與方法
CN103426792A (zh) * 2012-05-24 2013-12-04 上海宏力半导体制造有限公司 一种密封的n2清洗装置
US9412632B2 (en) * 2012-10-25 2016-08-09 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle pod
CN109671643B (zh) 2013-08-12 2023-11-28 应用材料公司 具有工厂接口环境控制的基板处理系统、装置和方法
KR102162366B1 (ko) 2014-01-21 2020-10-06 우범제 퓸 제거 장치
KR102226451B1 (ko) * 2014-09-22 2021-03-12 에스케이하이닉스 주식회사 기판 캐리어 세정장치 및 기판 캐리어의 세정 방법
US10359743B2 (en) 2014-11-25 2019-07-23 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls
JP2018515936A (ja) 2015-05-22 2018-06-14 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 磁気ドア密封を含む、基板キャリアドアアセンブリ、基板キャリア、及び方法
US10573545B2 (en) 2016-06-28 2020-02-25 Murata Machinery, Ltd. Substrate carrier and substrate carrier stack
FR3058562B1 (fr) * 2016-11-07 2019-05-10 Pfeiffer Vacuum Dispositif et procede de controle de l'etancheite d'une enceinte de transport pour le convoyage et le stockage atmospherique de substrats semi-conducteurs
US10741432B2 (en) 2017-02-06 2020-08-11 Applied Materials, Inc. Systems, apparatus, and methods for a load port door opener
US10446428B2 (en) 2017-03-14 2019-10-15 Applied Materials, Inc. Load port operation in electronic device manufacturing apparatus, systems, and methods
DE202019101794U1 (de) * 2018-06-27 2019-10-09 Murata Machinery, Ltd. Vorrichtungen zum mindestens einen aus Substrat-Handhabung, Substrat-Lagerung, Substrat-Behandlung und Substrat-Verarbeitung
US11061417B2 (en) 2018-12-19 2021-07-13 Applied Materials, Inc. Selectable-rate bottom purge apparatus and methods
US11569102B2 (en) 2020-02-14 2023-01-31 Applied Materials, Inc. Oxidation inhibiting gas in a manufacturing system
US12087605B2 (en) * 2020-09-30 2024-09-10 Gudeng Precision Industrial Co., Ltd. Reticle pod with antistatic capability
TWD223988S (zh) * 2022-03-03 2023-03-01 家登精密工業股份有限公司 氣匣

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Also Published As

Publication number Publication date
WO2007082031A2 (en) 2007-07-19
US20120060971A1 (en) 2012-03-15
TWI367539B (en) 2012-07-01
KR20080087880A (ko) 2008-10-01
CN101370616B (zh) 2011-04-27
US8601975B2 (en) 2013-12-10
JP2009523325A (ja) 2009-06-18
CN101370616A (zh) 2009-02-18
US8689812B2 (en) 2014-04-08
TW200737391A (en) 2007-10-01
WO2007082031A3 (en) 2007-11-15
US20120325328A1 (en) 2012-12-27
US20070158183A1 (en) 2007-07-12
US8074597B2 (en) 2011-12-13

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