TWI366074B - Method for forming a coating with a liquid, and method for manufacturing a semiconductor device - Google Patents

Method for forming a coating with a liquid, and method for manufacturing a semiconductor device

Info

Publication number
TWI366074B
TWI366074B TW096124264A TW96124264A TWI366074B TW I366074 B TWI366074 B TW I366074B TW 096124264 A TW096124264 A TW 096124264A TW 96124264 A TW96124264 A TW 96124264A TW I366074 B TWI366074 B TW I366074B
Authority
TW
Taiwan
Prior art keywords
coating
manufacturing
liquid
forming
semiconductor device
Prior art date
Application number
TW096124264A
Other languages
English (en)
Other versions
TW200832071A (en
Inventor
Tomoaki Muramatsu
Yuko Kaimoto
Ichiro Omata
Original Assignee
Fujitsu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Semiconductor Ltd filed Critical Fujitsu Semiconductor Ltd
Publication of TW200832071A publication Critical patent/TW200832071A/zh
Application granted granted Critical
Publication of TWI366074B publication Critical patent/TWI366074B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)
TW096124264A 2007-01-19 2007-07-04 Method for forming a coating with a liquid, and method for manufacturing a semiconductor device TWI366074B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007010293A JP5109373B2 (ja) 2007-01-19 2007-01-19 塗布液の塗布方法及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200832071A TW200832071A (en) 2008-08-01
TWI366074B true TWI366074B (en) 2012-06-11

Family

ID=39345477

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096124264A TWI366074B (en) 2007-01-19 2007-07-04 Method for forming a coating with a liquid, and method for manufacturing a semiconductor device

Country Status (6)

Country Link
US (1) US7754619B2 (zh)
EP (1) EP1947680B1 (zh)
JP (1) JP5109373B2 (zh)
KR (2) KR100941837B1 (zh)
CN (1) CN101226336B (zh)
TW (1) TWI366074B (zh)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5109373B2 (ja) 2007-01-19 2012-12-26 富士通セミコンダクター株式会社 塗布液の塗布方法及び半導体装置の製造方法
JP5133855B2 (ja) * 2008-11-25 2013-01-30 株式会社ディスコ 保護膜の被覆方法
KR101447759B1 (ko) 2008-12-16 2014-10-06 도쿄엘렉트론가부시키가이샤 도포 처리 방법 및 도포 처리 장치
JP4678740B2 (ja) * 2008-12-16 2011-04-27 東京エレクトロン株式会社 塗布処理方法及び塗布処理装置
EP2302845B1 (en) 2009-09-23 2012-06-20 Google, Inc. Method and device for determining a jitter buffer level
JP5485672B2 (ja) * 2009-12-07 2014-05-07 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5337180B2 (ja) * 2010-04-08 2013-11-06 東京エレクトロン株式会社 塗布処理方法、プログラム、コンピュータ記憶媒体及び塗布処理装置
US8630412B2 (en) 2010-08-25 2014-01-14 Motorola Mobility Llc Transport of partially encrypted media
US8477050B1 (en) 2010-09-16 2013-07-02 Google Inc. Apparatus and method for encoding using signal fragments for redundant transmission of data
CN102259083B (zh) * 2011-01-19 2013-03-27 沈阳芯源微电子设备有限公司 半导体封装用厚胶膜旋涂方法
JP5327238B2 (ja) * 2011-01-20 2013-10-30 東京エレクトロン株式会社 塗布処理装置、塗布処理方法及び記憶媒体
US8838680B1 (en) 2011-02-08 2014-09-16 Google Inc. Buffer objects for web-based configurable pipeline media processing
US8819525B1 (en) 2012-06-14 2014-08-26 Google Inc. Error concealment guided robustness
TWI566939B (zh) * 2012-06-14 2017-01-21 聯華電子股份有限公司 製作圖案化聚醯亞胺薄膜的方法及其應用
JP6352824B2 (ja) * 2015-01-23 2018-07-04 東芝メモリ株式会社 基板処理装置、制御プログラムおよび制御方法
CN105204290A (zh) * 2015-08-24 2015-12-30 北京中科紫鑫科技有限责任公司 一种su8列阵式微反应池的制备方法
JP6437405B2 (ja) * 2015-09-10 2018-12-12 東芝メモリ株式会社 回転塗布方法および電子部品の製造方法
JP6764713B2 (ja) * 2016-07-05 2020-10-07 株式会社Ｓｃｒｅｅｎホールディングス 塗布方法
KR101927696B1 (ko) * 2016-08-31 2019-02-27 세메스 주식회사 기판 처리 장치 및 방법
KR102207312B1 (ko) * 2018-07-23 2021-01-27 세메스 주식회사 기판 처리 방법 및 장치
CN111261549B (zh) * 2018-11-30 2022-09-16 台湾积体电路制造股份有限公司 分配溶剂的方法
CN111266265B (zh) * 2018-12-05 2021-10-08 长鑫存储技术有限公司 一种半导体的涂布设备及涂布方法
JP7485700B2 (ja) * 2020-01-16 2024-05-16 東京エレクトロン株式会社 基板処理方法、記憶媒体、及び基板処理装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4230752A (en) * 1979-04-26 1980-10-28 Brunswick Corporation Cigarette burn proof artificial grass
JPS59106120A (ja) 1982-12-11 1984-06-19 Toshiba Corp レジスト膜の形成方法
US4518678A (en) 1983-12-16 1985-05-21 Advanced Micro Devices, Inc. Selective removal of coating material on a coated substrate
JPS60231815A (ja) * 1984-04-28 1985-11-18 Kureha Chem Ind Co Ltd 弗化ビニリデン系樹脂モノフイラメントの製造方法
JP2583239B2 (ja) * 1987-06-16 1997-02-19 大日本印刷株式会社 フォトマスク用基板等へのレジスト塗布方法およびスピンナチャック装置
US5405813A (en) 1994-03-17 1995-04-11 Vlsi Technology, Inc. Optimized photoresist dispense method
US5607846A (en) 1994-05-17 1997-03-04 Research Foundation Of State University Of New York Vaccine for moraxella catarrhalis
JP3164739B2 (ja) 1994-09-30 2001-05-08 東京エレクトロン株式会社 塗布膜形成方法及びその装置
JP3361656B2 (ja) 1995-06-15 2003-01-07 大日本スクリーン製造株式会社 塗布液塗布方法
JP3396354B2 (ja) 1995-11-06 2003-04-14 大日本スクリーン製造株式会社 塗布液塗布方法
JPH1022220A (ja) 1996-07-04 1998-01-23 Dainippon Screen Mfg Co Ltd 基板への塗布液塗布方法及び塗布装置
JP3504444B2 (ja) 1996-09-13 2004-03-08 日本テキサス・インスツルメンツ株式会社 レジスト材料の塗布方法及び半導体装置の製造方法
JP3504092B2 (ja) * 1996-11-19 2004-03-08 大日本スクリーン製造株式会社 塗布液塗布方法
JPH10151406A (ja) * 1996-11-21 1998-06-09 Dainippon Screen Mfg Co Ltd 塗布液塗布方法
US6117486A (en) 1997-03-31 2000-09-12 Tokyo Electron Limited Photoresist coating method and apparatus
JP3302603B2 (ja) 1997-03-31 2002-07-15 東京エレクトロン株式会社 レジスト塗布方法及びレジスト塗布装置
US5780105A (en) 1997-07-31 1998-07-14 Vanguard International Semiconductor Corporation Method for uniformly coating a semiconductor wafer with photoresist
US5912049A (en) * 1997-08-12 1999-06-15 Micron Technology, Inc. Process liquid dispense method and apparatus
JP3330324B2 (ja) * 1998-01-09 2002-09-30 東京エレクトロン株式会社 レジスト塗布方法およびレジスト塗布装置
US6387825B2 (en) * 1998-11-12 2002-05-14 Advanced Micro Devices, Inc. Solution flow-in for uniform deposition of spin-on films
US6317642B1 (en) * 1998-11-12 2001-11-13 Advanced Micro Devices, Inc. Apparatus and methods for uniform scan dispensing of spin-on materials
JP3800282B2 (ja) 1998-11-30 2006-07-26 大日本スクリーン製造株式会社 塗布液塗布方法
JP3655576B2 (ja) * 2001-07-26 2005-06-02 株式会社東芝 液膜形成方法及び半導体装置の製造方法
TW554075B (en) 2002-04-17 2003-09-21 Grand Plastic Technology Corp Puddle etching method of thin film using spin processor
CN1271683C (zh) * 2002-07-25 2006-08-23 松下电器产业株式会社 一种基板镀膜方法
TWI305677B (en) * 2002-10-22 2009-01-21 Nanya Technology Corp Method for coating low viscosity materials
US7384878B2 (en) 2004-05-20 2008-06-10 International Business Machines Corporation Method for applying a layer to a hydrophobic surface
JP4498893B2 (ja) * 2004-11-11 2010-07-07 大日本スクリーン製造株式会社 基板処理方法および基板処理装置
US20070020561A1 (en) * 2005-07-21 2007-01-25 Kazuya Hisada Manufacturing method and manufacturing apparatus for an optical data recording medium, and an optical data recording medium
JP4749829B2 (ja) * 2005-10-20 2011-08-17 東京エレクトロン株式会社 レジスト塗布方法およびレジスト塗布装置
JP4749830B2 (ja) * 2005-10-21 2011-08-17 東京エレクトロン株式会社 レジスト塗布方法およびレジスト塗布装置
JP4805769B2 (ja) * 2006-09-14 2011-11-02 東京エレクトロン株式会社 塗布処理方法
JP5109373B2 (ja) 2007-01-19 2012-12-26 富士通セミコンダクター株式会社 塗布液の塗布方法及び半導体装置の製造方法

Also Published As

Publication number Publication date
EP1947680B1 (en) 2018-07-04
KR100984901B1 (ko) 2010-10-01
CN101226336B (zh) 2011-05-18
JP5109373B2 (ja) 2012-12-26
KR20100014750A (ko) 2010-02-11
EP1947680A3 (en) 2009-10-21
KR100941837B1 (ko) 2010-02-11
US20080176410A1 (en) 2008-07-24
US7754619B2 (en) 2010-07-13
CN101226336A (zh) 2008-07-23
JP2008177410A (ja) 2008-07-31
EP1947680A2 (en) 2008-07-23
KR20080068515A (ko) 2008-07-23
TW200832071A (en) 2008-08-01

Similar Documents

Publication Publication Date Title
TWI366074B (en) Method for forming a coating with a liquid, and method for manufacturing a semiconductor device
EP2276066A4 (en) SEMICONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF
EP2246895A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2242090A4 (en) SEMICONDUCTOR FILM, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
EP2420599A4 (en) SUBSTRATE, SUBSTRATE HAVING THIN FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
EP2351088A4 (en) SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
EP2280417A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
TWI367545B (en) Method for manufacturing a semiconductor device and semiconductor device
EP2474204A4 (en) LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING THE SAME
EP2436234A4 (en) LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE THEREFOR AND METHOD OF MANUFACTURING THEREOF
EP2276086A4 (en) HOLE INJECTION / TRANSPORT LAYER DEVICE, METHOD FOR MANUFACTURING SAME, AND INK FOR FORMING HOLE INJECTION / TRANSPORT LAYER
EP2133909A4 (en) SEMICONDUCTOR ARRANGEMENT AND METHOD FOR THE PRODUCTION THEREOF
TWI370516B (en) Semiconductor device manufacturing method
EP2135295A4 (en) Photovoltaic module and method for its production
EP2259305A4 (en) CONDENSER, SEMICONDUCTOR COMPONENT THEREWITH, METHOD FOR PRODUCING THE CONDENSER AND METHOD FOR PRODUCING THE SEMICONDUCTOR CONSTRUCTION ELEMENT
HK1148639A1 (en) Devices, substrate devices, multi-layered substrate devices and methods for forming substrate devices
EP2169711A4 (en) SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND METHOD FOR MANUFACTURING DISPLAY DEVICE
EP2352169A4 (en) SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND DISPLAY DEVICE
EP2503615A4 (en) DEVICE, THIN-LAYER TRANSISTOR, METHOD FOR PRODUCING THE DEVICE AND METHOD FOR PRODUCING THE THIN-LAYER TRANSISTOR
EP2139052A4 (en) Light-emitting semiconductor device and method for its production
TWI351087B (en) Package substrate and method for fabricating the same
EP2186129A4 (en) METHOD FOR PRODUCING A SEMICONDUCTOR CHIP AND SEMICONDUCTOR ELEMENT COMPRISING THE SEMICONDUCTOR CHIP OBTAINED THEREWITH
EP2178132A4 (en) ORGANIC ELECTROLUMINESCENT DEVICE, PROCESS FOR PRODUCING THE SAME, AND COATING LIQUID
EP2219215A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2092552A4 (en) MANUFACTURING METHOD FOR SEMICONDUCTOR COMPONENTS

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees