TWI365278B - - Google Patents

Info

Publication number
TWI365278B
TWI365278B TW098109727A TW98109727A TWI365278B TW I365278 B TWI365278 B TW I365278B TW 098109727 A TW098109727 A TW 098109727A TW 98109727 A TW98109727 A TW 98109727A TW I365278 B TWI365278 B TW I365278B
Authority
TW
Taiwan
Application number
TW098109727A
Other versions
TW201035513A (en
Inventor
Ko Chun Chen
Chiu Lang Lin
Original Assignee
Wah Hong Ind Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wah Hong Ind Corp filed Critical Wah Hong Ind Corp
Priority to TW098109727A priority Critical patent/TW201035513A/zh
Priority to JP2009169836A priority patent/JP2010232626A/ja
Priority to KR1020090074559A priority patent/KR101270486B1/ko
Priority to EP09167899A priority patent/EP2234152A2/en
Priority to US12/541,677 priority patent/US20100243230A1/en
Priority to BRPI1000957-4A priority patent/BRPI1000957A2/pt
Publication of TW201035513A publication Critical patent/TW201035513A/zh
Priority to US13/366,353 priority patent/US9097468B2/en
Application granted granted Critical
Publication of TWI365278B publication Critical patent/TWI365278B/zh
Priority to JP2013027629A priority patent/JP2013102228A/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49366—Sheet joined to sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW098109727A 2009-03-25 2009-03-25 Method for manufacturing heat dissipation interface device and product thereof TW201035513A (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
TW098109727A TW201035513A (en) 2009-03-25 2009-03-25 Method for manufacturing heat dissipation interface device and product thereof
JP2009169836A JP2010232626A (ja) 2009-03-25 2009-07-21 放熱装置及び該放熱装置の製作方法
KR1020090074559A KR101270486B1 (ko) 2009-03-25 2009-08-13 도금된 금속 레이어를 포함하는 열 방출 장치
EP09167899A EP2234152A2 (en) 2009-03-25 2009-08-14 Heat-dissipating device including a plating metal layer
US12/541,677 US20100243230A1 (en) 2009-03-25 2009-08-14 Heat-dissipating device including a plating metal layer
BRPI1000957-4A BRPI1000957A2 (pt) 2009-03-25 2010-03-17 dispositivo de dissipação de calor incluindo uma camada de metal de revestimento
US13/366,353 US9097468B2 (en) 2009-03-25 2012-02-05 Use of a graphite heat-dissipation device including a plating metal layer
JP2013027629A JP2013102228A (ja) 2009-03-25 2013-02-15 放熱装置の製作方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW098109727A TW201035513A (en) 2009-03-25 2009-03-25 Method for manufacturing heat dissipation interface device and product thereof

Publications (2)

Publication Number Publication Date
TW201035513A TW201035513A (en) 2010-10-01
TWI365278B true TWI365278B (zh) 2012-06-01

Family

ID=42244987

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098109727A TW201035513A (en) 2009-03-25 2009-03-25 Method for manufacturing heat dissipation interface device and product thereof

Country Status (6)

Country Link
US (1) US20100243230A1 (zh)
EP (1) EP2234152A2 (zh)
JP (2) JP2010232626A (zh)
KR (1) KR101270486B1 (zh)
BR (1) BRPI1000957A2 (zh)
TW (1) TW201035513A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547121A (zh) * 2012-07-09 2014-01-29 华宏新技股份有限公司 散热复合物及其使用

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8955580B2 (en) 2009-08-14 2015-02-17 Wah Hong Industrial Corp. Use of a graphite heat-dissipation device including a plating metal layer
US9404665B1 (en) * 2010-08-30 2016-08-02 Khart Panels LLC Radiant panel system having increased efficiency
JP2012077988A (ja) * 2010-09-30 2012-04-19 Fujitsu Ltd 熱中継機構及び放熱フィン
TWI579987B (zh) * 2015-12-22 2017-04-21 財團法人工業技術研究院 散熱模組
US20220347990A1 (en) * 2021-04-29 2022-11-03 GM Global Technology Operations LLC Flexible sheet of polyethylene terephthalate and heat-activated adhesive, and thermal cooling structure using the same
CN113622007A (zh) * 2021-09-08 2021-11-09 苏州市安派精密电子有限公司 一种高柔韧性石墨材质或石墨烯材质散热部件制备方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103547121A (zh) * 2012-07-09 2014-01-29 华宏新技股份有限公司 散热复合物及其使用

Also Published As

Publication number Publication date
JP2010232626A (ja) 2010-10-14
BRPI1000957A2 (pt) 2011-06-21
JP2013102228A (ja) 2013-05-23
US20100243230A1 (en) 2010-09-30
KR101270486B1 (ko) 2013-06-12
KR20100107371A (ko) 2010-10-05
EP2234152A2 (en) 2010-09-29
TW201035513A (en) 2010-10-01

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