EP1260615B1 - Metallbeschichtung von Graphit - Google Patents
Metallbeschichtung von Graphit Download PDFInfo
- Publication number
- EP1260615B1 EP1260615B1 EP20010111708 EP01111708A EP1260615B1 EP 1260615 B1 EP1260615 B1 EP 1260615B1 EP 20010111708 EP20010111708 EP 20010111708 EP 01111708 A EP01111708 A EP 01111708A EP 1260615 B1 EP1260615 B1 EP 1260615B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- graphite
- set forth
- metal coating
- electroplating
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910002804 graphite Inorganic materials 0.000 title claims abstract description 40
- 239000010439 graphite Substances 0.000 title claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 35
- 239000002184 metal Substances 0.000 title claims abstract description 35
- 239000011248 coating agent Substances 0.000 title claims abstract description 24
- 238000000576 coating method Methods 0.000 title claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 25
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract 2
- 238000005530 etching Methods 0.000 claims description 21
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 11
- KWYUFKZDYYNOTN-UHFFFAOYSA-M potassium hydroxide Substances [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 8
- 238000009210 therapy by ultrasound Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000010899 nucleation Methods 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 238000009713 electroplating Methods 0.000 claims 6
- 238000007772 electroless plating Methods 0.000 claims 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 18
- 239000010949 copper Substances 0.000 abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 4
- 230000008021 deposition Effects 0.000 abstract description 4
- 239000003518 caustics Substances 0.000 abstract 2
- 150000002739 metals Chemical class 0.000 description 8
- 238000005476 soldering Methods 0.000 description 4
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000035784 germination Effects 0.000 description 2
- 239000007770 graphite material Substances 0.000 description 2
- WMFOQBRAJBCJND-UHFFFAOYSA-M lithium hydroxide Inorganic materials [Li+].[OH-] WMFOQBRAJBCJND-UHFFFAOYSA-M 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002123 temporal effect Effects 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000004918 carbon fiber reinforced polymer Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229940072033 potash Drugs 0.000 description 1
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Substances [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 1
- 235000015320 potassium carbonate Nutrition 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1896—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by electrochemical pretreatment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
Definitions
- the present invention relates to a method for metal coating of Graphite.
- Graphite finds a wide variety of applications as a material. In many Cases must use graphite parts for electrically conductive connections often only mechanically clamped and by pressing others electrically conductive parts is contacted (in particular by pressing Metal contacts). With numerous technical problems is however a connection required by soldering or other joining techniques, so that the graphite part needs a metallic surface.
- GB 1 283 916 discloses the metallization of carbon fiber reinforced Plastic parts by anodic etching in sulfuric acid and subsequent galvanic coating with copper or nickel.
- JP 3027175 (Derwent Abstract XP-002179035) relates to improving the orientation quality and the tensile strength of carbon fiber parts by anodic Etching in lithium, sodium or potassium hydroxide.
- US 3,547,692 describes a two-stage electroless metallization process, each with subsequent Heating steps.
- JP 60208495 refers to her Patent Abstract of Japan on the pretreatment of carbon material too an electrical coating with a slight alkaline etching and subsequent Germination with Pd or Ag.
- the invention is based on the technical problem, a method for coating of graphite with metals.
- a method for metal coating of graphite characterized by the following steps in the following order: an alkaline etching bath of graphite in anodic operation and a galvanic metal coating of graphite.
- the invention is based on the idea that a metal coating of Graphite, so the application on the graphite more adhesive and not just overlying Metal layers, for electrical contacting and / or mechanical Attachment of graphite components makes a valuable contribution. To the one can on the applied metal layers other metallic contacts be pressed, with comparatively low contact resistance result. Second, the metal layers as Basis for solder joints or other methods for producing a Fixed connection with the component used, which is a metal surface provide.
- the essential point is to ensure good adhesion between the applied metal layers and the actual graphite surface.
- the inventor has found that good adhesion can be achieved when the graphite component first in an alkaline etching bath in anodic operation pretreated and activated and then a galvanic coating takes place.
- the alkaline etching bath in anodic operation is the graphite surface not only thoroughly cleaned but also slightly etched, so that the subsequent galvanic coating is one of foreign contaminants as well as graphite dust largely free and slightly roughened Surface finds.
- the metal layer can be good in the graphite surface dovetail, which essentially benefits the adhesive properties.
- the alkaline etching bath creates the prerequisite for a highly adherent and temperature-resistant coating with metals.
- the graphite surface before the galvanic metal coating be germinated with Pd.
- Pd seeding a so-called chemical metal layer are deposited. It is it is an electroless deposition of a metal with a reducing agent. This electroless deposition is optional but preferably the Pd germination ahead.
- Ni or Cu deposited the two metals also may be present together or in conjunction with other metals.
- the cleaning effect of the alkaline etching bath can be achieved by ultrasonic treatment get supported. This helps in adhering to the surface particles detached from the surface and also supports the mixing and the concentration balance near the surface.
- the ultrasound treatment however has several disadvantages. For some components it is because of mechanical stress sensitive parts undesirable. Furthermore it requires the installation of the parts in a suitable for ultrasonic treatment Contraption. To perfect the uniformity of ultrasonic treatment can in particular annular arrangements of the treated Batches of components are selected, but this relatively expensive apparatus is.
- the mentioned galvanic metal coating of graphite can be applied to racks and run in drums with appropriate part geometry.
- the galvanic Coating may preferably be with Cu, Ni or Sn, a mixture of these Metals or a mixture of one or more of these metals with others Metals are made.
- Sn and Sn alloys have good soldering properties, so that the galvanic layer for a later (optional) soldering step makes a good foundation.
- Preferred parameter ranges of the galvanic coating are a current density of 1-10 A / dm 2 and a treatment time, ie bath and turn-on time of the current, of 5-60 minutes.
- the alkaline etching bath may preferably be in caustic soda solution (NaOH solution) or Potash solution (KOH solution) or a mixture of the two alkalis, for example in a concentration range of 10-60% by weight, particularly preferably 20-50 wt .-% and im according to findings of Inventor's best case between 30 and 40 wt .-%.
- Of the preferred temperature range is between 55 ° and 65 ° C.
- graphite in this invention is directed to all materials which contain graphite to such an extent and on the relevant surface occurs that the metal coating also just the graphite surfaces even for the technical result is essential. Of course, this includes first once all pure graphite materials as well as those with minor Additives. Preferably, however, the invention is also directed to plastic-bonded Graphite materials in which graphite particles in a plastic matrix are included. Such material has various technical applications, in which the inventive method of great advantage can.
- the invention can be realized according to the following embodiment whose details are not to be understood as limiting:
- a plastic-bonded graphite component of an electrical engineering Device is manufactured in a conventional manner so far that the final Shape is given. Then larger numbers of the component than batch in a commercially available device for electrolytic etching in 35 % By weight NaOH solution at 60 ° C. for 10 minutes in anodic operation etched and then added directly into a simple water bath Room temperature introduced. There, the solution foams in the environment of Components of the batch briefly on, the batch is further rinsed and then in known to germinate with Pd. These are commercial ionogenic or colloidal Pd solutions available. The Pd nuclei serve as a catalyst for the following metallization steps.
- Ni layer chemically (without external power) deposited.
- This nickel layer can, da it is very thin, then chemically nickel, chemically copper, galvanic nickel and / or electroplated copper.
- soldering process is completely conventional, because only the surface of the Sn alloy plays a role.
- the solder joint can not only for excellent electrical contacts to the Graphite component can be used. She also has such good adhesion the graphite component that it can also serve for mechanical fastening, so that the graphite component is no longer clamped or bored in the Graphite component screwed or otherwise with respect to the graphite component must be attached positively or non-positively. It may just be a suitable one Metal pocket can be used as an assembly aid.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Electrochemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Carbon And Carbon Compounds (AREA)
- Coating With Molten Metal (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
- eine Pd-Bekeimung + chemisch Ni + Cu (oder Ni)
- oder nach Spülen galvanisch Ni direkt
- oder nach Spülen galvanisch Cu direkt
Claims (13)
- Verfahren zur Metallbeschichtung von Graphit,
gekennzeichnet durch folgende Schritte in folgender Reihenfolge:anodisches Ätzen des Graphits in einem alkalisches Ätzbadund eine galvanische Metallbeschichtung des Graphits. - Verfahren nach Anspruch 1, gekennzeichnet durch folgenden Schritt zwischen dem alkalischen Ätzbad und der galvanischen Metallbeschichtung:eine Pd-Bekeimung des Graphits.
- Verfahren nach Anspruch 2, gekennzeichnet durch folgenden Schritt zwischen der Pd-Bekeimung und der galvanischen Metallbeschichtung:eine außenstromlose Metallabscheidung zur Verstärkung der Pd-Schicht.
- Verfahren nach Anspruch 3, bei dem bei der außenstromlosen Abscheidung zumindest Ni oder Cu abgeschieden wird.
- Verfahren nach einem der vorstehenden Ansprüche, gekennzeichnet durch folgenden Schritt zwischen dem alkalischen Ätzbad und dem nachfolgenden Schritt:ein direktes Einbringen des Graphits aus dem alkalischen Ätzbad in Wasser oder eine dünne wässrige Lösung.
- Verfahren nach Anspruch 5, bei dem zwischen dem alkalischen Ätzbad und der ersten nachfolgenden Metallbeschichtung keine Ultraschallbehandlung durchgeführt wird.
- Verfahren nach einem der vorstehenden Ansprüche, bei dem bei der galvanischen Metallbeschichtung mit zumindest Cu, Ni oder Sn beschichtet wird.
- Verfahren nach einem der vorstehenden Ansprüche, bei dem die Stromdichte bei der galvanischen Metallbeschichtung zwischen 1 und 10 A/dm2 liegt.
- Verfahren nach einem der vorstehenden Ansprüche, bei dem die Stromzeit bei der galvanischen Metallbeschichtung zwischen 5 und 60 Minuten liegt.
- Verfahren nach einem der vorstehenden Ansprüche, bei dem das alkalische Ätzbad in einer Lösung aus im wesentlichen 10-60 Gew.-%-iger Lösung von NaOH und/oder KOH durchgeführt wird.
- Verfahren nach Anspruch 10, bei dem das alkalische Ätzbad bei einer Temperatur zwischen 20° und 70°C abläuft.
- Verfahren nach einem der vorstehenden Ansprüche, bei dem es sich bei dem Graphit um kunststoffgebundene Graphitpartikel handelt.
- Verfahren zum Herstellen einer Lötverbindung mit einem Graphitbauteil, bei dem mit einem Verfahren nach einem der vorstehenden Ansprüche eine Metallbeschichtung auf dem Graphitbauteil aufgebracht wird und danach auf der so hergestellten Metallschicht eine Lötstelle angebracht wird.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE50100123T DE50100123D1 (de) | 2001-05-14 | 2001-05-14 | Metallbeschichtung von Graphit |
AT01111708T ATE234950T1 (de) | 2001-05-14 | 2001-05-14 | Metallbeschichtung von graphit |
SI200130012T SI1260615T1 (en) | 2001-05-14 | 2001-05-14 | Metal coating of graphite |
EP20010111708 EP1260615B1 (de) | 2001-05-14 | 2001-05-14 | Metallbeschichtung von Graphit |
PCT/EP2002/003116 WO2002092884A1 (de) | 2001-05-14 | 2002-03-20 | Metallbeschichtung von graphit |
US10/712,458 US20040094424A1 (en) | 2001-05-14 | 2003-11-13 | Graphite metal coating |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP20010111708 EP1260615B1 (de) | 2001-05-14 | 2001-05-14 | Metallbeschichtung von Graphit |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1260615A1 EP1260615A1 (de) | 2002-11-27 |
EP1260615B1 true EP1260615B1 (de) | 2003-03-19 |
Family
ID=8177428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP20010111708 Expired - Lifetime EP1260615B1 (de) | 2001-05-14 | 2001-05-14 | Metallbeschichtung von Graphit |
Country Status (6)
Country | Link |
---|---|
US (1) | US20040094424A1 (de) |
EP (1) | EP1260615B1 (de) |
AT (1) | ATE234950T1 (de) |
DE (1) | DE50100123D1 (de) |
SI (1) | SI1260615T1 (de) |
WO (1) | WO2002092884A1 (de) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6907917B2 (en) * | 2003-01-10 | 2005-06-21 | International Business Machines Corporation | Graphite-based heat sinks and method and apparatus for the manufacture thereof |
US8955580B2 (en) * | 2009-08-14 | 2015-02-17 | Wah Hong Industrial Corp. | Use of a graphite heat-dissipation device including a plating metal layer |
TW201035513A (en) * | 2009-03-25 | 2010-10-01 | Wah Hong Ind Corp | Method for manufacturing heat dissipation interface device and product thereof |
TW201105827A (en) * | 2009-08-13 | 2011-02-16 | guo-zhen Zhang | Pretreatment method |
CN103469182B (zh) * | 2013-08-30 | 2015-05-13 | 西北工业大学 | 一种纳米石墨微片表面无钯化学镀铜的方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2547120A (en) * | 1945-10-23 | 1951-04-03 | Bendix Aviat Corp | Process for plating a carbon or graphite part with chromium |
GB1215002A (en) * | 1967-02-02 | 1970-12-09 | Courtaulds Ltd | Coating carbon with metal |
GB1283916A (en) * | 1968-09-28 | 1972-08-02 | Plessey Co Ltd | Improvements relating to electro-deposition |
US3547692A (en) * | 1968-10-17 | 1970-12-15 | Engelhard Min & Chem | Metal coating carbon substrates |
JPS60208495A (ja) * | 1984-04-02 | 1985-10-21 | Okuno Seiyaku Kogyo Kk | カ−ボン材料に電気めつきを行なうための前処理方法 |
JPH0327175A (ja) * | 1989-06-17 | 1991-02-05 | Kobe Steel Ltd | 炭素繊維の製造方法 |
US5591565A (en) * | 1992-03-20 | 1997-01-07 | Siemens Solar Gmbh | Solar cell with combined metallization and process for producing the same |
-
2001
- 2001-05-14 EP EP20010111708 patent/EP1260615B1/de not_active Expired - Lifetime
- 2001-05-14 AT AT01111708T patent/ATE234950T1/de active
- 2001-05-14 DE DE50100123T patent/DE50100123D1/de not_active Expired - Lifetime
- 2001-05-14 SI SI200130012T patent/SI1260615T1/xx unknown
-
2002
- 2002-03-20 WO PCT/EP2002/003116 patent/WO2002092884A1/de not_active Application Discontinuation
-
2003
- 2003-11-13 US US10/712,458 patent/US20040094424A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
SI1260615T1 (en) | 2003-12-31 |
US20040094424A1 (en) | 2004-05-20 |
DE50100123D1 (de) | 2003-04-24 |
EP1260615A1 (de) | 2002-11-27 |
WO2002092884A1 (de) | 2002-11-21 |
ATE234950T1 (de) | 2003-04-15 |
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